[KSCI] Korea Science Citation Index Service

http://dx.doi.org/10.11142/jicems.2013.2.4.441

A Thermal Model for Electrothermal Simulation of Power Modules

Meng, Jinlei (University of Chinese Academy of Sciences, Chinese Academy of Sciences, Beijing Engineering Laboratory of Electrical Drive System & Power Electronic Device Packaging Technology)
Wen, Xuhui (University of Chinese Academy of Sciences, Chinese Academy of Sciences, Beijing Engineering Laboratory of Electrical Drive System & Power Electronic Device Packaging Technology)
Zhong, Yulin (University of Chinese Academy of Sciences, Chinese Academy of Sciences, Beijing Engineering Laboratory of Electrical Drive System & Power Electronic Device Packaging Technology)
Qiu, Zhijie (University of Chinese Academy of Sciences, Chinese Academy of Sciences, Beijing Engineering Laboratory of Electrical Drive System & Power Electronic Device Packaging Technology)

Publication Information

Journal of international Conference on Electrical Machines and Systems / v.2, no.4, 2013 , pp. 441-446 More about this Journal

Abstract

A thermal model of power modules based on the physical dimension and thermal properties is proposed in this paper. The heat path in the power module is considered as a one-dimensional heat transfer in the model. The method of the parameters extraction for the model is given in the paper. With high speed and accuracy, the thermal model is suit for electrothermal simulation. The proposed model is verified by experimental results.

Keywords

Power module; Junction temperature; Thermal resistance; Thermal capacitance; Thermal time constant;

Citations & Related Records

Reference

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