• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.443-444
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• 2006

We present a low temperature thermal process for the color photoresist on the flexible substrate for the LCD color filter module by the $TruNano^{TM}$ processor in combination with a compositional modification to the conventional color photoresist. By this method the curing temperature can be lowered by more than $100^{\circ}C$, and the curing process time also can be shortening by more than 20 min.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.10a
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• pp.33-37
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• 2002

Recently, composites have been widely applied in the sporting goods, automobile, aerospace industry. As the use of advanced composites increase, specific techniques have been developed to repair damaged composite structures. In order to repair the damaged part, it is required that the material in the damaged area be removed first by utilizing the proper method, and prepreg be laid up in the area and cured under vacuum using the vacuum bagging materials. In curing process, either in an oven or autoclave is to be delamination can be occurred in the sound areas during and/or after the exposure to the elevated curing temperature in case that the repair process is repeated. Therefore, this study was conducted to evaluate the degree of degradation of properties of the cured parts and how it affects to the delamination phenomenon between laminated skin and honeycomb core.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.352.2-352.2
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• 2014

In this present work, we report a Cu-Mn alloy as a materials for the self-forming barrier process. And we investigated diffusion barrier properties of self-formed layer on low-k dielectrics with or without UV curing treatment. Cu alloy films were directly deposited onto low-k dielectrics by co-sputtering, followed by annealing at various temperatures. X-ray diffraction revealed Cu (111), Cu (200) and Cu (220) peaks for both of Cu alloys. The self-formed layers were investigated by transmission electron microscopy. In order to compare barrier properties between Mn-based interlayer interlayer, thermal stability was measured with various low-k dielectrics. X-ray photoelectron spectroscopy analysis showed that chemical compositions of self-formed layer. The compositions of the Mn based self-formed barriers after annealing were determined by the C concentration in the dielectric layers.

• Journal of the Korean Society of Tobacco Science
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• v.6 no.2
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• pp.147-153
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• 1984

During curing of aromatic tobacco leaves, coloring temperatures were set at 26, 30, 34, 38 and $42^{\circ}C$, and also leaf drying temperatures were established at 35, 40, 45, 50, 55 and $60^{\circ}C$, respectively, to investigate the thermal effect on characteristics of cured leaves. Appearance of yellow color from green was accelerated, the contents of non-volatile organic and higher fatty acids in leaves tended to increase with the higher yellowing temperature. Quality by price per kg was best at 45-$50^{\circ}C$ and score of smoking test was highest at 40-$50^{\circ}C$ during leaf drying stage. The concentrations of non-volatile organic acids and volatile essential oil inclined to decrease, but a reverse in this trend with higher fatty acids as temperature increased during leaf drying stage. The difference of other components was discussed.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.3
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• pp.14-19
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• 2008

In the semiconductor IC(Integrated Circuit) package, the top surface of silicon chip is directly attached to the area of the leadframe with a double-sided adhesive layer, in which the base layer have the upper adhesive layer and the lower adhesive layer. The IC package structure has been known to encounter a thermo-mechanical failure mode such as delamination. This failure mode is due to the residual stress on the adhesive surface of silicon chip and leadframe in the curing-cooling process. The induced thermal stress in the curing process has an influence on the cooling residual stress on the silicon chip and leadframe. In this paper, for the minimization of the chip surface damage, the adhesive topologies on the silicon chip are studied through the finite element analysis(FEA).

• Transactions of Materials Processing
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• v.24 no.2
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• pp.101-106
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• 2015

Recently, silicone is being used for LED chip lens due to its good thermal stability and optical transmittance. In order to predict residual stresses, which cause optical birefringence and mechanical warpage of silicone, a finite element analysis was conducted for the curing of silicone during molding. For the analysis of the curing process, a dynamic cure kinetics model was derived based on the results of a differential scanning calorimetry (DSC) testing and applied to the material properties for finite element analysis. Finite element simulation results showed that a step cure cycle reduced abrupt reaction heat and showed a decrease in the residual stresses.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.389-392
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• 2005

Poly(amic acid) precursors were prepared by mixing various main chain dianhydrides, main chain diamines and side chain diamines. The side chain diamine has an alkylbicyclohexyl group as a side chain. The copolyimide films, produced by casting the poly (amic acids) solution, exhibited the vertical alignment property without the rubbing process in the range of the curing themperature from $90^{\circ}C$ to $240^{\circ}C$ for 1h. The thermal and surface properties of the poly(amic acids) depending on the curing temperature was examined.

• Carbon letters
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• v.15 no.1
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• pp.67-70
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• 2014

In this work, nanocomposites of epoxy resin and chemically reduced graphene oxide (RGO) were prepared by thermal curing process. X-ray diffractions confirmed the microstructural properties of RGO. Differential scanning calorimetry was used to evaluate the curing behaviors of RGO/epoxy nanocomposites with different RGO loading amounts. We investigated the effect of RGO loading amounts on the mechanical properties of the epoxy nanocomposites. It was found that the presence of RGO improved both flexural strength and modulus of the epoxy nanocomposites till the RGO loading reached 0.4 wt%, and then decreased. The optimum loading achieved about 24.5 and 25.7% improvements, respectively, compared to the neat-epoxy composites. The observed mechanical reinforcement might be an enhancement of mechanical interlocking between the epoxy matrix and RGO due to the unique planar structures.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.11a
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• pp.17-21
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• 2000

Logarithmic electrical resistivity of the untreated or thin diameter carbon fiber composite increased suddenly to the infinity when the fiber fracture occurred by tensile electro-micromechanical test, whereas that of the ED or thick fiber composite increased relatively broadly up to the infinity. Electrical resistance of single-carbon fiber composite increased suddenly due to electrical disconnection by the fiber fracture in tensile electro-micromechanical test, whereas that of SFC increased stepwise due to the occurrence of the partial electrical contact with increasing the buckling or overlapping in compressive test. Electrical resistivity measurement can be very useful technique to evaluate interfacial properties and to monitor curing behavior of single-carbon fiber/epoxy composite under tensile/compressive loading.

• Macromolecular Research
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• v.16 no.2
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• pp.128-133
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• 2008

Several dual-curable acrylic pressure-sensitive adhesives (PSA) were synthesized by the radical polymerization of acrylic monomers containing benzophenone, hydroxyl, and alkyl groups. The optimum extent of UV-induced cure was determined by varying the content of the benzophenone groups (the photoinitiator) from 0.5 to 1.5 wt%. The weight average molecular weight of the polymers obtained ranged from 300,000 to 700,000 amu. The coated pressure-sensitive adhesives were cured either by short UV exposure to induce the grafting of acrylic polymers, or by heating for 6 hat $60^{\circ}C$ to promote the reactions between the polyisocyanates and hydroxyl groups. The dual-curing behavior was determined by monitoring both processes quantitatively by infrared spectroscopy. The developed dual-curable acrylic pressure-sensitive adhesives were found to compensate for the limitations in UV-induced curing of thick coatings.