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http://dx.doi.org/10.21289/KSIC.2019.22.6.767

A study on the heat dissipation characteristic of thermal interface materials with Graphene, Cu and Ag nano powders  

Park, Sang-Hyeok (Dept. of Energy and Mechanical Engineering, Gyeongsang Nat'l Univ.)
Im, Sung-Hoon (Dept. of Computer Aided Machinery, Changwon Campus of Korea Polytechnic)
Kim, Hyun-Ji (Dept. of Energy and Mechanical Engineering, Gyeongsang Nat'l Univ.)
Noh, Jung-Pil (Dept. of Energy and Mechanical Engineering, Gyeongsang Nat'l Univ.)
Huh, Sun-Chul (Dept. of Energy and Mechanical Engineering, Gyeongsang Nat'l Univ.)
Publication Information
Journal of the Korean Society of Industry Convergence / v.22, no.6, 2019 , pp. 767-773 More about this Journal
Abstract
The thermal diffusion performance of the electronic device is a factor for evaluating the stability of the electronic device. Therefore, many of research have been conducted to improve the thermal characteristics of thermal interface materials, which are materials for thermal diffusion of electronic products. In this study, nano thermal grease was prepared by blending graphene, silver and copper nano powders into a thermal grease, a type of thermal interface materials, and the heat transfer rate was measured and compared for the purpose of investigating the improved thermal properties. As a result, the thermal properties were good in the order of graphene, silver and copper, which is thought to be due to the different thermal properties of the nano powder itself.
Keywords
Thermal diffusion; Thermal interface materials; Graphene; Thermal grease; Heat transfer rate;
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