• Journal of the Ergonomics Society of Korea
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• v.22 no.3
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• pp.1-11
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• 2003

The objective of this research is the development of the Automatic Subjective Assessment System (ASAS). The proposed subjective assessment system is designed to evaluate human emotion and sensibility (or "gamsung" in Korean terminology) with subjective responses of volunteers about the experiment of emotion and sensibility. Once volunteers enter their subjective responses about the experiment into the developed system, the proposed system can automatically generate statistical results of human emotion and sensibility using Statistical Package for the Social Sciences (SPSS). Then, the system stores the statistical results in the database which will be open to public through internet. The proposed system will be integrated into the universal" gamsung" assessment system for evaluation of human emotion and sensibility.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.4
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• pp.79-88
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• 1998

This study deals with the development of CAM system which can machine and measure any shape of mold and die by machining center and coordinate measureing machine . The overall goal of the CAM system is to achieve the mold and die machining , from digitizing through to final cutting. The hardware of the system comprises PC and machining center. CMM. There are three steps in the mold and die machining. (1) measuring of physical model by the CMM, (2) geometric modeling by the CAD system, (3) generation of NC code by the tool path compensated for tool radius. It is developed a software package, with which can conduct a micro CAM system in the PC without economical burden.

• Journal of the Korea Safety Management & Science
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• v.3 no.2
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• pp.167-179
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• 2001

In this study, an overall survey of ERP system and methodology are first introduced, then an efficient way of const겨cting ERP system is suggested through a case study on S company S company has not reached the goal of ERP system as it planned and is still working on the project. The main idea for the efficient construction methodology of ERP system is that BPR (Business Process Reengineering) should be accomplished and the company should have enough time to test the ERP package and a proper ERP team organization before the ERP system is introduced. It is suggested that introduction of ERP system bring about benefits to companies in terms of effective management system.

• Journal of the Korean Home Economics Association
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• v.41 no.5
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• pp.109-118
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• 2003

The purpose of this study was to analyze the utilization of Database Information System of Fashion Brands in Daegu area. The interviews, reviews of previous studies and the empirical investigations were processed for this study. The questionnaire was administered to 27 fashion brands in Daegu, Korea, from September to October in 2002. Data were analyzed by using frequency, mean and percentage utilizing SPSS statistical package. There were no brand differentiation in brand characteristics, items, target age and company size in Daegu Fashion brands. Awareness of Information Network and Usages of Internet marketing were in relatively low level. The rate of the brands possessing Web-site, POS system and Customer ID card were less than one third. More than a half of the brands had Customer Database system.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.14 no.3
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• pp.60-66
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• 2005

Design of drawing dies was used In real industrial environments. It was designed by CAD software in many small & medium companies, but many products require various types, and sizes. There(ore many companies are required to reduce process time and design mistakes. In this paper, it was developed the automatic program in order to learn and use easily for design of the drawing dies. It was composed with Visual LISP/DCL language in a commercial CAD package, AutoCAD, and CUI in design system. The system is based in the knowledge base system which is involved a lot of expert's know-how. We have built database of design type and detail sizes. The automatic design system requires basic product type and sizes, and then the system accesses to the database and finds out sizes by comparing with input parameters, after then finally generates drawing dies file.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.57-65
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• 2015

Electronic packages consist of various materials, and as temperature changes, warpage occurs because of the difference in coefficient of thermal expansion. Shadow $moir{\acute{e}}$ is non-contact, whole field measurement technique for out-of-plane displacement. However, the technique has low sensitivity above $50{\mu}m/fringe$, it is not adequate for the warpage measurement in some circumstance. In this paper, by applying phase shifting process to the traditional shadow $moir{\acute{e}}$, measurement system having enhanced sensitivity of $12.5{\mu}m/fringe$ is constructed. Considering Talbot effect, the measurement is carried out in the half Talbot area. Shadow fringe pattern having four times enhanced sensitivity is obtained by the image process with four shadow fringes. The measurement technique is applied to the fibered package substrate and coreless package substrate for measuring warpages at room temperature and at about $100^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.43-48
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• 2016

3-Dimensional System in Package (3-D SiP) structure (Amkor calls it mPossum-molded Possum) using double side Surface Mount Technology (SMT) and double side molding was evaluated in order to achieve small/thin form factor as well as good functionality by integration and double side layout. As the new platform on laminate substrate basis, molding process was challenge in mold flow balance at top and bottom side and package warpage control over the overall assembly process. There were two types of different molding process evaluated with 1) 1-step molding which was done at both side at the same time and 2) 2-step molding which was done at the conventional molding process twice. Mold simulation helped to narrow down the material selections and parameters available before actual sample build. There were many challenges for this first trial in design/ parameter and material types but optimized them to enable this structure.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.6
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• pp.443-453
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• 2017

In flip chip technology, the conventional solder bump has been replaced with a copper (Cu) pillar bump owing to its higher input/output (I/O) density, finer pitch, and higher reliability. However, Cu pillar bump technology faces several issues, such as interconnect shorting and higher low-k stress due to stiffer Cu pillar structure when the conventional reflow process is used. Therefore, the thermal compression bonding (TCB) process has been adopted in the flip chip attachment process in order to reduce the package warpage and stress. In this study, we investigated the package warpage induced during the TCB process using a numerical analysis. The warpage of the TCB process was compared with that of the reflow process.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.467-470
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• 2005

There are about 10 motors for tile actuator of the automation system in an auto-mobile recently. The performance of the motor-case is much related to the noise and the vibration of an auto-mobile Multi-Forming process is so much the better than existing deep-drawing or Multi-step forming by press by less cost, installation and staff. But there isn't the specific and general process design, so we aren't good at competition. So in the first step, I want to study about the core design for the multi-forming process. We can access by the elasto-plastic theory and the finite element method, and we use a commercial package of the Deform-2D and, Deform-3D which is based on three-dimensional elasto-plastic finite element, evaluated propriety oi the package. The evaluation of the package propriety was simulated by simple bending example. It was found the elasto-plastic theory was mostly in agreement with the simulation. We proposed that three type of section for the core and analyzed by finite element method (Deform-2D). We can get the best result with the ellipse type core. Then we apply the result of the preceding analysis to the finite element method (Deform-3D). In 3D-finite element analysis, we can get the result of 8/100mm-roundness. This result can help the improvement of the multi-forming process.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.27 no.6
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• pp.68-74
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• 2013

Induction-heated system is innovative system which applied IH(Induction Heating) magnetic induction heating generated from induction-heated metallic package and high-frequency power circuit technique for thermal converse technique. In this occurs not burning, so that the working environment and deterioration of products can be improved. This technique is used high frequency inverter. By using high frequency inverter high frequency in the range of kHz can be made with conventional alternative current. In this contribution IGBT module is used for high frequency inverter. In this paper are discussed analysis of characteristics according to the each frequency and produced Flat plate induction heating system using 1.5kW-class half-bridge resonant inverter. In addition, operating characteristics of the system to changes in the distance between the coil and the heater, applications of system are also discussed.