• Title/Summary/Keyword: T-gate

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Low-Gate-Count 32-Bit 2/3-Stage Pipelined Processor Design (소면적 32-bit 2/3단 파이프라인 프로세서 설계)

  • Lee, Kwang-Min;Park, Sungkyung
    • Journal of the Institute of Electronics and Information Engineers
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    • v.53 no.4
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    • pp.59-67
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    • 2016
  • With the enhancement of built-in communication capabilities in various meters and wearable devices, which implies Internet of things (IoT), the demand of small-area embedded processors has increased. In this paper, we introduce a small-area 32-bit pipelined processor, Juno, which is available in the field of IoT. Juno is an EISC (Extendable Instruction Set Computer) machine and has a 2/3-stage pipeline structure to reduce the data dependency of the pipeline. It has a simple pipeline controller which only controls the program counter (PC) and two pipeline registers. It offers $32{\times}32=64$ multiplication, 64/32=32 division, $32{\times}32+64=64$ MAC (multiply and accumulate) operations together with 32*32=64 Galois field multiplication operation for encryption processing in wireless communications. It provides selective inclusion of these algebraic logic blocks if necessary in order to reduce the area of the overall processor. In this case, the gate count of our integer core amounts to 12k~22k and has a performance of 0.57 DMIPS/MHz and 1.024 Coremark/MHz.

Memory window characteristics of vertical nanowire MOSFET with asymmetric source/drain for 1T-DRAM application (비대칭 소스/드레인 수직형 나노와이어 MOSFET의 1T-DRAM 응용을 위한 메모리 윈도우 특성)

  • Lee, Jae Hoon;Park, Jong Tae
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.20 no.4
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    • pp.793-798
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    • 2016
  • In this work, the memory window characteristics of vertical nanowire device with asymmetric source and drain was analyzed using bipolar junction transistor mode for 1T-DRAM application. A gate-all-around (GAA) MOSFET with higher doping concentration in the drain region than in the source region was used. The shape of GAA MOSFET was a tapered vertical structure that the source area is larger than the drain area. From hysteresis curves using bipolar junction mode, the memory windows were 1.08V in the forward mode and 0.16V in the reverse mode, respectively. We observed that the latch-up point was larger in the forward mode than in the reverse mode by 0.34V. To confirm the measurement results, the device simulation has been performed and the simulation results were consistent in the measurement ones. We knew that the device structure with higher doping concentration in the drain region was desirable for the 1T-DRAM using bipolar junction mode.

Flexible Crypto System for IoT and Cloud Service (IoT와 클라우드 서비스를 위한 유연한 암호화 시스템)

  • Kim, SeokWoo
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.9 no.1
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    • pp.15-23
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    • 2016
  • As various IoT devices appear recently, Cloud Services such as DropBox, Amazon S3, Microsoft Azure Storage, etc are widely use for data sharing across the devices. Although, cryptographic algorithms like AES is prevalently used for data security, there is no mechanisms to allow selectively and flexibly use wider spectrum of lightweight cryptographic algorithms such as LEA, SEED, ARIA. With this, IoT devices with lower computation power and limited battery life will suffer from overly expensive workload and cryptographic operations are slower than what is enough. In this paper, we designed and implemented a CloudGate that allows client programs of those cloud services to flexibly select a cryptographic algorithms depending on the required security level. By selectively using LEA lightweight algorithms, we could achieve the cryptographic operations could be maximum 1.8 faster and more efficient than using AES.

Filed Programmable Logic Control and Test Pattern Generation for IoT Multiple Object switch Control (사물인터넷 환경에서 다중 객체 스위치 제어를 위한 프로그래밍 가능한 로직제어 및 테스트 패턴 형성)

  • Kim, Eung-Ju;Jung, Ji-Hak
    • Journal of Internet of Things and Convergence
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    • v.6 no.1
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    • pp.97-102
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    • 2020
  • Multi-Channel Switch ICs for IoT have integrated several solid state structure low ON-resistance bi-directional relay MOS switches with level shifter to drive high voltage and they should be independently controlled by external serialized logic control. These devices are designed for using in applications requiring high-voltage switching control by low-voltage control signals, such as medical ultra-sound imaging, ink-jet printer control, bare board open/short and leakage test system using Kelvin 4-terminal measurement method. This paper describes implementation of analog switch control block and its verification using Field programmable Gate Array (FPGA) test pattern generation. Each block has been implemented using Verilog hardware description language then simulated by Modelsim and prototyped in a FPGA board. Compare to conventional IC, The proposed architecture can be applied to fields where multiple entities need to be controlled simultaneously in the IoT environment and the proposed pattern generation method can be applied to test similar types of ICs.

A Research About P-type Polycrystalline Silicon Thin Film Transistors of Low Temperature with Metal Gate Electrode and High Temperature with Gate Poly Silicon (실리콘 게이트전극을 갖는 고온소자와 금속 게이트전극을 갖는 P형 저온 다결정 실리콘 박막 트랜지스터의 전기특성 비교 연구)

  • Lee, Jin-Min
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.6
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    • pp.433-439
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    • 2011
  • Poly Si TFTs (poly silicon thin film transistors) with p channel those are annealed HT (high temperature) with gate poly crystalline silicon and LT (low temperature) with metal gate electrode were fabricated on quartz substrate using the analyzed data and compared according to the activated grade silicon thin films and the size of device channel. The electrical characteristics of HT poly-Si TFTs increased those are the on current, electron mobility and decrease threshold voltage by the quality of particles of active thin films annealed at high temperature. But the on/off current ratio reduced by increase of the off current depend on the hot carrier applied to high gate voltage. Even though the size of the particles annealed at low temperature are bigger than HT poly-Si TFTs due to defect in the activated grade poly crystal silicon and the grain boundary, the characteristics of LT poly-Si TFTs were investigated deterioration phenomena those are decrease the electric off current, electron mobility and increase threshold voltage. The results of transconductance show that slope depend on the quality of particles and the amplitude depend on the size of the active silicon particles.

Effect of Fluoride-based Plasma Treatment on the Performance of AlGaN/GaN MISHFET

  • Ahn, Ho-Kyun;Kim, Hae-Cheon;Kang, Dong-Min;Kim, Sung-Il;Lee, Jong-Min;Lee, Sang-Heung;Min, Byoung-Gue;Yoon, Hyoung-Sup;Kim, Dong-Young;Lim, Jong-Won;Kwon, Yong-Hwan;Nam, Eun-Soo;Park, Hyoung-Moo;Lee, Jung-Hee
    • ETRI Journal
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    • v.38 no.4
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    • pp.675-684
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    • 2016
  • This paper demonstrates the effect of fluoride-based plasma treatment on the performance of $Al_2O_3/AlGaN/GaN$ metal-insulator-semiconductor heterostructure field effect transistors (MISHFETs) with a T-shaped gate length of $0.20{\mu}m$. For the fabrication of the MISHFET, an $Al_2O_3$ layer as a gate dielectric was deposited using atomic layer deposition, which greatly decreases the gate leakage current, followed by the deposition of the silicon nitride layer. The silicon nitride layer on the gate foot region was then selectively removed through a reactive ion etching technique using $CF_4$ plasma. The etching process was continued for a longer period of time even after the complete removal of the silicon nitride layer to expose the $Al_2O_3$ gate dielectric layer to the plasma environment. The thickness of the $Al_2O_3$ gate dielectric layer was slowly reduced during the plasma exposure. Through this plasma treatment, the device exhibited a threshold voltage shift of 3.1 V in the positive direction, an increase of 50 mS/mm in trans conductance, a degraded off-state performance and a larger gate leakage current compared with that of the reference device without a plasma treatment.

Millimeter-wave Broadband Amplifier integrating Shunt Peaking Technology with Cascode Configuration (Cascode 구조에 Shunt Peaking 기술을 접목시킨 밀리미터파 광대역 Amplifier)

  • Kwon, Hyuk-Ja;An, Dan;Lee, Mun-Kyo;Lee, Sang-Jin;Moon, Sung-Woon;Baek, Tae-Jong;Park, Hyun-Chang;Rhee, Jin-Koo
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.43 no.10 s.352
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    • pp.90-97
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    • 2006
  • We report our research work on the millimeter-wave broadband amplifier integrating the shunt peaking technology with the cascode configuration. The millimeter-wave broadband cascode amplifier on MIMIC technology was designed and fabricated using $0.1{\mu}m\;{\Gamma}-gate$ GaAs PHEMT, CPW, and passive library. The fabricated PHEMT has shown a transconductance of 346.3 mS/mm, a current gain cut off frequency ($f_T$) of 113 GHz, and a maximum oscillation frequency ($f_{max}$) of 180 GHz. To prevent oscillation of designed cascode amplifier, a parallel resistor and capacitor were connected to drain of common-gate device. For expansion of the bandwidth and flatness of the gain, we inserted the short stub into bias circuits and the compensation transmission line between common-source device and common-gate device, and then their lengths were optimized. Also, the input and output stages were designed using the matching method to obtain the broadband characteristic. From the measurement, we could confirm to extend bandwidth and flat gain by integrating the shunt peaking technology with the cascode configuration. The cascode amplifier shows the broadband characteristic from 19 GHz to 53.5 GHz. Also, the average gain of this amplifier is about 6.5 dB over the bandwidth.

Nano-Floating Gate Memory Devices with Metal-Oxide Nanoparticles in Polyimide Dielectrics

  • Kim, Eun-Kyu;Lee, Dong-Uk;Kim, Seon-Pil;Lee, Tae-Hee;Koo, Hyun-Mo;Shin, Jin-Wook;Cho, Won-Ju;Kim, Young-Ho
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.8 no.1
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    • pp.21-26
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    • 2008
  • We fabricated nano-particles of ZnO, $In_2O_3$ and $SnO_2$ by using the chemical reaction between metal thin films and polyamic acid. The average size and density of these ZnO, $In_2O_3$ and $SnO_2$ nano-particles was approximately 10, 7, and 15 nm, and $2{\times}10^{11},\;6{\times}10^{11},\;2.4{\times}10^{11}cm^{-2}$, respectively. Then, we fabricated nano-floating gate memory (NFGM) devices with ZnO and $In_2O_3$ nano-particles embedded in the devices' polyimide dielectrics and silicon dioxide layers as control and tunnel oxides, respectively. We measured the current-voltage characteristics, endurance properties and retention times of the memory devices using a semiconductor parameter analyzer. In the $In_2O_3$ NFGM, the threshold voltage shift (${\Delta}V_T$) was approximately 5 V at the initial state of programming and erasing operations. However, the memory window rapidly decreased after 1000 s from 5 to 1.5 V. The ${\Delta}V_T$ of the NFGM containing ZnO was approximately 2 V at the initial state, but the memory window decreased after 1000 s from 2 to 0.4 V. These results mean that metal-oxide nano-particles have feasibility to apply NFGM devices.