Browse > Article
http://dx.doi.org/10.5012/bkcs.2013.34.12.3787

Thermal Curing Property of Silicone Encapsulant Containing Quantum Dot Surrounded by Various Types of Ligands  

Lee, Chae Sung (Department of Chemical & Biochemical Engineering, Dongguk University-Seoul)
Kim, BeomJong (Department of Chemical & Biochemical Engineering, Dongguk University-Seoul)
Jeon, Seongun (Department of Chemical & Biochemical Engineering, Dongguk University-Seoul)
Han, Cheul Jong (Flexible display Research Center, Korea Electronics Technology Institute (KETI))
Hong, Sung-Kyu (Department of Chemical & Biochemical Engineering, Dongguk University-Seoul)
Publication Information
Abstract
In this study, the silicone thermal curing degree of the silicone-encapsulated quantum dot light emission diode was measured using the various types of chemical ligands around quantum dot. It was confirmed that the trioctyl phosphin oxide (TOPO) ligand around the quantum dot was responsible for dispersion of the quantum dot in silicone encapsulant and decline of the thermal curing degree of the silicone encapsulant. Also, it was confirmed that the thermal curing degree of silicone encapsulants containing the steric acid (SA) and the dodecanoic acid (DA) ligands were higher than the one of TOPO ligand.
Keywords
Quantum dot; Silicone encapsulant; Ligand; Thermal curing degree; TOPO;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Norris, D. J.; Sacra, A.; Murray, C. B.; Bawendi, M. G. Phys. Rev. Lett. 1994, 72, 2612-2615.   DOI   ScienceOn
2 Empedocles, S. A.; Norris, D. J.; Bawendi, M. G. Phys. Rev. Lett. 1996, 77, 3873-3876.   DOI   ScienceOn
3 Dabbousi, B. O.; Rodriguez-Viejo, J.; Mikulec, F. V.; Heine, J. R.; Mattoussi, H.; Ober, R.; Jensen, K. F.; Bawendi, M. G. J. Phys. Chem. B. 1997, 101, 9463-9475.   DOI   ScienceOn
4 Rodriguez-Viejo, J.; Jensen, K. F.; Mattoussi, H.; Michel, J.; Dabbousi, B. O.; Bawendi, M. G. Appl. Phys. Lett. 1997, 70, 2132-2134.   DOI   ScienceOn
5 Steckel, J. S.; Zimmer, J. P.; Coe-Sullivan, S.; Stott, N. E.; Bulovic, V.; Bawendi, M. G. Angew. Chem. Int. Ed. 2004, 43, 2154-2158.   DOI   ScienceOn
6 Anikeeva, P. O.; Madigan, C. F.; Coe-Sullivan, S. A.; Steckel, J. S.; Bawendi, M. G.; Bulovic, V. Chem. Phys. Lett. 2006, 424, 120-125.   DOI   ScienceOn
7 Anikeeva, P. O.; Halpert, J. E.; Bawendi, M. G.; Bulovic, V. Nano. Lett. 2009, 9, 2532-2536.   DOI   ScienceOn
8 Wood, V.; Panzer, M. J.; Chen, J.; Bradley, M. S.; Halpert, J. E.; Bawendi, M. G.; Bulovic, V. Adv. Mater. 2009, 21, 2151-2155.   DOI   ScienceOn
9 Shirasaki, Y.; Supran, G. J.; Bawendi, M. G.; Bulovic, V. Nature Photon. 2013, 7, 13-23.
10 Steigerwald, M. L.; Alivisatos, A. P.; Gibson, J. M.; Harris, T. D.; Kortan, R.; Muller, A. J.; Thayer, A. M.; Duncan, T. M.; Douglass, D. C.; Brus, L. E. J. Am. Chem. Soc. 1988, 110, 3046-3050.   DOI   ScienceOn
11 Murray, C. B.; Noms, D. J.; Bawendi, M. G. J. Am. Chem. Soc. 1993, 115, 8706-8715.   DOI   ScienceOn
12 Kim, S.; Bawendi, M. G. J. Am. Chem. Soc. 2003, 125, 14652-14653.   DOI   ScienceOn
13 Huang, B.; Donald, A. Inorg. Chim. Acta 2006, 359, 1961-1966.   DOI   ScienceOn
14 Hammer, N. I.; Emrick, T.; Barnes, M. D. Nanos. Res. Lett. 2007, 2, 282-290.   DOI
15 Watson, E. K.; Rickelton, W. A.; Solvent Extraction and Ion Exchange 1992, 10, 879-89.   DOI   ScienceOn