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http://dx.doi.org/10.6117/kmeps.2015.22.3.057

Sensitivity Enhancement of Shadow Moiré Technique for Warpage Measurement of Electronic Packages  

Lee, Dong-Sun (Department of Mechanical Engineering, Chungbuk National University)
Joo, Jin-Won (Department of Mechanical Engineering, Chungbuk National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.22, no.3, 2015 , pp. 57-65 More about this Journal
Abstract
Electronic packages consist of various materials, and as temperature changes, warpage occurs because of the difference in coefficient of thermal expansion. Shadow $moir{\acute{e}}$ is non-contact, whole field measurement technique for out-of-plane displacement. However, the technique has low sensitivity above $50{\mu}m/fringe$, it is not adequate for the warpage measurement in some circumstance. In this paper, by applying phase shifting process to the traditional shadow $moir{\acute{e}}$, measurement system having enhanced sensitivity of $12.5{\mu}m/fringe$ is constructed. Considering Talbot effect, the measurement is carried out in the half Talbot area. Shadow fringe pattern having four times enhanced sensitivity is obtained by the image process with four shadow fringes. The measurement technique is applied to the fibered package substrate and coreless package substrate for measuring warpages at room temperature and at about $100^{\circ}C$.
Keywords
Shadow $Moir{\acute{e}}$; Phase Shift; Talbot effect; Coreless package substrate; Warpage;
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Times Cited By KSCI : 1  (Citation Analysis)
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