• 대한기계학회논문집
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• 제18권3호
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• pp.729-737
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• 1994

A three-dimensional finite element model of a 20-pin plastic dual-in-line package(PDIP) plugged into a PCE has been developed by using the finite element code ANSYS. The model has been used for thermal characterization of the package during its normal operation under natural convection cooling. Temperature distributions in the package and PCB are obtained from numerical analysis and compared with experimentally measured data. Various cases are assumed and analyzed to study the effects of package and PCB materials on thermal characteristics of PDIP with and without aluminum heatspreader. Thermal dissipation capability of PDIP is greatly increased due to copper die pad/lead frame and heatspreader. However, thermally induced stresses in the package and fatigue life of chip are improved for PDIP with Alloy 42 die pad/lead frame and no heatspreader. It is also found that the role of PCB on thermal characteristics of PDIP is very imporatant.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• 제13권2호
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• pp.73-86
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• 2009

The problem of thermal stability of an exothermic reactive viscous fluid between two parallel walls in the plane Poiseuille and Couette flow configurations is investigated for different thermal boundary conditions. Neglecting reactant consumption, the closed-form solutions obtained from the momentum equation was inserted into the energy equation due to dissipative effect of viscosity. The resulting energy equation was analyzed for criticality using the variational method technique. The problem is characterized by two parameters: the Nusselt number(N) and the dynamic parameter($\Lambda$). We observed that the thermal and dynamical boundary conditions of the wall have led to a significant departure from known results. The influence of the variable pre-exponential factor, due to the numerical exponent m, also give further insight into the behavior of the system and the results expressed graphically and in tabular forms.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.975-976
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• 2007

Thermal and mechanical stresses, caused by repetitive start and stop and load fluctuation during long time operation, on winding stator bars are one of the main causes for electrical degradation of insulating materials. To understand the degradation process, we manufactured bar specimens with the same processes that make generator winding stator bars and the specimens were subjected to various degrees of thermal cycling. Measurements of the insulation properties, such as dissipation factor, tip-up and partial discharge, for un-aged specimens and for specimens aged by thermal cycling at 50, 100, 250, 500 and 1000 thermal cycles were performed. Finally all specimens were tested to obtain electrical breakdown voltages. In this paper we present the data and electrical degradation analysis results obtained during this program.

• 전기화학회지
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• 제5권3호
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• pp.125-130
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• 2002

다공성 그물구조 금속을 반도체 칩 방열재료로써 활용하기 위한 실험을 실시하였다. 이를 위해 다공성 그물구조 구리와 반도체 칩 사이의 열팽창 차이를 최소화하기 위한 시도로써 다공성 구리에 대한 Fe/Ni 합금전착을 수행하였다. Fe/Ni 합금전착 실험으로 표준 Hull Cell을 구성하고 전류밀도 분포에 따른 Fe/Ni 합금층 내의 조성변화를 관찰하였으며, 실험결과 합금전착시 이상공석현상으로 인하여 전해액의 교반정도에 따라 합금층 조성이 크게 영향을 받는 것으로 나타났다. 본 실험에서는 paddle type 교반기를 사용하여 전해질의 확산을 제어하는 방법으로 원하는 조성의 Fe/Ni 합금층을 얻을 수 있었으며, 얻어진 Fe/Ni 후막을 대상으로 TMA 열분석을 실시한 결과 구리에 비해 훨씬 낮은 열팽창율을 보이는 것으로 나타났다. 또한, 본 실험에서 Fe/Ni 합금전착을 통하여 제작한 다공성 그물구조 금속을 대상으로 방열성능을 측정한 결과 구리 평판 대비 최대 2배 이상의 방열성능을 보여 반도체 칩 방열재료로의 활용 가능성을 높여 주었다.

• 대한금속재료학회지
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• 제56권11호
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• pp.805-812
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• 2018

High pressure die casting is one of the precision casting methods. It is highly productivity and suitable for manufacturing components with complex shapes and accurate dimensions. Recently, there has been increasing demand for efficient heat dissipation components, to control the heat generated by devices, which directly affects the efficiency and life of the product. Die cast aluminum alloys with high thermal conductivity are especially needed for this application. In this study, the influence of elements added to the die cast aluminum alloy on its thermal conductivity was evaluated. The results showed that Mn remarkably deteriorated the thermal conductivity of the aluminum alloy. When Cu content was increased, the tensile strength of cast aluminum alloy increased, showing 1 wt% of Cu ensured the minimum mechanical properties of the cast aluminum. As Si content increased, the flow length of the alloy proportionally increased. The flow length of aluminum alloy containing 2 wt% Si was about 85% of that of the ALDC12 alloy. A heat dissipation component was successfully fabricated using an optimized composition of Al-1 wt%Cu-0.6 wt%Fe-2 wt%Si die casting alloy without surface cracks, which were turned out as intergranular cracking originated from the solidification contraction of the alloy with Si composition lower than 2 wt%.

• 한국전기전자재료학회논문지
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• 제32권6호
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• pp.490-495
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• 2019

This study performs the thermal aging of chlorosulfonated polyethylene (CSPE) for 807.36 and 1,614.48 hours at $110^{\circ}C$, which is equivalent to 40 and 80 years of aging at $50^{\circ}C$ in nuclear power plants, respectively. Flat-type CSPEs were soaked in seawater for five days and then dried for five days at room temperature. Furthermore, the soaked CSPEs were cleaned for 5 days with fresh water and dried for 1,100 days at room temperature. Through this process, the log IV of the CSPEs decreases, whereas the dissipation factor of the CSPEs increases as thermally accelerated aged years increase at the measured frequency. Although the phase degree of the response voltage versus excitation voltage of the CSPEs increases, that of the response current versus excitation voltage decreases with the thermally accelerated aging. The thermal conductivity of the CSPEs increases slightly, but the thermal diffusivity does not vary with the thermally accelerated aged year increase. The displacement of the compressive strength of the CSPEs decreases gradually as the thermally accelerated aged years increase.

• 한국산업융합학회 논문집
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• 제22권6호
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• pp.767-773
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• 2019

The thermal diffusion performance of the electronic device is a factor for evaluating the stability of the electronic device. Therefore, many of research have been conducted to improve the thermal characteristics of thermal interface materials, which are materials for thermal diffusion of electronic products. In this study, nano thermal grease was prepared by blending graphene, silver and copper nano powders into a thermal grease, a type of thermal interface materials, and the heat transfer rate was measured and compared for the purpose of investigating the improved thermal properties. As a result, the thermal properties were good in the order of graphene, silver and copper, which is thought to be due to the different thermal properties of the nano powder itself.

• 대한기계학회논문집
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• 제1권2호
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• pp.95-103
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• 1977

The expermental research was carried out to investigate the thermal performance of the locally manufactured radiators for 1300cc automobiles. The choice of .epsilon. value (the ratio of water tube surface area to the total heat transfer area ) resulted in remarkable difference in their performance including the Louver effect, the overrall heat tranfer coefficient and the heat dissipation capability.

• 마이크로전자및패키징학회지
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• 제24권4호
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• 한국정밀공학회지
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• 제27권1호
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• pp.91-98
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• 2010

The increasing of power and processing speed and miniaturization of central processor unit (CPU) used in electronics equipment requires better performing thermal management systems. A typical thermal management package consists of thermal interfaces, heat dissipaters, and external cooling systems. There have been a number of experimental techniques and procedures for estimating thermal conductivity of thin, compressible thermal interface material (TIM). The TIM performance is affected by many factors and thus TIM should be evaluated under specified application conditions. In compact packaging of electronic equipment the chip is interfaced with a thin heat spreader. As the package is made thinner, the coupling between heat flow through TIM and that in the heat spreader becomes stronger. Thus, a TIM characterization system for considering the heat spreader effect is proposed and demonstrated in detail in this paper. The TIM test apparatus developed based on ASTM D-5470 standard for thermal interface resistance measurement of high performance TIM, including the precise measurement of changes in in-situ materials thickness. Thermal impedances are measured and compared for different directions of heat dissipation. The measurement of the TIM under the practical conditions can thus be used as the thermal criteria for the TIM selection.