• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.12
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• pp.2655-2661
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• 2009

In this paper, an accurate noise parameters for thermal noise modeling of short channel MOSFET is derived and extracted. Fukui model for calculating the noise parameters of a MOSFET is modified by considering effects of parasitic elements in short channel, and it is compared with conventional noise model equation. In addition, for obtaining the intrinsic noise sources of devices, noise parameters(minimum noise figure $F_{min}$, equivalent noise resistance $R_n$ optimized source admittance $Y_{opt}=G_{opt}+B_{opt}$) in submicron MOSFETs is extracted. With this extraction method, the intrinsic noise parameters of MOSFET without effects of probe pad and extrinsic parasitic elements from RF noise measurements can be directly obtained.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.31-35
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• 2013

TSOP(Thin Small Outline Package) is the IC package using lead frame, which is the type of low cost package for white electronics, auto mobile, desktop PC, and so on. Its performance is not excellent compared to BGA or flip-chip CSP, but it has been used mostly because of low price of TSOP package. However, it has been issued in TSOP package that thermal deflection of lead frame occurs frequently during molding process and Au wire between semiconductor die and pad is debonded. It has been required to solve this problem through substituting materials with low CTE and improving structure of lead frame. We focused on developing the lead frame structure having thermal stability, which was carried out by numerical analysis in this study. Thermal deflection of lead frame in TSOP package was simulated with positions of anti-deflection adhesives, which was ranging 198 um~366 um from semiconductor die. It was definitely understood that thermal deflection of TSOP package with anti-deflection adhesives was improved as 30.738 um in the case of inside(198 um), which was compared to that of the conventional TSOP package. This result is caused by that the anti-deflection adhesives is contributed to restrict thermal expansion of lead frame. Therefore, it is expected that the anti-deflection adhesives can be applied to lead frame packages and enhance their thermal deflection without any change of substitutive materials with low CTE.

• Proceedings of the KIEE Conference
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• 2002.07b
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• pp.694-696
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• 2002

Transformers together with all equipment and accessories shall be designed and constructed to withstand the mechanical and thermal stresses produced by external short circuit which include three phase, single line-to-ground, double line-to-ground and line-to-line faults etc. Generally the Short Circuit Test of transformers is tested according to the ANSI/IEEE, IEC/JEC, KS etc, in domestic. In this study, it will be showed and compared the difference of symmetrical current for short circuit test of a Pad -mounted transformer according to with ANSI /IEEE and IEC.

• Proceedings of the KSR Conference
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• 2003.10b
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• pp.442-447
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• 2003

The actual behavior of the railroad track structure is suspected to be a complex interaction between the vertical, lateral, longitudinal, and torsional behaviors. A FE program are developed in the present study to be used for extensive nonlinear analysis of the track structures subjected to thermal load. Using the rigorous study on the deformed shape of the rail and tie, and stress resultants, characteristics of the three dimensional behavior are investigated. It is found that the flexural rigidity of the tie and the rotational stiffness of pad-fastener can be affect the behavior of the track structure and the postbuckling behavior in each rail, except lateral behavior, is not same.

• Aerospace Engineering and Technology
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• v.11 no.2
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• pp.26-32
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• 2012

The purpose of this paper is to present the summary of trouble shooting result on the dendrite defect of SSM(Second Surface Mirror) which is one of major thermal control elements for satellite. Through this failure analysis on SSM dendrite, it is found that the dendrite defect may happen to silver coated layer of SSM if SSM is directly exposed to the environment containing sulfur or chlorine compound. As a preventive action, it is required that SSM shall not contact directly with rubber pad containing sulfur compound.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.28-33
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• 2001

Screw conveyors are used extensively in industrial for conveying and elevating materials. Despite their apparent simplicity, the mechanics of the conveying action is very complex. so many engineers depend on experiential data. Capacities of screw are pumping, steady flow of polymer melts, steady volumetric throughput etc. they are affected by geometry of screw, heat flux, pressure on inside barrel, rotating velocity, friction coefficient at screw surface etc. by computation volumetric efficiency increases as rotating velocity increases and decreases as friction coefficient increases. also it decreases with short pitch length. and double flight screw is more effective than single flight screw. The temperature of polymer melts by heating pad and injection pressure play a very important role in the injection molding machine. so in this paper we analyze thermal distortion and stress of screw includes pressure and temperature distributions by finite element analysis to understand what design factors influence on volumetric throughput efficiency of the screw and thermo-mechanical characteristics of screw.

• Journal of Sensor Science and Technology
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• v.19 no.2
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• pp.130-136
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• 2010

The microbolometer array sensor with fine pitch pixel array has been implemented to the released amorphous silicon layer supported by two contact pads. For the design of focal plane mirror with geometrical flatness, the simple beam test structures were fabricated and characterized. As the beam length decreased, the effect of beam width on the bending was minimized, Mirror deformation of focal plane in a real pixel showed downward curvature by residual stress of a-Si and Ti layer. The mirror tilting was caused by the mis-align effect of contact pad and confirmed by FEA simulation results. The properties of bolometer have been measured as such that the NETD 145 mK, the TCR -2 %/K, and thermal time constant 1.99 ms.

• Journal of Welding and Joining
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• v.14 no.3
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• pp.86-92
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• 1996

This paper presents the investigations on the initial strength and its variation of Sn-Pb solder joint using different lead frames, such as are 42 alloy lead and Cu alloy lead. As the result of the lack of initial strength at solder joints, whose pitch is from 0.3 to 0.4mm, short circuit often occured at the solder joint by thermal shock or external impact. Therefore, in this paper investigations were performed on the initial strength and its variation of Sn-Pb solder joint as well as fractured mode with using different lead frames.

• Tribology and Lubricants
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• v.15 no.4
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• pp.314-320
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• 1999

Friction and wear characteristics of phenolic resin-based friction materials reinforced with aramid pulp and potassium titanate were investigated using a pad-on-disk type friction tester. Friction characteristics such as friction stability, thermal stability, and wear rate varied according to the type of phenolic resins and the relative amount of aramid pulp and potassium titanate. The modified novolac resin-based friction materials showed better heat resistance and friction stability than those with the unmodified(straight) novolac resin. Compared with friction materials filled with potassium titanate or aramid pulp only, the friction materials reinforced with both aramid pulp and potassium titanate showed good friction stability and wear resistance. Increment of aramid pulp from 10 to 20 vol.% however, showed little difference in friction stability.

• Journal of the Korean Home Economics Association
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• v.25 no.1
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• pp.43-50
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• 1987

Non-durable flame retardant finish, borax/boric acid mixed solution, was applied to cotton fabric with pad-dry method. The LOI(limited oxygen index) was measured as the measare of the flame retardant effect. The TGA was investigated to know the thermal behavior of the samples. In addition, the solubility of the solutions was investigated. The results were as follows: 1) There was a synergism of flame retardant effect in the borax/boric acid mixed solution treatment and the maximum synergism was shown around the ratio of 7 : 3 2) After the borax/boric acid solution treatment, the degradation temperature was lowered and degraded at the larger temp range with slower rate. The residual char length also increased. 3) The solubility of borax/boric acid become higher when the ratio of borax/boric acid became similar. Compositions from 80/20 to 40/60 borax/boric acid mixtures were solubilized well in room temperatuare or warmwater therefor there was no problem for home use.