• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.14-14
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• 2011

Graphene is known to possess excellent thermal properties, including high thermal conductivity, that make it a prime candidate material for heat management in ultra large scale integrated circuits. For device applications, the key parameters are the thermal expansion coefficient and the thermal conductivity. There has been no reliable experimental determination on the thermal expansion coefficient of graphene whereas the estimates of the thermal conductivity vary widely. In this work, we estimate the thermal expansion coefficient of graphene on silicon dioxide by measuring the temperature dependence of the Raman spectrum. The shift of the Raman peaks due to heating or cooling results from both the intrinsic temperature dependence of the Raman spectrum of graphene and the strain on the graphene film due to the thermal expansion mismatch with silicon dioxide. By carefully comparing the experimental data against theoretical calculations, it is possible to determine the thermal expansion coefficient. The thermal conductivity is measured by estimating the thermal profile of a graphene film suspended over a circular hole of the substrate.

• Korean Journal of Materials Research
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• v.30 no.2
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• pp.93-98
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• 2020

Effective control of the heat generated from electronics and semiconductor devices requires a high thermal conductivity and a low thermal expansion coefficient appropriate for devices or modules. A method of reducing the thermal expansion coefficient of Cu has been suggested wherein a ceramic filler having a low thermal expansion coefficient is applied to Cu, which has high thermal conductivity. In this study, using pressureless sintering rather than costly pressure sintering, a polymer solution synthesis method was used to make nano-sized Cu powder for application to Cu matrix with an AlN filler. Due to the low sinterability, the sintered Cu prepared from commercial Cu powder included large pores inside the sintered bodies. A sintered Cu body with Zn, as a liquid phase sintering agent, was prepared by the polymer solution synthesis method for exclusion of pores, which affect thermal conductivity and thermal expansion. The pressureless sintered Cu bodies including Zn showed higher thermal conductivity (180 W/m·K) and lower thermal expansion coefficient (15.8×10^-6/℃) than did the monolithic synthesized Cu sintered body.

• Journal of Korea Foundry Society
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• v.9 no.1
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• pp.80-88
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• 1989

SGCI(Spheroidal Graphite Cast Iron), CVGCI(CV Graphite Cast Iron) and FGCI(Flake Graphite Cast Iron) having different contents of Mn($0.25%{\sim}0.85%$) and Ni($0.3%{\sim}1.2%$) were produced, respectively. The thermal expansion and thermal conductivity of the cast iron were investigated in the temperature range of $50^{\circ}C{\sim}300^{\circ}C$. As the graphite nodularity of the cast iron increases, thermal expansion coefficient increases, thermal conductivity and electrical conductivity to thermal conductivity ratio decrease. The thermal expansion coefficient of the cast iron increases with increasing Mn content and decreases with increasing Ni content. The thermal conductivity of the cast iron decreases with increasing Mn and Ni contents.

• Korean Journal of Materials Research
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• v.31 no.11
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• pp.626-634
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• 2021

Cu matrix composites reinforced with chopped carbon fiber (CF), which is cost effective and can be well dispersed, are fabricated using electroless plating and hot pressing, and the effects of content and alignment of CF on the thermal properties of CF/Cu composites are studied. Thermal conductivity of CF/Cu composite increases with CF content in the in-plane direction, but it decreases above 10% CF; this is due to reduction of thermal diffusivity related with phonon scattering by agglomeration of CF. The coefficient of thermal expansion decreases in the in-plane direction and increases in the through-plane direction as the CF content increases. This is because the coefficient of thermal expansion of the long axis of CF is smaller than that of the Cu matrix, and the coefficient of thermal expansion of its short axis is larger than that of the Cu matrix. The thermal conductivity is greatly influenced by the agglomeration of CF in the CF/Cu composite, whereas the coefficient of thermal expansion is more influenced by the alignment of CF than the aggregation of CF.

• Nuclear Engineering and Technology
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• v.47 no.7
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• pp.814-826
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• 2015

The most important advantage of nanoparticles is the increased thermal conductivity coefficient and convection heat transfer coefficient so that, as a result of using a 1.5% volume concentration of nanoparticles, the thermal conductivity coefficient would increase by about twice. In this paper, the effects of a nanofluid ($TiO_2$/water) on heat transfer characteristics such as the thermal conductivity coefficient, heat transfer coefficient, fuel clad, and fuel center temperatures in a VVER-1000 nuclear reactor are investigated. To this end, the cell equivalent of a fuel rod and its surrounding coolant fluid were obtained in the hexagonal fuel assembly of a VVER-1000 reactor. Then, a fuel rod was simulated in the hot channel using Computational Fluid Dynamics (CFD) simulation codes and thermohydraulic calculations (maximum fuel temperature, fluid outlet, Minimum Departure from Nucleate Boiling Ratio (MDNBR), etc.) were performed and compared with a VVER-1000 reactor without nanoparticles. One of the most important results of the analysis was that heat transfer and the thermal conductivity coefficient increased, and usage of the nanofluid reduced MDNBR.

• Korean Journal of Materials Research
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• v.21 no.8
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• pp.456-460
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• 2011

Microelectromechanical systems (MEMS)-fabricated suspended devices were used to measure the in-plane electrical conductivity, Seebeck coefficient, and thermal conductivity of 304 nm and 516 nm thick InGaAlAs films with 0.3% ErAs nanoparticle inclusions by volume. The suspended device allows comprehensive thermoelectric property measurements from a single thin film or nanowire sample. Both thin film samples have identical material compositions and the sole difference is in the sample thickness. The measured Seebeck coefficient, electrical conductivity, and thermal conductivity were all larger in magnitude for the thicker sample. While the relative change in values was dependent on the temperature, the thermal conductivity demonstrated the largest decrease for the thinner sample in the measurement temperature range of 325 K to 425 K. This could be a result of the increased phonon scattering due to the surface defects and included ErAs nanoparticles. Similar to the results from other material systems, the combination of the measured data resulted in higher values of the thermoelectric figure of merit (ZT) for the thinner sample; this result supports the theory that the reduced dimensionality, such as in twodimensional thin films or one-dimensional nanowires, can enhance the thermoelectric figure of merit compared with bulk threedimensional materials. The results strengthen and provide a possible direction in locating and optimizing thermoelectric materials for energy applications.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.89-94
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• 2022

Thermoelectric materials can directly convert a temperature gradient to an electrical energy and vice-versa, and their performance is determined by the electrical conductivity, Seebeck coefficient, and thermal conductivity. However, it is difficult to establish an effective strategy for enhancing performance since electrical conductivity, Seebeck coefficient, and thermal conductivity are strongly dependent on the composition, crystal structure, and electronic structure of the material, and show a correlation with each other. Herein, based on the understanding of the formulas related to the performance of thermoelectric materials, we provide a methodology to establish feasible defect engineering strategies of thermal conductivity reduction for improving the performance of thermoelectric materials in connection with the experimental results.

• Journal of the Korean Ceramic Society
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• v.53 no.1
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• pp.43-49
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• 2016

This analyzed a Young's modulus (E), a thermal expansion coefficient (TEC, ${\beta}$) and a thermal conductivity (${\kappa}$) of the material with simple cubic particulate inclusion using two model structures: a parallel structure and a series structure of laminated layers. The derived ${\beta}$ equations were applied to calculate the ${\beta}$ value of the W-MgO system. The accuracy was higher for the series model structure than for the parallel model structure. Young's moduli ($E_c$) of sintered porous alumina compacts were theoretically related to the development of neck growth of grain boundary between sintered two particles and expressed as a function of porosity. The series structure model with cubic pores explained well the increased tendency of $E_c$ with neck growth rather than the parallel structure model. The thermal conductivity of the three phase system of alumina-mullite-pore was calculated by a theoretical equation developed in this research group, and compared with the experimental results. The pores in the sintered composite were treated as one phase. The measured thermal conductivity of the composite with 0.5-25% porosity (open and closed pores) was in accordance with the theoretical prediction based on the parallel structure model.

• Fire Science and Engineering
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• v.32 no.2
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• pp.17-23
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• 2018

In this study, the relations of the wall thermal conductivity and surface temperature in a compartment fire are investigated using Buckingham Pi theorem. The dimensionless parameters of the previous study are analyzed in order to correlate the dimensionless groups of the heat release rate, the thermal conductivity, the volume of compartment and the convective heat transfer coefficient. In addition the reduced scale of compartment, which has 1/6 size of ISO 9705 Room Corner Tester, is manufactured and the oxygen concentration and the maximum temperature in the space are measured for the gasoline pool fire ($10cm{\times}10cm$, $15cm{\times}15cm$ and $20cm{\times}20cm$). Finally, the criterion of the wall temperature increase are suggested in accordance with the thermal conductivity and the convective heat transfer coefficient. In addition, the dimensionless empirical equation using Buckingham Pi theorem considering the heat release rate are presented suggested. The results of this study will be useful especially for the fire phenomenon investigation of the wall thermal conductivity coefficient and shape in the compartment space.

• Journal of Powder Materials
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• v.26 no.2
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• pp.112-118
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• 2019

Infiltration is a popular technique used to produce valve seat rings and guides to create dense parts. In order to develop valve seat material with a good thermal conductivity and thermal expansion coefficient, Cu-infiltrated properties of sintered Fe-Co-M(M=Mo,Cr) alloy systems are studied. It is shown that the copper network that forms inside the steel alloy skeleton during infiltration enhances the thermal conductivity and thermal expansion coefficient of the steel alloy composite. The hard phase of the CoMoCr and the network precipitated FeCrC phase are distributed homogeneously as the infiltrated Cu phase increases. The increase in hardness of the alloy composite due to the increase of the Co, Ni, Cr, and Cu contents in Fe matrix by the infiltrated Cu amount increases. Using infiltration, the thermal conductivity and thermal expansion coefficient were increased to 29.5 W/mK and $15.9um/m^{\circ}C$, respectively, for tempered alloy composite.