• 한국정보통신학회논문지
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• 제10권2호
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• pp.338-343
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• 2006

본 논문은 저비용 고성능으로 패킷암호 처리를 할 수 있는 VPN 시스템의 구조와 그 설계에 대해서 소개한다. 제안하는 시스템 구조는 보안장비용 다기능 네트워크 프로세서와 전용 암호패킷 처리 칩의 2개의 컴페니언 칩들로 구성되어 있으며, 즉각적인 활용을 위해 필요한 운영체제의 구축 및 디바이스 드라이버, 컴파일러와 이를 기반으로 한 IPSec VPN의 핵심 엔진에 대해 구축한 방안이 언급된다. 특히, 계산력을 많이 필요로 하는 블록 암호 알고리즘인 3DES, AES, SEED는 별도의 칩으로 구현되어 범용성이 뛰어난 것이 특징이며, 이 칩의 성능 평가 결과를 소개한다.

• 한국멀티미디어학회논문지
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• 제18권2호
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• pp.244-252
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• 2015

This paper describes the design and implementation of a System-on-a-Chip (SoC) for face recognition to use in wearable/mobile products. The design flow starts from the system specification to implementation process on silicon. The entire process is carried out using a FPGA-based prototyping platform environment for design and verification of the target SoC. To ensure that the implemented face recognition SoC satisfies the required performances metrics, time analysis and recognition tests were performed. The motivation behind the work is a single chip implementation of face recognition system for target applications.

• 전자공학회논문지A
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• 제31A권10호
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• pp.161-172
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• 1994

This paper describes the design of a neurochip with on-chip learning capability in hardware with multiple processing elements. A digital architecture is adopted because its flexiblity and accuracy is advantageous for simulating the various application systems. The proposed chip consists of several processing elements to fit the large computation of neural networks, and has on-chip learning capability based on error back-propagation algorithm. It also minimizes the number of blobal control signals for processing elements. The modularity of the system makes it possible to buil various kinds of boards to match the expected range of applications.

• 전기전자학회논문지
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• 제23권4호
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• pp.1203-1207
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• 2019

As the number of IP cores has been increasing in a System-on-Chip (SoC), multiple routers are included in on-chip-networks. Each router has its own arbitration policy and it is difficult to obtain a desired arbitration result by combining multiple routers. Allocating desired bandwidths to the ports across the routers is more difficult. In this paper, a guaranteed bandwidth allocation scheme using an IP-level QoS control is proposed to overcome the limitations of existing local arbitration policies. Each IP can control the priority of a packet depending on the data communication requirement within the allocated bandwidth. The experimental results show that the proposed mechanism guarantees for IPs to utilize the allocated bandwidth in multiple router on-chip-networks. The maximum error rate of bandwidth allocation of the proposed scheme is only 1.9%.

• Biotechnology and Bioprocess Engineering:BBE
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• 제11권2호
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• pp.146-153
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• 2006

A passive microfluidic delivery system using hydrophobic valving and pneumatic control was devised for microfluidic handling on a chip. The microfluidic metering, cutting, transport, and merging of two liquids on the chip were correctly performed. The error range of the accuracy of microfluid metering was below 4% on a 20 nL scale, which showed that microfluid was easily manipulated with the desired volume on a chip. For a study of the feasibility of biochemical reactions on the chip, a single enzymatic reaction, such as ${\beta}-galactosidase$ reaction, was performed. The detection limit of the substrate, i.e. fluorescein $di-{\beta}-galactopyranoside$ (FDG) of the ${\beta}-galactosidase$ (6.7 fM), was about 76 pM. Additionally, multiple biochemical reactions such as in vitro protein synthesis of enhanced green fluorescence protein (EGFP) were successfully demonstrated at the nanoliter scale, which suggests that our microfluidic chip can be applied not only to miniaturization of various biochemical reactions, but also to development of the microfluidic biochemical reaction system requiring a precise nano-scale control.

• 한국정밀공학회지
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• 제23권5호
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• pp.155-161
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• 2006

This paper introduces a new type of mechanical tape feeder for chip mounter. The mechanical feeder is composed of a pneumatic linear actuator and a linear feeding module with the application of a cam-slider. As semiconductor chips are getting smaller, PCB assembly makers require the feeder to position the chip with high accuracy. The linear feeding system improves the positioning accuracy of the chip by getting rid of the index error, which brings into existence on the sprocket rotating feeder. It also can make greatly reduce the dumping rate. The dumping error is caused by the impact occurred as the pawl to interrupt ratchet wheel rotation. The paper discusses its mechanism and mechanical performance. The positioning accuracy and the dynamic characteristic were measured for long time operation and analyzed. As a result, the feeder showed very good performance. However, the feeding system was dynamically unstable due to the cover film eliminator that is required to be modified

• 한국통신학회논문지
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• 제34권8C호
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• pp.806-813
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• 2009

본 논문은 고속 무선 통신을 위한 모뎀 설계에 관한 것이다. 고속 통신을 위한 기술에는 여러 가지가 있는데, 그 중 넓은 주파수를 사용하고 여타 서비스에 주파수 간섭을 일으키지 않는 기술인 MB-OFDM (Multi-Band Orthogonal Frequency Division Multiplexing) 방식의 UWB (Ultra-Wideband) 모뎀의 SoC (System-on-Chip) 칩을 설계하였다. 개발된 모뎀 SoC 칩의 기저대역 시스템은 WiMedia에서 정의한 표준안을 따라서 설계되었다. 설계된 SoC 칩은 코어 부분인 FFT/lFFT (Fast Fourier Transform/lnverse Fast Fourier Transform), 송신부, 심볼동기 및 주파수 오프셋 추정부, 비터비 디코더, 그리고 기타 수신부등으로 구성되어 있다. 반도체 공정은 90nm CMOS (Complementary Metal-Oxide-Semiconductor) 공정을 사용하였고, 칩 사이즈는 약 5mm x 5mm 이다. 2009년 7월 20일에 fab-out되었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• ETRI Journal
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• 제38권6호
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• pp.1240-1249
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• 2016

With the number of IP cores in a multicore system-on-chip increasing to up to tens or hundreds, the role of on-chip interconnection networks is vital. We propose a networks-on-chip-style bus network as a compromise and redefine the exploration problem to find the best IP tiling patterns and communication path combinations. Before solving the problem, we estimate the time complexity and validate the infeasibility of the solution. To reduce the time complexity, we propose two fast exploration algorithms and develop a program to implement these algorithms. The program is executed for several experiments, and the exploration time is reduced to approximately 1/22 and 7/1,200 at the first and second steps of the exploration process, respectively. However, as a trade-off for the time saving, the time cost (TC) of the searched architecture is increased to up to 4.7% and 11.2%, respectively, at each step compared with that of the architecture obtained through full-case exploration. The reduction ratio can be decreased to 1/4,000 by simultaneously applying both the algorithms even though the resulting TC is increased to up to 13.1% when compared with that obtained through full-case exploration.

• 대한전자공학회논문지SD
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• 제42권2호
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• pp.65-72
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• 2005

공정기술과 EDA 툴의 발전에 따라서 하나의 실리콘 다이(Die)에 많은 IP가 집적되고 멀티프로세서가 포함되는 SoC 구조가 가능해지고 있다 그러나 대부분의 기존 SoC 버스는 공유버스 구조라는 문제점으로 인해 통신의 병목현상이 발생하고 이는 전체 시스템 성능을 저하시키는 요인이 된다. 많은 경우에 멀티프로세서 시스템의 성능은 CPU 자체의 속도보다는 효율적인 통신과 균형있는 연산의 분배가 좌우하게 된다 따라서 충분한 SoC 버스 대역폭(Bandwidth)을 확보하기 위한 하나의 해결책으로 크로스바 라우터(Crossbar Router)를 이용하여 효율적인 온 칩 버스구조인 SoC Network Architecture(SNA)를 제안한다. 제안된 SNA구조는 다중 마스터(multi-master)에 대해 다중 채널(multi-channel)을 제공하여 통신의 병목현상을 크게 줄일 수 있으며 뛰어난 확장성을 지원한다. 제안된 구조에 따라 모델 시스템을 설계하고 시뮬레이션을 진행한 결과 AMBA AHB 버스에 비해 평균 $40\%$ 이상 효율이 증가했다.