• 한국생산제조학회지
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• 제21권6호
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• pp.1008-1012
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• 2012

Injection molds are fabricated by assembling a number of plates in which mold core and cavity components are inserted. The assembled structure causes a number of contact interfaces between each component where the heat transfer is affected by the thermal contact resistance. However, the mold assembly has been treated as a one body in numerical analyses of injection molding, which has a limitation in predicting the mold temperature distribution during the molding cycle. In this study, a numerical approach that considers the thermal contact effect is proposed to predict the heat transfer characteristics of an injection mold assembly. To find the thermal contact conductance between the mold core and plate, a number of finite element (FE) simulations were performed with the design of experiment (DOE) and statistical analysis. Thus, the heat transfer analyses using the obtained conductance values can provide more reliable results than conventional one-body simulations.

• Nuclear Engineering and Technology
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• 제22권1호
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• pp.75-81
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• 1990

핵연료봉내의 온도 분포를 결정하는데 있어서 중요한 핵연료소자와 피복판 사이의 접촉 열전도도를 결정하기 위한 실험을 수행하였다. 이 실험에 사용된 측정장치는 접촉압력을 임의로 변화시켜 줄 수 있는 가압기와 열전대, 진공펌프, 핵연료소자, 봉형태의 피복관, 그리고 두 개의 히터 등으로 구성되어 있다. 접촉 열전도도는 $UO_2$ 소자와 Zircaloy-2 피복관 사이의 접촉 압력과 표면 조도를 변화시키면서 측정하였다. 그 결과 두 물체사이의 접촉압력이 증가함에 따라, 그리고 표면이 매끄러울수록 접촉 열전달계수는 증가하였다. 실험에서 얻은 값을 가지고 상관식을 만들었으며 일반적으로 사용되고 있는 상관식과 비교하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 춘계학술대회 논문집
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• pp.629-634
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• 1996

Heat generation in machine operating condition makes thermal deformation and thermalstress in the structure, which results in the change the contact characteristics of machine joint such s change of shrinkage fit, contact heat conductance and contact pressure. As the change of contact pressure is related to variation of static, dynamic and thermalcharacteristics, the prediction of transient contact perssure is strongly required. This paper presents some analytical results which will be effective to predict static and dynamic characteristics of the compound cylindrical structure.

• 한국항공우주학회지
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• 제45권12호
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• pp.1021-1030
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• 2017

본 논문은 유한요소 열해석 시 불일치하는 격자 접촉면의 열교환계수를 효과적으로 계산하는 방법에 대해 논의한다. 원래 유한요소해석은 두 경계면 사이의 격자가 일치해야 하는데, 복잡하고 다양한 재질의 형상들의 접촉면을 모두 일치하기 위해서는 많은 수고와 계산량이 소요된다. 본문은 이를 극복하기 위해 서로 다른 두 격자면의 접촉 열교환계수를 각 절점으로 효과적으로 분배하는 새로운 기법을 제안하였다. 제시된 기법의 지향점을 서술하고 이를 위해 격자면의 형상에 의존성이 낮은 절점 가중치 분배 기법을 서술하였다. 그리고 이를 3차원의 곡면 접촉면에도 적용하여 제시한 방법론의 범용성을 확인함으로서 열해석을 포함한 여타 유한요소 해석 기법에도 적용 가능함을 알 수 있다.

• 한국초전도ㆍ저온공학회논문지
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• 제17권4호
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• pp.1-7
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• 2015

This paper addresses technical problems of thermal contact conductance or resistance which inevitably occurs in most cryogenic engineering systems. The main focus of this paper is to examine what kind of physical factors primarily influences the thermal contact resistance and to suggest how it can be minimized. It is a good practical rule that the contact surface must have sub-micron roughness level with no oxide layer and be thinly covered by indium, gold, or Apiezon-N grease for securing sufficient direct contact area. The higher contact pressure, the lower the thermal contact resistance. The general description of this technique has been widely perceived and reasonable engineering results have been achieved in most applications. However, the detailed view of employing these techniques and their relative efficacies to reduce thermal contact resistances need to be thoroughly reviewed. We should consider specific thermal contact conditions, examine the engineering requirements, and execute each method with precautions to fulfil their maximum potentials.

• International Journal of Korean Welding Society
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• 제2권1호
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• pp.1-10
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• 2002

The thermal contact conductance at different temperatures and with different electrode forces and zinc coating morphology was measured by monitoring the infrared emissions from the one dimensionally simulated contact heat transfer experiments. The contact heat transfer coefficients were presented as a function of the harmonic mean temperature of the two contacting surfaces. Using these contact heat transfer coefficients and experimentally measured temperature profiles, the electrical contact resistivities both for the faying interface and electrode-workpiece interface were deduced from the numerical analyses of the one dimension simulation welding. It was found that the average value of the contact heat transfer coefficients for the material with zinc coating (coating weight from 0 g/$mm^2$to 100 g/$mm^2$) ranges from 0.05 W/$mm^2$$^{\circ}C$ to 2.0 W/$mm^2$$^{\circ}C$ in the temperature range above 5$0^{\circ}C$ harmonic mean temperature of the two contacting surfaces. The electrical contact resistivity deduced from the one dimension simulation welding and numerical analyses showed that the ratio of electrical contact resistivity at the laying interface to the electrical contact resistivity at the electrode interface is smaller than one far both bare steel and zinc coated steel.

• E2M - 전기 전자와 첨단 소재
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• 제10권9호
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• pp.895-900
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• 1997

A Quench in cable-in-conduit (CIC) conductors is often initiated by a disturbance such as strand motion that generates a highly localized normal zone in a strand or a few strands of the CIC conductors. The localized normal zone causes current and heat transfer between a disturbed strand and neighboring strands. Electrical and thermal contact characteristics between strands thus have an effect on the transient stability of the CIC conductors. In this paper the effect of contact characteristics between strands on the CIC conductor stability is presented based on the measured heat transfer characteristics of supercritical helium (SHe) for the local heating. The quench and recovery processes of the strands for the abrupt and highly localized disturbance are analyzed at the boundary between quench and recovery.

• 대한기계학회논문집A
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• 제40권1호
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• pp.41-51
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• 2016

볼나사 시스템은 볼과 그루브 사이에서 발생하는 마찰에 의해 온도가 상승하며, 이에 따른 열변형이 이송계의 위치결정 정도를 저하시킨다. 이를 보상하기 위해서는 볼나사 온도분포의 우선적 예측이 필요하다. 본 논문에서는 나사축 회전속도에 따른 온도분포를 해석하기 위해 볼나사 축과 너트를 각각 실린더와 중공 실린더로 가정한다. 경계조건인 대류 열전달계수, 볼과 그루브에서 발생하는 마찰토크와 접촉열전도를 볼나사 운전 및 조립 조건에 대하여 정식화 한다. 그리고, 현시적 유한차분법을 적용한 온도 분포 예측 시뮬레이터를 개발하고 그 유용성을 검증한다.

• 한국전기전자재료학회논문지
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• 제24권2호
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• pp.152-155
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• 2011

Even though nano-scale materials were very advantageous for various applications, there are still problems to be solved such as the stabilization of surface state and realization of low contact resistances between a semiconducting nanowire and electrodes in nano-electronics. It is well known that the effects of contacts barrier between nano-channel and metal electrodes were dominant in carrier transportation in individual nano-electronics. In this report, it was investigated the electrical properties of GaN nanorod devices after chemical etching and rapid thermal annealing for making good contacts. After KOH wet-etching of the contact area the devices showed better electrical performance compared with non-treated GaN individual devices but still didn't have linear voltage-current characteristics. The shape of voltage-current properties of GaN devices were improved remarkably after rapid thermal annealing as showing Ohmic behaviors with further bigger conductivities. Even though chemical etching of the nanorod surfaces could cause scattering of carriers, in here it was shown that the most important and dominant factor in carrier transport of nano-electronics was realization of low contact barrier between nano-channel and metal electrodes surely.

• 센서학회지
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• 제27권5호
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.