Journal of international Conference on Electrical Machines and Systems

  • 제2권4호
  • /
  • Pages.441-446
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  • 2013
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  • 2234-6902(pISSN)
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  • 2234-7577(eISSN)
대한전기학회 분과 (Journal of International Conference on Electrical Machines and Systems)
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A Thermal Model for Electrothermal Simulation of Power Modules

  • Meng, Jinlei (University of Chinese Academy of Sciences, Chinese Academy of Sciences, Beijing Engineering Laboratory of Electrical Drive System & Power Electronic Device Packaging Technology) ;
  • Wen, Xuhui (University of Chinese Academy of Sciences, Chinese Academy of Sciences, Beijing Engineering Laboratory of Electrical Drive System & Power Electronic Device Packaging Technology) ;
  • Zhong, Yulin (University of Chinese Academy of Sciences, Chinese Academy of Sciences, Beijing Engineering Laboratory of Electrical Drive System & Power Electronic Device Packaging Technology) ;
  • Qiu, Zhijie (University of Chinese Academy of Sciences, Chinese Academy of Sciences, Beijing Engineering Laboratory of Electrical Drive System & Power Electronic Device Packaging Technology)
  • 투고 : 2013.10.03
  • 심사 : 2013.10.20
  • 발행 : 2013.12.01
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초록

A thermal model of power modules based on the physical dimension and thermal properties is proposed in this paper. The heat path in the power module is considered as a one-dimensional heat transfer in the model. The method of the parameters extraction for the model is given in the paper. With high speed and accuracy, the thermal model is suit for electrothermal simulation. The proposed model is verified by experimental results.

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참고문헌

  1. S. Wen, and L. Guo-Quan, "Finite-element modeling of thermal and thermomechanical behavior for threedimensional packaging of power electronics modules," in Thermal and Thermomechanical Phenomena in Electronic Systems, 2000, pp. 303-309.
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  3. Z. Z. a. P. Igic, "High-speed electro-thermal modelling of a three-phase insulated gate bipolar transistor inverter power module," International Journal of Electronics, vol. 97, pp. 11, February 2010.
  4. C.-S. Yun, P. Malberti, M. Ciappa, and W. Fichtner, "Thermal component model for electrothermal analysis of IGBT module systems," IEEE Transactions on Advanced Packaging, vol. 24, pp. 401-406, 2001. https://doi.org/10.1109/6040.938309
  5. T. Kojima, Y. Yamada, M. Ciappa, M. Chiavarini, and W. Fichtner, "A novel electro-thermal simulation approach of power IGBT modules for automotive traction applications," Proceedings in Power Semiconductor Devices and ICs, 2004. 2004, pp. 289-292.
  6. T. L. BERGMAN, A. S. LAVINE, F. P. INCROPERA, and D. P. DEWITT, "Fundamentals of heat and mass transfer," SEVENTH EDITION ed. USA: John Wiley & Sons, Inc., 2011.
  7. Y. C. Gerstenmaier, W. Kiffe, and G. Wachutka, "Combination of thermal subsystems modeled by rapid circuit transformation," in Thermal Investigation of ICs and Systems, 2007, pp. 115-120.

피인용 문헌

  1. Bond graph multi-physics modeling of encapsulating materials in power electronic modules vol.89, pp.2, 2013, https://doi.org/10.1051/epjap/2020180287