• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.150-150
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• 2000

The adsorption geometry and the electronic property of Mg grown at room temperature on the Si(111)-7$\times$7 surface with various coverages have been studied by scanning tunneling microscopy (STM) and low energy electron diffraction (LEED). At low Mg coverage, the Mg atoms preferentially adsorb at the center adatom sites of the faulted half of the Si(111)-7$\times$7 surface. The adsorbed Mg atom acts as nucleophile with respect to Si atoms thus forms a stable ionic bond with the substrate Si atoms. Above 1 Ml, the 7$\times$7 surface starts to be disrupted and an amorphous Mg overlayer is formed. The LEED shows either $\delta$7$\times$7 or 1$\times$1 pattern at this coverage. When more Mg atoms were exposed, a flat and broad {{{{ { 2} over {3 } }}}}{{{{ SQRT { 3} }}}}$\times${{{{ { 2} over {3 } }}}}{{{{ SQRT { 3} }}}}R30$^{\circ}$region evolves. A flat silicide is formed at first and multi-level Mg islands having hexagonal step edges develop with increasing coverage. The scanning tunneling spectroscopy (STS) confirms the electronic properties of these Mg films on the si(111) 7$\times$7 surface at various coverages.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.1
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• pp.115-122
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• 2014

In this paper, reliability is secured by sensing a post-program resistance of several tens of kilo ohms and restricting a read current flowing over an unblown eFuse within $100{\mu}A$ since RWL driver and BL pull-up load circuits using a regulated voltage of V2V ($=2V{\pm}10%$) are proposed to have a wide operating voltage range for eFuse OTP memory. Also, when a comparison of a cell array of 1 row ${\times}$ 32 columns with that of 4 rows ${\times}$ 8 columns is done, the layout size of 4 rows ${\times}$ 8 columns is smaller with $187.065{\mu}m{\times}94.525{\mu}m$ ($=0.01768mm^2$) than that of 1 row ${\times}$ 32 columns with $735.96{\mu}m{\times}61.605{\mu}m$ ($=0.04534mm^2$).

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.11
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• pp.7-13
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• 2002

BSCT 320${\times}$240 IRFPA detector module is implemented, which is a key component in uncooled thermal imaging systems. The detector module consists of two parts, infrared sensitive pixel array and read-out integrated circuit(ROIC). The BSCT 320${\times}$240 pixels are made by laser scribe process and 10-${\mu}m$ micro-bump to satisfy 50-${\mu}m$ pitch and 95-% fill-factor. The ROIC has been designed to electrically address the pixels sequentailly and to improve signal-to-noise ratio with single transistor amplifier, HPF, tunable LPF and clamp circuit. The fabricated hybrid chip of detector and ROIC has been mounted on the TEC built-in ceramic package for more stable operation and tested for lots of electrical and optical properties. The IRFA sample has shown successful properties and met with good results of fill-factor, detectivity and responsivity.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.7
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• pp.394-399
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• 2016

The silicon dioxide ($SiO_2$) was deposited using various gas as oxygen and nitrous oxide ($N_2O$) in nowadays. In order to improve electrical characteristics and the interface state density ($D_{it}$) in low temperature, It was deposited with carbon dioxide ($CO_2$) and silane ($SiH_4$) gas by inductively coupled plasma chemical vapor deposition (ICP-CVD). Each $D_{it}$ of $SiO_2$ using $CO_2$ and $N_2O$ gas was $1.30{\times}10^{10}cm^{-2}{\cdot}eV^{-1}$ and $3.31{\times}10^{10}cm^{-2}{\cdot}eV^{-1}$. It showed $SiO_2$ using $CO_2$ gas was about 2.55 times better than $N_2O$ gas. After 10 years when the thin film was applied to metal/insulator/semiconductor(MIS)-nonvolatile memory(NVM), MIS NVM using $SiO_2$($CO_2$) on tunneling layer had window memory of 2.16 V with 60% retention at bias voltage from +16 V to -19 V. However, MIS NVM applied $SiO_2$($N_2O$) to tunneling layer had 2.48 V with 61% retention at bias voltage from +20 V to -24 V. The results show $SiO_2$ using $CO_2$ decrease the $D_{it}$ and it improves the operating voltage.

• Journal of the East Asian Society of Dietary Life
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• v.16 no.6
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• pp.717-723
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• 2006

Chemical characteristics of soybean oil after deep-frying with potato sticks (200 g, 10% w/w of soybean oil) were studied according to the 34 deep-frying times. After consecutive 34 deep-frying, total polyunsaturated FA contents was gradually decreased while the total saturated FA and trans FA were increased. Acid value and peroxide value were increased while iodine value decreased, respectively. The Hunter $L^{\ast}$ value decreased while each $a^{\ast}\;and \;b^{\ast}b$ value were gradually increased. Electronic nose equipped with 12 metal oxide sensors was used for the discrimination of odor pattern of frying oils against the times of deep-trying. The proportions of 1st and 2nd principal component analysis showed 75.97% and 21.23%, respectively. While 6 among total 12 sensors well responded to discrimination of odor in the repented frying oils, suggesting that the odor pattern of each oil after deep-frying would be discriminated against fresh soybean oil, especially after 14 times. From the results, electronic nose could differentiate the degree of quality deterioration of the repeated deep-frying oils.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.10
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• pp.767-770
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• 2010

In this work, we investigated the static characteristics of 4H-SiC vertical metal-oxidesemiconductor field effect transistors (VMOSFETs) by adjusting the doping level of n-epilayer and the effect of a current spreading layer (CSL), which was inserted below the p-base region with highly doped n+ state ($5{\times}10^{17}cm^{-3}$). The structure of SiC VMOSFET was designed by using a 2-dimensional device simulator (ATLAS, Silvaco Inc.). By varying the n-epilayer doping concentration from $1{\times}10^{16}cm^{-3}$ to $1{\times}10^{17}cm^{-3}$, we investigated the static characteristics of SiC VMOSFETs such as blocking voltages and on-resistances. We found that CSL helps distribute the electron flow more uniformly, minimizing current crowding at the top of the drift region and reducing the drift layer resistance. For that reason, silicon carbide VMOSFET structures of highly intensified blocking voltages with good figures of merit can be achieved by adjusting CSL and doping level of n-epilayer.

• Journal of the Semiconductor & Display Technology
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• v.17 no.2
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• pp.20-25
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• 2018

In this paper, we have designed circularly polarized array antenna for 5.8GHz microwave wireless power transmission. To obtain high antenna gain, we studied a single patch antenna, a $2{\times}1$ array antenna, a $2{\times}2$ array antenna, a $2{\times}4$ array antenna, and a $4{\times}4$ array antenna. Commonly, characteristics of each antenna have a frequency of 5.8 GHz and Right Hand Circular Polarization(RHCP) of circular polarization. Also, the results were obtained with the design to each antenna that the return loss was less than -10dB and the axial ratio was less than 3dB. The gain of the antennas was 6.08dBi for a single patch antenna, 9.69dBi for a $2{\times}1$ array antenna, 12.99dBi for a $2{\times}2$ array antenna, 15.72dBi for a $2{\times}4$ array antenna and 18.39dBi for a $4{\times}4$ array antenna. When the elements of the array antenna were increased, it was confirmed that it increased by about 3dBi.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.10
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• pp.2369-2379
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• 2013

A CMOS x-ray line scan sensor which is used in both medical imaging and non-destructive diagnosis is designed. It has a pixel array of 512 columns ${\times}$ 4 rows and a built-in DC-DC converter. The pixel circuit is newly proposed to have three binning modes such as no binning, $2{\times}2$ binning, and $4{\times}4$ binning in order to select one of pixel sizes of $100{\mu}m$, $200{\mu}m$, and $400{\mu}m$. It is designed to output a fully differential image signal which is insensitive to power supply and input common mode noises. The layout size of the designed line scan sensor with a $0.18{\mu}m$ x-ray CMOS image sensor process is $51,304{\mu}m{\times}5,945{\mu}m$.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.2
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• pp.193-202
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• 2012

In this paper, we propose a new approach for compact range sensor system for real-time robot applications. Instead of using off-the-shelf camera and projector, we devise a compact system with a CMOS image-sensor and a DMD (Digital Micro-mirror Device) that yields smaller dimension ($168{\times}50{\times}60mm$) and lighter weight (500g). We also realize one chip hard-wired processing of projection of structured-light and computing the range by exploiting correspondences between CMOS images-ensor and DMD. This application-specific chip processing is implemented on an FPGA in real-time. Our range acquisition system performs 30 times faster than the same implementation in software. We also devise an efficient methodology to identify a proper light intensity to enhance the quality of range sensor and minimize the decoding error. Our experimental results show that the total-error is reduced by 16% compared to the average case.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.04a
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• pp.236-238
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• 1997

A cellular power amplifier using an APCVD(Atmospheric Pressure Chemical Vapor Deposition)-grown SiGe base HBT of ETRI has been designed with a linear simulation CAD. The Si/SiGe HBT with an emitter area of 2$\times$8${\mu}{\textrm}{m}$$^2$typically has a cutoff frequency(f$_{T}$) of 7.0 GHz and a maximum oscillation frequency(f$_{max}$) of 16.1 GHz with a pad de-embedding A packaged power Si/SiGe HBT with an emitter area of 2$\times$8$\times$80${\mu}{\textrm}{m}$$^2$typically shows a f$_{T}$ of 4.7 GHz and a f$_{max}$ of 7.1 GHz at a collector current (Ic) of 115 mA. The power amplifier exhibits a Forward transmission coefficient(S21) of 13.5 dB, an input and an output reflection coefficients of -42 dB and -45 dB respectively. Up to now the III-V compound semiconductor devices hale dominated microwave applications, however a rapid progress in Si-based technology make the advent of the Si/SiGe HBT which is promising in low to even higher microwave range because of lower cost and relatively higher reproducibility of a Si-based process.ess.ess.