• 제목/요약/키워드: Thermal curing

검색결과 515건 처리시간 0.029초

Electro-Micromechanical 시험법을 이용한 탄소 섬유 강화 에폭시아크릴레이트 복합재료의 자외선과 열경화에 따른 경화 모니터링 및 비파괴적 계면 평가 (Nondestructive Interfacial Evaluation and Cure Monitoring of Carbon Fiber/Epoxyacrylate Composite with UV and Thermal Curing Using Electro-Micromechanical Technique)

  • 박종만;공진우;김대식;이재락
    • 폴리머
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    • 제27권3호
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    • pp.189-194
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    • 2003
  • Electro-micromechanical 시험법을 이용하여 탄소 섬유 강화 열경화성 수지 복합재료의 경화 방법에 따른 계면 평가와 손상 감지능 및 경화 모니터링에 대해 고찰하였다. 경화 후 잔류 응력은 전기 저항 측정을 통해 모니터링 하였으며, 경화 방법에 따라 상호 비교하였다. 기지 재료의 인장 강도, 탄성률 및 계면 전단 강도는 열 경화의 경우가 자외선 경화보다 더 크게 나타났으며, 열 경화에서 경화 수축은 열팽창 계수 차이에 의한 잔류 응력 및 기지 재료의 수축에 의해 자외선 경화와 비교하여 더 크게 나타났다. 열 경화 시의 경화 중 전기 저항은 자외선 경화보다 더 큰 범위에서 변하였으며, 기지 재료의 기계적 물성과 계면 접착력에 의해 다르게 나타나는 겉보기 탄성률 또한 더 컸고, 같은 응력까지 더 빠르게 도달하였다.

Electro-Micromechanical 시험법을 이용한 탄소섬유 강화 Epoxyacrylate 복합재료의 UV 및 열경화에 따른 비파괴적 손상 감지능 및 경화 Monitoring (Nondestructive Damage Sensing and Cure Monitoring of Carbon Fiber/Epoxyacrylate Composite with UV and Thermal Curing using Electro-Micromechanical Technique)

  • Kong, Jin-Woo;Kim, Dae-Sik;Park, Joung-Man;Lee, Jae-Rock
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2002년도 추계학술발표대회 논문집
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    • pp.261-264
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    • 2002
  • Interfacial evaluation, damage sensing and cure monitoring of single carbon fiber/thermosetting composite with different curing processes was investigated using electro-micromechanical test. After curing, residual stress was monitored by measurement of electrical resistance (ER) and then it was compared to correlate with various curing processes. In thermal curing, curing shrinkage appeared significantly by matrix shrinkage and residual stress due to the difference in thermal expansion coefficient (TEC). The change in electrical resistance (ΔR) on thermal curing was higher than that on ultraviolet (UV) curing. For thermal curing, apparent modulus was the highest and reaching time until same strain was faster. So far thermal curing shows strong durability on the IFSS after boiling test.

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경화제 변화에 따른 WLP(Wafer Level Package)용 신규 Epoxy Resin System의 경화특성 (Cure Properties of Novel Epoxy Resin Systems for WLP (Wafer Level Package) According to the Change of Hardeners)

  • 김환건
    • 반도체디스플레이기술학회지
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    • 제21권2호
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    • pp.57-67
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    • 2022
  • The curing characteristics of naphthalene type epoxy resin systems according to the change of curing agent were investigated to develop a new next-generation EMC(Epoxy Molding Compound) with excellent warpage characteristics, low thermal expansion, and excellent fluidity for WLP(Wafer Level Package). As epoxy resins, DGEBA, which are representative bisphenol type epoxy resins, NE-16, which are the base resins of naphthalene type epoxy resins, and NET-OH, NET-MA, and NET-Epoxy resins newly synthesized based on NE-16 were used. As a curing agent, DDM (Diamino Diphenyl Methane) and CBN resin with naphthalene moiety were used. The curing reaction characteristics of these epoxy resin systems with curing agents were analyzed through thermal analysis experiments. In terms of curing reaction mechanism, DGEBA and NET-OH resin systems follow the nth curing reaction mechanism, and NE-16, NET-MA and NET-Epoxy resin systems follow the autocatalytic curing reaction mechanism in the case of epoxy resin systems using DDM as curing agent. On the other hand, it was found that all of them showed the nth curing reaction mechanism in the case of epoxy resin systems using CBN as the curing agent. Comparing the curing reaction rate, the epoxy resin systems using CBN as the curing agent showed a faster curing reaction rate than them with DDM as a hardener in the case of DGEBA and NET-OH epoxy resin systems following the same nth curing reaction mechanism, and the epoxy resin systems with a different curing mechanism using CBN as a curing agent showed a faster curing reaction rate than DDM hardener systems except for the NE-16 epoxy resin system. These reasons were comparatively explained using the reaction rate parameters obtained through thermal analysis experiments. Based on these results, low thermal expansion, warpage reduction, and curing reaction rate in the epoxy resin systems can be improved by using CBN curing agent with a naphthalene moiety.

고품질 매스콘크리트 시공을 위한 배합설계 및 온도균열제어 시스템에 관한 연구 (A Study on the Mix Design and the Control System of Thermal Crack for High Quality Mass Concrete)

  • 김선구;이상수;원철;박상준;김동석
    • 한국건축시공학회지
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    • 제1권2호
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    • pp.174-178
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    • 2001
  • This study was performed to control the thermal crack of the mat footing slab in the multi-purposed buildings. In this study, we executed the mixing design of concrete to satisfy the workability and the quality according to the site conditions. And, we evaluated quantitatively about the possibility of thermal crack by using hydration heat analysis system. Finally, we proposed the optimal mixing conditions, curing methods and curing period which all factors are considered. As a result, the optimal mixing conditions were : W/B 41%, unit binder 375kgf/$\textrm{m}^3$, FA replacement ratio 20%. Lowest thermal stress was 22.0kgf/$\textrm{cm}^2$ and at that time thermal crack index was over 1.5, when the coefficient of thermal conductivity was lowest among the curing conditions. And, the total curing time was estimated at 6.7 days according to curing steps.

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매스콘크리트의 배합설계 및 온도균열제어에 관한 연구 (A Study on the Mix Design and the Control of Thermal Crack of Mass Concrete)

  • 이상수;원철;박상준;김동석
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2001년도 봄 학술발표회 논문집
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    • pp.533-538
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    • 2001
  • This study was peformed to control the thermal crack of the mat footing slab in the multi-purposed buildings. In this study, we executed the mixing design of concrete to satisfy the workability and the quality according to the site conditions. And, we evaluated quantitatively about the possibility of thermal crack by using hydration heat analysis system. Finally, we proposed the optimal mixing conditions, curing methods and curing period which all factors are considered. As a results, the optimal mixing conditions were : W/B 41%, unit binder 375kg/$cm^{2}$, FA replacement ratio 20%. Lowest thermal stress was 22.0kgf/$cm^{2}$ and at that time thermal crack index was over 1.5, when the coefficient of thermal conductivity was lowest among the curing conditions. And, the total curing time was estimated at 6.7 days according to curing steps.

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Thermal Curing Property of Silicone Encapsulant Containing Quantum Dot Surrounded by Various Types of Ligands

  • Lee, Chae Sung;Kim, BeomJong;Jeon, Seongun;Han, Cheul Jong;Hong, Sung-Kyu
    • Bulletin of the Korean Chemical Society
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    • 제34권12호
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    • pp.3787-3789
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    • 2013
  • In this study, the silicone thermal curing degree of the silicone-encapsulated quantum dot light emission diode was measured using the various types of chemical ligands around quantum dot. It was confirmed that the trioctyl phosphin oxide (TOPO) ligand around the quantum dot was responsible for dispersion of the quantum dot in silicone encapsulant and decline of the thermal curing degree of the silicone encapsulant. Also, it was confirmed that the thermal curing degree of silicone encapsulants containing the steric acid (SA) and the dodecanoic acid (DA) ligands were higher than the one of TOPO ligand.

DGEBA/DDM계 에폭시수지 경화 시험편의 기계적 및 열적특성 (Mechanical and Thermal Properties of Cured Specimen or DGEBA/DDM System)

  • 김공수;박준하;김기운;김영준
    • Elastomers and Composites
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    • 제33권1호
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    • pp.10-16
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    • 1998
  • In DGEBA/DDM system, the curing specimen are many curing factors which can affect on thermal and mechanical properties. This study was performed to prove the effect on curing specimen prepared by changing of the curing factors which are curing time and temperature of DGEBA/DDM system. As a result on thermal and mechanical properties, flexural strength, modulus and glass transition temperature (Tg) were increased with curing time and temperature were increased. It was found that the optimum curing condition of DGEBA/DDM system cure at $150^{\circ}C$ for 3hrs at equivalent ratio of 1/1.

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칼슘설포알루미네이트 시멘트의 탄산화 양생과 열 안정성에 관한 검토 (Review on Carbonation Curing and Thermal Stability of Calcium Sulfoaluminate Cement)

  • 오현유;쿠날 크뤼쉬나 다스;장정국
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2023년도 봄 학술논문 발표대회
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    • pp.53-54
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    • 2023
  • In recent decades, climate change has become an issue of global importance. The calcium sulfoaluminate (CSA) cement emits lower CO2 than the Portland cements while manufacturing. However, ettringite, which is a main hydration product of CSA cement, starts dehydrating at a temperature above 100℃, hence it may limit the CSA cement for high temperature application. Recently, an early carbonation curing of cement-based material has been extensively studied in terms of carbon neutralization. The carbonation curing of CSA cement has a potential to transform the AFt and AFm phases into calcium carbonate, and the transformation of unstable hydrates to stable hydrates can increase the resistance to elevated temperature. This review study summarizes and discusses the carbonation curing effect of CSA cement and the thermal stability of CSA cement exposed to elevated temperatures.

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수열합성경화체의 1차 양생조건에 따른 수화특성 (Hydration Characteristics according to First Curing Condition in Solid Hydrated by Hydro-Thermal Synthesis Reaction)

  • 김진만;정은혜;박선규
    • 콘크리트학회논문집
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    • 제20권5호
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    • pp.543-548
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    • 2008
  • 프리캐스트 제품은 소요의 강도를 단기간에 얻기 위하여 일반적으로 상압 증기양생을 실시하며, 칼슘-실리케이트의 수열합성반응을 이용할 경우 1차 양생 이후에 오토클레이브 양생이라는 2차 양생도 실시하고 있다. 여기에서 제품의 강도발현에 커다란 영향을 미치는 양생 방법의 경우, 2차 양생 방법에 대한 연구는 각종 연구로 부터 수열반응에 적합한 조건이 구명되는 등 많은 연구가 수행되었으나, 1차 양생 방법에 대한 검토는 아직 미비한 실정이며 생산업체별로 양생 방식을 달리하여 제품을 생산하고 있어 제품의 소요강도 획득에 문제점을 가지고 있다. 이에 본 연구에서는 수열합성 경화체에 있어서 보다 높은 강도를 얻기 위한 1차 양생 방법에 대한 자료를 얻고자 실험적 연구를 수행하였다. 즉 수열합성 경화체에 있어서 1차 양생 방법을 건식과 건/습식 그리고 습식으로 실시한 후에 각각의 시험체에 대하여 수화특성을 알아보기 위하여 SEM, XRD, DT-TGA 및 porosimeter 시험을 실시하였으며, 강도 특성을 알아보기 위하여 압축강도 시험을 실시하였다. 측정 결과, 1차, 2차 양생 후 각 양생조건에 따른 시험체의 압축강도는 건/습식 양생조건이 강도발현에 유리한 것으로 나타났으며, 그 차이는 크지 않은 것을 알 수 있었다. 수화도 분석을 위한 SEM, XRD 및 DT-TGA의 측정 결과, 건/습식 양생조건의 경우가 건식과 습식 양생조건에 비해 가장 많이 수화가 진행된 것을 알 수 있었고, porosimeter의 측정 결과에 있어서도 건/습식 양생조건이 강도특성에 유리한 공극특성을 갖는 것으로 나타났다.

경화제의 입체 이성질체 구조가 에폭시 수지의 경화 거동과 열 및 기계적 특성에 미치는 영향 (Effect of Stereoisomeric Structures of Curing Agents on Curing Behaviors, Thermal and Mechanical Properties of Epoxy Resins)

  • 이민규;권웅;정의경
    • 한국염색가공학회지
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    • 제30권3호
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    • pp.180-189
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    • 2018
  • To study the effect of stereoisomeric structures of curing agents on curing behaviors, thermal and mechanical properties of epoxy resins, DGEBA(diglycidyl ether of bisphenol A) epoxy resin and 3,3'- and 4,4'-DDS(diaminodiphenyl sulfone) curing agents were selected. The curing initiation temperature and activation energy of DGEBA/3,3'-DDS was lower than DGEBA/4,4'-DDS. DGEBA/3,3'-DDS has a faster curing rate and higher degree of cure than DGEBA/4,4'-DDS, suggesting that 3,3'-DDS has higher reactivity than 4,4'-DDS. Tensile strength and fracture toughness of DGEBA/3,3'-DDS was lower than those of DGEBA/4,4'-DDS, indicating that mechanical properties of the epoxy resin can be different only by the stereoisomeric difference in chemical structure of the curing agent.