• Journal of IKEEE
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• v.22 no.2
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• pp.339-343
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• 2018

Power semiconductors are semiconductors capable of controlling power over 1W and are mainly used as switches. This power semiconductor device has been developed with the goal of reducing power consumption and high breakdown voltage. This research was analyzed electrical characteristics of IGBT(Insulated Gate Biopolar Transistor) according to diffusion length of JFET region. The Diffusion length of JFET region was controlled by temperature and time using T-CAD simulator. As a result of experiments, we could obtain 1.14V low on state voltage drop by fixing 1440V breakdown voltage.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.753-759
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• 2001

The purpose of this study is to suggest the machining technique of the constant control of cutting speed in order to improve precision machining and tool life in high speed machining using ball end mill. Cutting speed is changed in machining free form surface like free form surface. So, we don't have supreme surface form and toll life on machining. The way to solving this problem is that we should be settled to optimal cutting speed in free form surface machining. And, to improve precision machining is executed high speed machining method to output optimum NC data with developed constant control of cutting speed program after modeling of CAD/CAM. In this paper, a comparison was made of the cutting precision and tool life in conventional cutting and those in free form surface machining applying the program developed.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.399-404
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• 2001

In CNC machining, a 3D(3-dimension) linear segment and a 2D(2-dimension) circular arc are general forms given by CAD/CAM system. Generally, the 2D circular arc machining is processed using dividing into some linear segments. A 3D circular arc also don't exist in the standard form of NC data. This paper present a algorithm and method for real-time machining of a circular arc(not only the 2D one, but also the 3D one). The 3D circular arc machining is based on the 2D circular arc machining. It only needs making a new coordinate system, converting given 3D points(a start point, a end point, and a center point of a 3D circular arc) into points of the new coordinate system, and processing a inverse transformation about a interpolated point. The proposed algorithm was implemented and simulated on PC system. It was confirmed to give a gcod result.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.50-53
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• 2003

Most companies use technologies such as stereolithography, selective laser sintering, and fused deposition modeling to make parts for such small consumer products as telephones, heads, and shoes. The largest part that the existing RP systems can make is only 600 mm in length. Because most RP systems build parts by depositing, solidifying, or sintering material point-by-point, making larger objects takes a long time. and in many cases, large objects won't fit the build size. A new effective thick-layered RP process. Transfer type Variable Lamination Manufacturing using expandable polystyrene foam (VLM-ST) has been developed with thick layers and sloped surfaces. In this paper, a scaledown model of F16 Fighter with the length of 800 mm is rapidly fabricated using the VLM-ST process. In order to build a CAD model of F16 larger than 600 mm in length, the approach in VLM-ST is to build larger parts in multiple sub-parts and then glue them together. The fabricated result shows that the VLM-ST process employing thick layers and sloped surfaces is adequate for creating the real-sized large objects in the diverse fields such as automobiles, electric home appliances, electronics. and etc.

• Journal of the Korean Society of Clothing and Textiles
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• v.27 no.7
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• pp.851-861
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• 2003

The objectives of this study were to investigate the effect of perceiver's fashion involvement, clothing color, and background of object person on image perceptions of clothing, and to examine how clothing color preference vary according to perceiver's fashion involvement. Subjects were 273 college women in the metropolitan area of Seoul. The T-shirt was changed into 11 colors by using the CAD system. Five factors were derived to account for the dimensions of image perception. These were individuality, elegance, femininity, activity, and neatness. Perceiver's fashion involvement gave a significant influence on perception of individuality. Clothing color gave significant influences on 5 image dimensions. White and beige were evaluated neat image. Neatness factor had an interaction effect by fashion involvement and clothing color. The high involvement group evaluated white and beige shirt more neatly, and orange and yellow less neatly than the low involvement group. Individuality and elegance had an interaction effect by fashion involvement and background of object person. The high involvement group liked red, violet, and black shirt more than the low involvement. Refined and becomingness image gave significant influences on clothing color preference in both high and low involvement groups.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.3
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• pp.131-136
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• 2002

A design system of dies for hot extrusion of structural shapes such as Z's, L's, T's, U's and H's from aluminium alloys was developed in this study. The developed design system of dies is based of estimated die design rule system. The design rules for die design are obtained from the handbooks, plasticity theories and relevant references. The environment of the system is AutoCAD and AutoLISP, the graphic programming language was used for the configuration of the system. This system includes five major modules such as section shape design module, die opening number module, die opening layout module, die correction module and die bearing design module that are used to determine design variables. This system would be used to design of dies for hot extrusion from aluminum alloys and widely used in manufacturing course.

• Speech Sciences
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• v.15 no.2
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• pp.33-51
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• 2008

Difference of learner speech and loanword phonology is investigated in terms of Korean learners' speech and their loanword adaptation of English words with a post-vocalic word-final stop. When we compared the speech of 12 Korean learners in mid-intermediate level with that of eight English speakers, the learner speech did not reflect loanword phonology of the vowel insertion after a voiced word-final stop (e.g., rib$[\dotplus]$, bad$[\dotplus]$, gag$[\dotplus]$ vs. tip[=], cat[=], book[=]), but, instead, the target phonology of vowel lengthening before a voiced word-final stop (e.g., rib[r.I:b], CAD$[k{\ae}:d]$, bag$[b{\ae}:g]$ vs. rip[rI.p], cat$[k{\ae}t]$, back$[b{\ae}k])$. A longitudinal study of learner speech before and after instruction showed some development toward the acquisition of target phonology. The results indicate that learner speech departs from loanword phonology, and approaches to target speech in a faster rate than direct ratio. Thus, native phonology predicts loanword phonology, but lends little support to learner speech. Our results also indicate that loanword phonology is constant, while learner speech changes toward the acquisition of target phonology.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.8
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• pp.486-489
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• 2015

Power semiconductor device has a very long history among semiconductor, since the invention of low-pressure bipolar transistor 1947, and so far from small capacity to withstand voltage-current, high-speed and high-frequency characteristics have been developed with high function. In this study, the PWM IC Switch to the main parts used in IGBT (insulated gate bipolar transistor) for the low power loss and high drive capability of the simulator to Synopsys' T-CAD used by the 1,700 V NPT Planar IGBT, 1,700 V FS was a study of the Planar IGBT, the results confirmed that IGBT 1,700 V FS Planar is making about 11 percent less than the first designed NPT Planar IGBT.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.2
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• pp.109-113
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• 2020

A power device is a component used as a switch or rectifier in power electronics to control high voltages. Consequently, power devices are used to improve the efficiency of electric-vehicle (EV) chargers, new energy generators, welders, and switched-mode power supplies (SMPS). Power device designs, which require high voltage, high efficiency, and high reliability, are typically based on MOSFET (metal-oxide-semiconductor field-effect transistor) and IGBT (insulated-gate bipolar transistor) structures. As a unipolar device, a MOSFET has the advantage of relatively fast switching and low tail current at turn-off compared to IGBT-based devices, which are built on bipolar structures. A superjunction structure adds a p-base region to allow a higher yield voltage due to lower R_DS (on) and field dispersion than previous p-base components, significantly reducing the total gate charge. To verify the basic characteristics of the superjunction, we worked with a planar type MOSFET and Synopsys' process simulation T-CAD tool. A basic structure of the superjunction MOSFET was produced and its changing electrical characteristics, tested under a number of environmental variables, were analyzed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.19-20
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• 2006

As the Mobile and Display technology are being developed quickly, new wireless devices are released in great numbers. They reduce existing devices' life time and demand a reduction of developing period of portable devices. With these demands, existing film cutting mold used many films of portable devices, especially LCD Display, needs to be more precise, and cheaper. In this research, we have analyzed machining characteristics of cutter shapes, materials, and cutting conditions for application to other films. Cutter edge was machined by slot cutting method and CAD program to select the cutter shape and cutter angle. Also, we have determined the optimal cutting conditions using high speed machining experiments to improve the productivity.