1 |
D. Post, B. Han and P. Ifju, High Sensitivity moire: Experimental Analysis for Mechanics and Materials, Springer-Verlag, New York, pp. 119-130 (1994).
|
2 |
J. W. Joo, S. Cho and B. Han, "Characterization of Flexural and Thermo- mechanical Behavior of Plastic Ball Grid Array Package Assembly Using Moire Interferometry", Micrelectronics Reliability, 45(4), 637 (2005).
DOI
|
3 |
S. J. Ham and S. B. Lee, "Measurement of Creep and Relaxation Behaviors of Wafer-level CSP Assembly Using Moire Interferometry", J. Electronic Packaging, Trans. of the ASME, 125(June), 282 (2003).
DOI
|
4 |
B. H. Lee and J. W Joo, "Assessment of Viscoplastic Deformation Behavior of Eutectic Solder and Lead-free Solder", J. Microelectron. Packag. Soc., 18(2), 17 (2011).
|
5 |
B. H. Lee, M. K. Kim and J. W. Joo, "Thermo-mechanical Mehavior of WB-PBGA Packages with Pb-Sn Solder and Lead-free solder Using Moire Interferometry", J. Microelectron. Packag. Soc., 17(3), 17 (2010).
|
6 |
Y. J. Kang, W. J. Ryu and Y. K. Kwon, "A Study on the Improvement of Accurasy of Surface Measurement in the Phase-Shifting Shadow Moire Method", J. of KSPE, 15(10), 96 (1998).
|
7 |
S. M. Lee and Y. Y. Earmme, "A Study on the Measurement of PWB Warpage Using Shadow Moire," Proc. KSME 2002 Meeting for Material & Fracture, pp. 146-151 (2002).
|
8 |
H. G. Yang and J. W. Joo, "Enhancement of sensitivity for the measurement of warpage using shadow moire technique", Proc. KSME 2012 Fall Annual Meeting, Changwon (2012).
|
9 |
H. Talbot, "On Facts Relating to Optical Science", Phil. Mag., 9, 401 (1836).
|
10 |
K. Creath, Phase-measurement Interferometry Techniques, Elsevier Sscience Publishers, pp. 357-364 (1991).
|
11 |
L. Valdevit , V. Khanna, A. Sharma, S. Sri-Jayantha, D. Questad and K. Sikka, "Organic substrates for flip-chip design: A thermo-mechanical model that accounts for heterogeneity and anisotropy", Microelectronics Reliability, 48(2), 245 (2008).
DOI
|