• 한국전산구조공학회논문집
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• 제32권2호
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• pp.103-108
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• 2019

본 논문에서는 비평형 분자동역학 시뮬레이션 기법을 사용하여 알루미늄 박막과 실리콘 웨이퍼 간 열경계저항을 예측하였다. 실리콘의 끝 단 고온부에 열을 공급하고, 같은 양의 열을 알루미늄 끝 단 저온부에서 제거하여 경계면을 통한 열전달이 일어나도록 하였으며, 실리콘 내부와 알루미늄 내부의 선형 온도 변화를 계산함으로써 경계면에서의 온도 차이에 따른 열저항 값을 구하였다. 300K 온도에서 $5.13{\pm}0.17m^2{\cdot}K/GW$의 결과를 얻었으며, 이는 열유속 조건의 변화와 무관함을 확인하였다. 아울러, 펨토초 레이저 기반의 시간영역 열반사율 기법을 사용하여 열경계저항 값을 실험적으로 구하였으며, 시뮬레이션 결과와 비교 검증하였다. 전자빔 증착기를 사용하여 90nm 두께의 알루미늄 박막을 실리콘(100) 웨이퍼 표면에 증착하였으며, 유한차분법을 이용한 수치해석을 통해 열전도 방정식의 해를 구해 실험결과와 곡선맞춤 함으로써 열경계저항을 정량적으로 평가하고 나노스케일에서의 열전달 현상에 관한 특징을 살펴보았다.

• 대한조선학회지
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• 제9권2호
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• pp.21-32
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• 1972

The problems of thermal stress and residual stress in resistance spot welding are studied from two standpoint namely, effect of temperature distributions and effect of the radius of free boundary. The radius of the region where the temperature distributions are occured is taken as a function of time after welding and as a finite size, 6 times of heated zone. The region of the radial stress distribution is treated as a function of time under Saint-Venant's principle and 6 or 12 times of originally heated zone. Thermal stresses and strains are obtained by analytic solution under constant mechanical properties and by the finite difference method for varing properties under temperature variation. From the computed results following conclusions are derived (1) For the engineering purpose, the region of temperature distribution and stress distribution can be treated as a finite region, $R=r_o=6r_e$ (2) If the maximum temperature of the aluminum alloy plate is less than $500^{\circ}F$, thermal stresses and strains can be obtained with constant mechanical properties. (3) The residual stresses and strains will be remained in welds and its vicinity.

• E2M - 전기 전자와 첨단 소재
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• 제8권6호
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• pp.737-743
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• 1995

Two step RTD(Rapid Thermal Diffussion) of P into silicon wafer using tungsten halogen lamp was used to fabricated very shallow n$^{+}$p junction. 1st RTD was performed in the temperature range of 800.deg. C for 60 see and the heating rate was in the 50.deg. C/sec. Phosphrous solid source was transfered on the silicon surface. 2nd RTD process was performed in the temperature range 1050.deg. C, 10sec. Using 2 step RTD we can obtain a shallow junction 0.13.mu.m in depth. After RTD, the Ti-silicide process was performed by the two step RTA(Rapid Thermal Annealing) to reduced the electric resistance and to improve the n$^{+}$p junction diode. The titanium thickness was 300.angs.. The condition of lst RTA process was 600.deg. C of 30sec and that of 2nd RTA process was varied in the range 700.deg. C, 750.deg. C, 800.deg. C for 10sec-60sec. After 2 step RTA, sheet resistance was 46.ohm../[]. Ti-silicide n+p junction diode was fabricated and I-V characteristics were measured.red.

• 설비공학논문집
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• 제21권11호
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• pp.613-620
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• 2009

The thermal stresses of a ceramic heat exchanger were analyzed numerically since the ceramic material is good in heat resistance but weak in the thermal stress. The analysis of thermal stress was conducted in the ceramic core with two boundary conditions depending on bolt jointing. The thermal stresses were computed by applying temperature and pressure distributions obtained from the numerical results of conjugate heat transfer to ANSYS WORKRBENCH. When number of bolt joining halls was reduced from $8\times2$ to $4\times2$, the maximum principal stresses decrease by 47.6~50.5% and increase in safety factors by 2.18~2.5 for ultimate tensile strength. Thus, it can be said that bolt joining halls should be minimized in ceramic heat exchanger to be efficient in reducing thermal stress. In addition, the width of particular gas flow passages were revised from 52 mm to 42 mm to reduce maximum thermal stresses since certain passages experienced high thermal stresses. From the revision, safety factors were increased by 13.8~14.1% for the boundary condition of $4\times2$ bolt joining halls. Therefore, it is suggested that thermal stress can be reduced by changing local geometry of a ceramic heat exchanger.

• 한국화재소방학회논문지
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• 제24권6호
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• pp.69-75
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• 2010

콘크리트가 충전된 각형강관 기둥(CFT)은 외부에 강재가 노출된 형상으로 외측의 강관은 화재시 급격한 온도상승으로 인해 강도가 저하되나, 내부의 콘크리트는 열용량이 큰 재료로써 내화성능을 확보할 수 있는 구조로 구성되어 있다. CFT 기둥을 내화구조로서 적용하기 위해서는 구조적 성능에 영향을 미치는 인자에 대한 연구가 필요하며, 이에 대한 조건별 영향성에 관한 연구가 필요하다. 내화성능에 영향을 주는 주요인자는 콘크리트 압축강도.단면크기.축력비.경계조건이며, 그 중 기둥과 보의 경계조건은 구조적 측면에서 하중지지능력에 영향을 미치므로 내화성능을 지배하는 주요 인자 중에 하나이다. 실험결과 360단면에서는 양단 고정조건에서는 106분의 내화성능이 확보되나 양단 힌지 조건에서는 89분의 내화성능을 확보하는 것으로 나타났다. 280단면에서는 양단 고정조건에서는 113분의 내화성능이 확보되나 양단힌지 조건에서는 78분의 내화성능을 확보하였다.

• Nuclear Engineering and Technology
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• 제34권2호
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• pp.132-141
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• 2002

The effects of microstructure on fretting wear were investigated in Inconel 690 tube. The microstructure observation indicated that the solution annealing temperature and time affected the grain size of the Inconel 690 tubes. The carbide morphology, along grain boundaries, was mainly affected by thermal treatment time and temperature. The wear test results showed that specimens with larger grain size and with coarse carbides along grain boundaries had better wear resistance. Cracks were found in specimens with carbides along the grain boundary, while few cracks were found in carbide free specimens. It seemed that the carbides on grain boundary assisted crack formation and propagation in carbide containing specimens. On the other hand, the micro-hardness of specimen did not have a major role in fretting wear. It could be inferred from the SEM images of worn surfaces that the main wear mechanism of carbide containing specimen was delamination, while that of carbide free specimen was abrasion.

• 한국재료학회지
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• 제16권9호
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• pp.564-570
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• 2006

Silicides have been required to be below 40 nm-thick and to have low contact resistance without agglomeration at high silicidation temperature. We fabricated composite silicide layers on the wafers from Ni(20 nm)/Co(20 nm)/poly-Si(70 nm) structure by rapid thermal annealing of $700{\sim}1100^{\circ}C$ for 40 seconds. The sheet resistance, surface composition, cross-sectional microstructure, and surface roughness were investigated by a four point probe, a X-ray diffractometer, an Auger electron spectroscopy, a field emission scanning electron microscope, and a scanning probe microscope, respectively. The sheet resistance increased abruptly while thickness decreased as silicidation temperature increased. We propose that the fast metal diffusion along the silicon grain boundary lead to the poly silicon mixing and inversion. Our results imply that we may consider the serious thermal instability in designing and process for the sub-0.1 um CMOS devices.

• 마이크로전자및패키징학회지
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• 제6권4호
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• pp.23-33
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• 1999

유한요소법을 이용한 IGBT 3상 풀브릿지 모듈의 열.응력 해석을 수행하였다. 패키지 재료에 의한 영향을 살피고자 AIN과 $A1_2O_3$절연기판을 사용한 경우를 비교하였으며, 적층구조의 규격을 변화시켜 열해석 및 열응력 해석결과를 비교하였다. 열해석 경계조건 설정에 따른 차이를 비교하기 위하여 등가열전달계수 경계조건(FHTCC)과 일정온도 경계조건(CTC)으로 나누어 해석하였다. 절연기판 면적의 증가는 열저항 감소에 거의 기여하지 못하였으나 열응력 감소에는 상당한 효과를 보였는데, 기판면적이 3배 넓어지면 열저항 감소분은 $A1_2O_3$ 절연기판 모듈에서 8.9%정도, AIN 절연기판 모듈에선 1.5% 정도 감소하는데 그쳤으나 열응력은 최고 60%의 감소를 보였다. 또한 솔더의 두께가 증가할수록 열저항은 증가하였으나, 열응력은 감소 또는 일정하게 유지함을 확인하였다. 각 모듈에서 최대응력값은 모두 절연기판과 접촉된 상, 하부 Cu pad에서 발생하였으며 모듈 패키지 가장자리 부분보다는 중앙부의 응력값이 높았다.

• 농업과학연구
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• 제38권1호
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• pp.115-120
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• 2011

20% of total energy use to sustain temperature of building inside. In this reasons, researchers effort to improve the thermal insulation capacity with new wall system. Using appropriate materials and consisting new wall system should considered in energy saving design. OSB(Oriented strand board), Larch lining board used to consist wall system. $2{\sim}6$ Larch lining board has tongue & groove shape for preventing moisture. Comparing with gypsum board and green timber lining board as interior sheathing material, temperature difference of Green timber wall system was bigger than temperature difference of gypsum board wall system. This aspects indicate that Green timber wall system was revealed higher thermal insulation property than gypsum board wall system. Gypsum board portion transfer heat easily because temperature difference gradient of gypsum board wall system was smaller than OSB wall system. Total temperature variation shape of G-4-S and G-6-S show similar model but, temperature variation shape in green timber wall portion assume a new aspect. The purpose of this study was that possibility of thermal insulation variation and new composition of wall system identify to improve thermal insulation performance. In the temperature case, this study shows possibility of improving thermal insulation performance. Humidity, sunshine and wind etc. should considered to determine building adiabatic properties.

• Membrane and Water Treatment
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• 제2권3호
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• pp.159-173
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• 2011

The air gap membrane distillation (AGMD) process was applied for water desalination. The main objective of the present work was to study the heat and mass transfer mechanism of the process. The experiments were performed on a flat sheet module using aqueous NaCl solutions as a feed. The membrane employed was hydrophobic PTFE of pore size 0.22 ${\mu}m$. A mathematical model is proposed to evaluate the membrane mass transfer coefficient, thermal boundary layers' heat transfer coefficients, membrane / liquid interface temperatures and the temperature polarization coefficients. The mass transfer model was validated by the experimentally and fitted well with the combined Knudsen and molecular diffusion mechanism. The mass transfer coefficient increased with an increase in feed bulk temperature. The experimental parameters such as, feed temperature, 313 to 333 K, feed velocity, 0.8 to 1.8 m/s (turbulent flow region) were analyzed. The permeation fluxes increased with feed temperature and velocity. The effect of feed bulk temperature on the boundary layers' heat transfer coefficients was shown and fairly discussed. The temperature polarization coefficient increased with feed velocity and decreased with temperature. The values obtained were 0.56 to 0.82, indicating the effective heat transfer of the system. The fouling was observed during the 90 h experimental run in the application of natural ground water and seawater. The time dependent fouling resistance can be added in the total transport resistance.