• Carbon letters
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• v.4 no.3
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• pp.111-116
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• 2003

Carbon/carbon composites were developed using PAN based carbon fibres and phenolic resin as matrix in different volume fractions and heat treated to temperatures between $1000^{\circ}C$ to $2500^{\circ}C$. Although both the starting precursors are nongraphitizing hard carbons individually, their composites lead to very interesting properties e.g. x-ray diffractograms show the development of graphitic phase for composites having fibre volume fractions of 30~40%. Consequently the electrical resistivity of such composites reaches a value of $0.8\;m{\Omega}cm$, very close to highly graphitic material. However, it was found that by increasing the fibre volume fraction to 50~60%, the trend is reversed. Optical microscopy of the composites also reveals the development of strong columnar type microstructure at the fibre (matrix interface due to stress graphitization of the matrix. The study forcasts a unique possibility of producing high thermal conductivity carbon/carbon composites starting with carbon fibres in the chopped form only.

• Transactions on Electrical and Electronic Materials
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• v.15 no.2
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• pp.73-76
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• 2014

$Pt/Al_2O_3/La_2Si_5O_x/SiO_2/Si$ charge trap memory capacitors were prepared, in which the $La_2Si_5O_x$ film was used as the charge trapping layer, and the effects of post annealing atmospheres ($NH_3$ and $N_2$) on their memory characteristics were investigated. $La_2O_3$ nanocrystallites, as the storage nodes, precipitated from the amorphous $La_2Si_5O_x$ film during rapid thermal annealing. The $NH_3$ annealed memory capacitor showed higher charge storage performances than either the capacitor without annealing or the capacitor annealed in $N_2$. The memory characteristics were enhanced because more nitrogen was incorporated at the $La_2Si_5O_x/SiO_2$ interface and interfacial reaction was suppressed after the $NH_3$ annealing treatment.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.4
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• pp.454-461
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• 2015

Light enhancement of GaN based light emitting diodes (LEDs) have been investigated by texturing the top p-GaN surface. Nano-textured LEDs have been fabricated using self-assembled Ni nano mask during dry etching process. Experimental results were further compared with simulation data. Three types of LEDs were fabricated: Conventional (planar LED), Surface nano-porous (porous LED) and Surface nano-cluster (cluster LED). Compared to planar LED there were about 100% and 54% enhancement of light output power for porous and cluster LED respectively at an injection current of 20 mA. Moreover, simulation result showed consistency with experimental result. The increased probability of light scattering at the nano-textured GaN-air interface is the major reason for increasing the light extraction efficiency.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.2
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• pp.68-76
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• 1992

Concurrent Junction process (simultaneous formation of a silicide and a junction on the implanted substrate) by Rapid Thermal Annealig has been investigated. Electrical and material properties of CoSi$_2$ films were analyzed with Alpha Step, 4-point probe, X-ray diffraction(XRD) and Scanning Electron Microscope(SEM). And CoSi$_2$ junctions were examined with Spreading Resistance probe in order to see the redistribution of electrically activated dopants and determined the junction depth. Two step annealing process, which was 80$0^{\circ}C$ for 30sec and 100$0^{\circ}C$ for 30sec in NS12T ambient was employed to form CoSi$_2$ and shallow junctions. Resistivity of CoSi$_2$ was turned out to be 11-15${\mu}$cm and shallow junctions less than 0.1$\mu$m were successfully formed by the process. It was found that the dopant concentration at CoSi$_2$/Si interface increased as decreasing the thickness of Co films in case of $p^{+}/n$ and $n^{+}/p$ junctions while the junction depth decreased as increasing CoSiS12T thickness in case of $p^{+}/n$ junction.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1987.06a
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• pp.50-56
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• 1987

A mechanical face seal is most commonly used to seal liquids and gases at various speeds, pressures and temperatures. The primary seal ring is in sliding contact with the seal seat and as a result heat in the vicinity of the interface is generated. Local temperatures at points along the circumferential direction will fluctuate as asperities on the surfaces pass. This kind of fluctuation of temperature has been investigated to take place. This may lead to the hot spots phenomenon between the contacting asperities. Sibley and Allen showed photographic evidence of systemically moving hot spots in the contact zone. The appearance of such a temperature disturbance has been attributed to a kind of thermoelastic instabilities between two surfaces: This involves a feedback loop which comprises localized elevation of frictional heating, resultant localized thermal bulding, localized pressure increase as the result of the bulging and futher elevation of frictional heating as the result of the pressure increase. The heating of hot spots will be continued until the expanded material due to the frictional heating is worn off. Therefore to predict the speed of temperature propagation into the body is essential to the analysis of heat transfer on the edge of the seal.

• Journal of the Korean institute of surface engineering
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• v.28 no.6
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• pp.368-375
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• 1995

Thermal CVD method is in general used for the fabrication of TiC/$Al_2O_3$-coated carbide tools. The growth of TiC layer and the coating morphology depended on the chemical composition of the hard metal substrate on which the tool properties were strongly influenced. TiC-coated layer was grown by the diffusion of carbon from the substrate, whereas the growth of $Al_2O_3$ layer was unrelated to the composition of substrate. In the nitride hard coatings of Zr, Nb and Mo metals deposited on high speed steel substrate by magnetron sputtering, the reactivity of the metal elements was decreased with increasing group number in one period of the periodic system. The hard material films exhibited the highest adhesion with the chemical composition of stoichiometry or substoichiometry. The critical load as a measure of adhesion was evaluated using scratch tester. The CVD tools indicated the values of 80 and 40N in the coated layers with proper bonding to the substrate and with $\eta$ phase of 1$\mu\textrm{m}$ in the interface respectively, but the nitride films prepared by sputtering of PVD showed only the values between 10 and 20N.

• Journal of Powder Materials
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• v.19 no.4
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• pp.278-284
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• 2012

$Al_2O_3$ foam is an important engineering material because of its exceptional high-temperature stability, low thermal conductivity, good wear resistance, and stability in hostile chemical environment. In this work, $Al_2O_3$ foams were designed to control the microstructure, porosity, and cell size by varying different parameters such as the amount of amphiphile, solid loading, and stirring speed. Particle stabilized direct foaming technique was used and the $Al_2O_3$ particles were partially hydrophobized upon the adsorption of valeric acid on particles surface. The foam stability was drastically improved when these particles were irreversibly adsorbed at the air/water interface. However, there is still considerable ambiguity with regard to the effect of process parameters on the microstructure of particle-stabilized foam. In this study, the $Al_2O_3$ foam with open and closed-cell structure, cell size ranging from $20{\mu}m$ to $300{\mu}m$ having single strut wall and porosity from 75% to 93% were successfully fabricated by sintering at $1600^{\circ}C$ for 2 h in air.

• Electrical & Electronic Materials
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• v.9 no.7
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• pp.708-718
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• 1996

The microstructure and electrical properties of the nonlinear ZnO varistor with A1$_{2}$ $O_{3}$ additions is investigated. The variation of nonlinear behavior with A1$_{2}$ $O_{3}$ additions is indicated from J-E and C-V measurement to be a result of the change of the interface defects density $N_{t}$ at the grain boundaries and the donor concentration $N_{d}$ in the ZnO grains. The optimum composition which has the nonlinear coefficients of -57 was observed in the sample with 0.005wt% A1$_{2}$ $O_{3}$ additions. The conduction mechanism at the pre-breakdown region is consistent with a Schottky thermal emission process obeying a relation given by $J^{\var}$exp[-(.psi.-.betha. $E^{1}$2/)kT] and the conduction process at the breakdown region follows a Fowler-Nordheim tunneling mechanism of the form $J^{\var}$exp(-.gamma./E).

• Journal of Korea Foundry Society
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• v.20 no.1
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• pp.21-28
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• 2000

Ni and Ni-Cr porous metals which are estimated to be easy to fabricate by squeeze casting are used as strengtheners for composite materials. As a matrix material, Al-7%wtSi-0.3 wt%Mg(AC4C) has been used. In case of Ni/AC4C and Ni-Cr/AC4C composite, $750^{\circ}C$ melt temperature and minimum 25 MPa squeezing pressure are needed to produce sound composite materials. The observation of interfacial reaction zone at various heat treatment condition showed that solutionizing temperature of above 520^{\circ}C$, the interfacial reaction zone increased proportionally with increasing heat treatment tim and reaction products formed by interfacial reaction are mainly composed of $Al_3Ni$ and $Al_3Ni_2$ phases. The tensile strength of Ni/AC4C and Ni-Cr/AC4C composite is lower than the matrix metal and this can be explained by the brittle intermetallic compounds formed at the interface of Ni and Ni-Cr reinforcements. But the properies of hardness, wear resistance and thermal expansion are better than the matrix due to the strengthening effect of Ni-Cr porous metals.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.8
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• pp.18-24
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• 2021

Polymers, polymer compounds, are very moldable at low temperatures and have good strength against weight, and hence, are often used in the interior and exterior materials of cars. Owing to the increasing environmental problems, emission regulations have become stricter, which has increased the use of lightweight polymers as substitutes for metal materials. Therefore, as the use of polymer increases, extensive research is being conducted on the bonding technology of polymers, such as polyurethane and epoxy. However, the increased cost and environmental pollution by adhesives caused by the polymer manufacturing plant depend on the chemical composition or the manufacturer's mix ratio. To compensate for this issue, a laser beam is irradiated through a highly permeable polymer (PC) placed on top of an absorbent polymer (ABS) to transfer the laser output to the ABS polymer and fuse them at the interface. Moreover, enabling laser penetrating bonding by placing a stainless steel wire mesh between the two polymers can achieve improved bonding strength compared to conventional heterogeneous polymer bonding.