Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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Cure Properties of Novel Epoxy Resin Systems for WLP (Wafer Level Package) According to the Change of Hardeners

경화제 변화에 따른 WLP(Wafer Level Package)용 신규 Epoxy Resin System의 경화특성

  • Kim, Whan Gun (Department of Nano Chemical & Biological Engineering, Seokyeong University)
  • 김환건 (서경대학교 나노화학생명공학과)
  • Received : 2022.05.30
  • Accepted : 2022.06.21
  • Published : 2022.06.30
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Abstract

The curing characteristics of naphthalene type epoxy resin systems according to the change of curing agent were investigated to develop a new next-generation EMC(Epoxy Molding Compound) with excellent warpage characteristics, low thermal expansion, and excellent fluidity for WLP(Wafer Level Package). As epoxy resins, DGEBA, which are representative bisphenol type epoxy resins, NE-16, which are the base resins of naphthalene type epoxy resins, and NET-OH, NET-MA, and NET-Epoxy resins newly synthesized based on NE-16 were used. As a curing agent, DDM (Diamino Diphenyl Methane) and CBN resin with naphthalene moiety were used. The curing reaction characteristics of these epoxy resin systems with curing agents were analyzed through thermal analysis experiments. In terms of curing reaction mechanism, DGEBA and NET-OH resin systems follow the nth curing reaction mechanism, and NE-16, NET-MA and NET-Epoxy resin systems follow the autocatalytic curing reaction mechanism in the case of epoxy resin systems using DDM as curing agent. On the other hand, it was found that all of them showed the nth curing reaction mechanism in the case of epoxy resin systems using CBN as the curing agent. Comparing the curing reaction rate, the epoxy resin systems using CBN as the curing agent showed a faster curing reaction rate than them with DDM as a hardener in the case of DGEBA and NET-OH epoxy resin systems following the same nth curing reaction mechanism, and the epoxy resin systems with a different curing mechanism using CBN as a curing agent showed a faster curing reaction rate than DDM hardener systems except for the NE-16 epoxy resin system. These reasons were comparatively explained using the reaction rate parameters obtained through thermal analysis experiments. Based on these results, low thermal expansion, warpage reduction, and curing reaction rate in the epoxy resin systems can be improved by using CBN curing agent with a naphthalene moiety.

Keywords

Acknowledgement

본 연구는 2022년도 서경대학교 교내연구비 지원에 의하여 이루어졌습니다. 또한 본 연구를 위하여 시료제공 및 여러 도움을 주신 한국생산기술연구원 전현애 박사님과 Nippon Kayaku Co.에게도 깊은 감사의 말씀을 드립니다.

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