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Chun, H. et al., "The Naphthalene Type Epoxy Dimers and a method for the preparation thereof", Korea Patent 10-1264607(Registered Patent), 2013.
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2 |
Kim, W. G., and Lee, J. Y., "Contributions of the Network Structure to the Cure Kinetics of Epoxy Resin Systems According to the Change of Hardeners", Polymer, Vol.43, pp.5713-5722, 2002.
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3 |
Kim, W. G., "Cure Properties of Isocyanurate Type Epoxy Resin Systems for FO-WLP (Fan Out-Wafer Level Package) Next Generation Semiconductor Packaging Materials", J. of the Semiconductor & Display Technology, Vol. 18, pp. 19-26, 2019.
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4 |
Kim, W. G., and Chun, H., "Cure Properties of Naphthalene-Base Epoxy Resin Systems with Hardeners and Latent Catalysts for Semiconductor Packaging Materials", Molecular Crystals and Liquid Crystals, Vol.579, pp.39-49, 2013.
DOI
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5 |
Kim, W. G., and Chun, H., "Cure Properties of Alkoxysilylated Epoxy Resin Systems with Hardeners for Semiconductor Packaging Materials", Molecular Crystals and Liquid Crystals, Vol.636, pp.107-116, 2015.
DOI
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6 |
Ryu, J. H., Choi, K. S., and W. G. Kim, "Latent Catalyst Effects in Halogen-Free Epoxy Molding Compounds for Semiconductor Encapsulation", J. Applied Polymer Science, Vol.96, pp.2287-2299, 2005.
DOI
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7 |
Qu, S., and Liu, Y., "Fan-Out Wafer-Level Chip-Scale Package", in Wafer-Level Chip-Scale Packaging, Chap.3, pp 39~62, 2015.
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8 |
Chun, H. et al., "The Naphthalene Type Epoxy Resins and the Epoxy Resin Compositions with them", Korea Patent 10-1189185(Registered Patent), 2012.
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9 |
Qu, S., and Liu, Y., "Demand and Challenges for Wafer-Level Chip-Scale Analog and Power Packaging", in Wafer-Level Chip-Scale Packaging, Chap.1, 1~14, 2015.
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10 |
Kim, W. G., "Cure Characteristics of Naphthalene Type Epoxy Resins for SEMC for WLP application", J. of the Semiconductor & Display Technology, Vol. 19, pp. 29-35, 2020.
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11 |
Kim, W. G., "Cure Characteristics of Ethoxysilyl Bisphenol A Type Epoxy Resin Systems for Next Generation Semiconductor Packaging Materials", J. of the Semiconductor & Display Technology, Vol. 16, pp. 19-26, 2017.
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