• BMB Reports
• /
• 제28권4호
• /
• pp.359-362
• /
• 1995

The highly polymorphic variable number of tandem repeat (VNTR) loci in the human genome are informative markers for the genetic characterization of individuals in the paternity test and forensic science as well as for the study of human disease. In this study, VNTR loci D1S80 and D2S123 have been amplified by PCR and the amplified length polymorphic alleles were detected with a discontinuous vertical PAGE system and silver staining. For explicit DNA typing, PCR optimization, in which amplification efficiencies are similar over a wide range of allele sizes, non-specific amplifications are minimal, and new longer alleles have high amplification efficiency, has been performed by changing the PCR reaction buffer composition and thermal cycling conditions. It turned out that adding an appropriate amount of Tween 20 and NP40 to the PCR reaction buffer and raising the annealing temperature to $68^{\circ}C$ in thermal cycling made it possible for optimal VNTR loci amplification. A modified PAGE system for VNTR separation was established. Under these conditions, new longer alleles in the 01580 locus were discovered and 025123 pattern changes in colorectal tumors were observed. These technical tips are valuable for detecting various amplified fragment length polymorphisms.

• Journal of Welding and Joining
• /
• 제20권2호
• /
• pp.90-94
• /
• 2002

FC-BGA has advantages over other interconnection methods including high I/O counts, better electrical performance, high throughput, and low profile. But, FC-BGA has a lot of reliability issues. The 2nd level solder joint reliability of the FC-BGA with large chip on laminate substrate was studied in this paper. The purpose of this study is to discuss solder joint failures of 2nd level thermal cycling test. This work has been done to understand the influence of the structure of package, the properties of underfill, the properties and thickness of bismaleimide tiazine substrate and the temperature range of thermal cycling on 2nd level solder joint reliability. The increase of bismaleimide tiazine substrate thickness applied to low modulus underfill was improve of solder joint reliability. The resistance of solder ball fatigue was increased solder ball size in the solder joints of FC-BGA.

• 한국세라믹학회지
• /
• 제41권5호
• /
• pp.388-394
• /
• 2004

균일하게 혼합된 LiNO$_3$와 Co 금속분말을 알곤 분위기 하에서 SHS 공정으로 리튬이차전지용 양극활물질인 LiCoO$_2$분말을 합성하였다. 여러 가지 반응변수에 따라 제조된 분말의 특성과 전기화학적 특성평가를 수행하였는데, 반응온도 및 속도와 제조된 분말의 입도는 각각 Li/Co 몰비와 시료의 냉각속도 변화로 제어 가능하였다. Li/Co 몰비가 1.05일 때 최대방전용량인 145 mAh/g을 나타냈으며, 10회 충ㆍ방전 실험 후 6.4%의 낮은 용량감소를 갖는 비교적 안정된 cycling 특성을 보였다.

• 대한기계학회논문집A
• /
• 제33권2호
• /
• pp.179-184
• /
• 2009

The Fuel Test Loop(FTL) which is capable of an irradiation testing under a similar operating condition to those of PWR(Pressurized Water Reactor) and CANDU(CANadian Deuterium Uranium reactor) nuclear power plants has been developed and installed in HANARO, KAERI(Korea Atomic Energy Research Institute). It consists of In-Pile Section(IPS) and Out-of Pile System(OPS). The IPS, which is located inside the pool is divided into 3-parts; the in-pool pipes, the IVA(IPS Vessel Assembly) and the support structures. The test fuel is loaded inside a double wall, inner pressure vessel and outer pressure vessel, to keep the functionality of the reactor coolant pressure boundary. The IVA is manufactured by local company and the functional test and verification were done through pressure drop, vibration, hydraulic and leakage tests. The brazing technique for the instrument lines has been checked for its functionality and performance. An IVA has been manufactured by local technique and have finally tested under high temperature and high pressure. The IVA and piping did not experience leakage, as we have checked the piping, flanges, assembly parts. We have obtained good data during the three cycle test which includes a pressure test, pressure and temperature cycling, and constant temperature.

• 한국건설순환자원학회논문집
• /
• 제5권4호
• /
• pp.414-420
• /
• 2017

이 연구에서는 고온의 태양열 에너지를 저장하기 위한 고로슬래그 콘크리트의 열역학적 특성을 파악하였다. 고로슬래그 콘크리트의 열역학적 특성에 미치는 영향을 파악하기 위한 실험연구를 수행하였다. 실험변수로써 고로슬래그 함유량과 물-바인더 비를 고려하였다. 고로슬래그 콘크리트의 역학적 특성으로써 열사이클 전과 후의 압축강도 및 인장강도를 측정하고, 열적 특성으로써 열전도율과 비열을 측정하였다. 고로슬래그를 포함한 콘크리트의 열싸이클 적용 후의 잔류압축강도가 고로슬래그를 포함하지 않은 콘크리트의 잔류압축강도보다 크다. 또한, 고로슬래그를 혼입한 콘크리트의 열전도율이 고로슬래그를 포함하지 않은 콘크리트의 열전도율보다 더욱 크다. 이는 고로슬래그 콘크리트가 열에너지의 축열과 방열에 효과적인 것을 나타낸다. 실험연구 결과는 콘크리트 열저장 축열 모듈 설계에 효율적으로 활용될 수 있다.

• 마이크로전자및패키징학회지
• /
• 제13권2호
• /
• pp.21-26
• /
• 2006

NCA의 물성이 미세피치 Chip on glass (COG) 접합부의 신뢰성에 미치는 영향을 연구하였다. Si 위에 Sn을, 유리기판 위에 In을 열증발 방법으로 증착하고 lift-off 방법을 이용하여 $30{\mu}m$ 피치를 가지는 솔더범프를 형성하였으며 열압착 방법으로 $120^{\circ}C$에서 In 범프와 Sn 범프를 접합하였다. 접합할 때 세 종류의 Non conductive adhesive (NCA)를 적용하였다. 신뢰성은 $0^{\circ}C$와 $100^{\circ}C$ 사이로 열충격시험을 2000회까지 실시하여 평가하였다. 4단자 저항측정법을 이용하여 접합부의 저항을 측정하였다. 필러의 양이 증가할수록 열충격시험 후 접합부의 저항이 가장 적게 증가하여 신뢰성이 우수하였다. 필러의 양이 증가할수록 NCA의 열팽창이 작아지기 때문이다.

• 한국전기전자재료학회논문지
• /
• 제21권1호
• /
• pp.57-62
• /
• 2008

From the progressing results, it was found that thin film using 52 wt% Ni - 38 wt% Cr - 3 wt% Al - 4 wt% Mn - 3 wt% Si target has good characteristics for low TCR (temperature coefficients of resistance) and high resistivity. The optimum sputtering condition was DC 250 W, 5 mtorr, and 50 sccm and the proper annealing condition was $350^{\circ}C$/3.5 hr in air atmosphere. At these fabricated conditions, thin film resistors with TCR values of less than ${\pm}10ppm/^{\circ}C$ were obtained. The TCR of the packaged-samples made at proper fabrication conditions was $-3{\sim}15ppm/^{\circ}C$ after the thermal cycling and $-20{\sim}180ppm/^{\circ}C$ after PCT (pressure cooker test), we could confirm reliability for the thin film resistor and find the need for enduring research about packaging method.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
• /
• pp.565-568
• /
• 2001

We have fabricated $Bi_{3.25}La_{0.75}Ti_{3}O_{12}(BLT)$ thin(200nm) films on the $Pt/Ti/SiO_{2}/Si$ substrates using a MOD(Metalorganic decomposition) method with annealing temperature from $550^{\circ}C$ to $750^{\circ}C$. The structural properties of the films examined by x-ray diffraction. The layered-perovskite phase obtained above $600^{\circ}C$. Scanning electron micrographs showed uniform surface composed of rodlike grains. The grain size increased with increasing annealing temperature. The BLT thin films showed little polarization fatigue test up to $3.5{\times}10^{9}$ bipolar cycling at a 5V and 100kHz.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 추계학술대회 논문집
• /
• pp.565-568
• /
• 2001

We have fabricated $Bi_{3.25}$$La_{0.75}$ti$_3$O$_{12}$ (BLT) thin(200nm) films on the Pt/Ti/SiO$_2$/Si substrates using a MOD(Metalorganic decomposition) method with annealing temperature from 55$0^{\circ}C$ to 75$0^{\circ}C$. The structural properties of the films examined by x-ray diffraction. The layered-perovskite phase obtained above $600^{\circ}C$. Scanning electron micrographs showed uniform surface composed of rodlike grains. The grain size increased with increasing annealing temperature. The BLT thin films showed little polarization fatigue test up to 3.5x10$^{9}$ bipolar cycling at a 5V and 100kHz.kHz.

• 한국분말재료학회지
• /
• 제29권6호
• /
• pp.505-510
• /
• 2022

The thermal shock resistance of cement composites with hollow glass microspheres (HGM) is investigated. Cement composites containing various concentrations of HGM are prepared and their properties studied. The density, thermal conductivity, and coefficient of thermal expansion of the composites decrease with increasing HGM concentration. A thermal shock test is performed by cycling between -60 and 50℃. After the thermal shock test, the compressive strength of the cement composite without HGM decreases by 28.4%, whereas the compressive strength of the cement composite with 30 wt% HGM decreases by 5.7%. This confirms that the thermal shock resistance of cement is improved by the incorporation of HGM. This effect is attributed to the reduction of the thermal conductivity and coefficient of thermal expansion of the cement composite because of the incorporation of HGM, thereby reducing the occurrence of defects due to external temperature changes.