• Corrosion Science and Technology
• /
• 제20권4호
• /
• pp.196-203
• /
• 2021

To improve corrosion resistance and reduce the hydrogen uptake of 22MnB5, up to 5% Mg was added to the AlSi coating of 22MnB5. After hot-stamping and electrocoating were done on the metallic-coated specimen, the surface characteristics of the steel, hydrogen uptake content, and corrosion resistance were examined by transmittance electron microscopy, thermal desorption spectrometry, cyclic corrosion testing, and electrochemical impedance spectroscopy. Mg was investigated as MgO on the surface layer after hot-stamping while it existed as Mg₂Si before hot-stamping. The total hydrogen content of 22MnB5 was decreased along with the Mg content. However, there was no difference at 0.2 wt% or more. When a small amount of Mg was added, the coating corrosion resistance was decreased, but when it was added at around 1.0 wt%, the greatest corrosion resistance increase was seen. However, when 3 wt% or more was added excessively, the corrosion resistance was decreased. MgO on the surface was considered to suppress H uptake by the AlSi melting solution and increase the barrier effect of the coating.

• 대한금속재료학회지
• /
• 제46권2호
• /
• pp.69-79
• /
• 2008

A composition consisting of 10 nm-Ni/1 nm-Pd/(30 nm or 70 nm-poly)Si was thermally annealed using rapid thermal for 40 seconds at $300{\sim}1100^{\circ}C$ to improve the thermal stability of conventional nickel monosilicide. The annealed bilayer structure developed into $Ni(Pd)Si_x$, and the resulting changes in sheet resistance, microstructure, phase, chemical composition, and surface roughness were investigated. The silicide, which formed on single crystal silicon, could defer the transformation of $NiSi_2$, and was stable at temperatures up to $1100^{\circ}C$. It remained unchanged on polysilicon substrate compared with the sheet resistance of conventional nickel silicide. The silicides annealed at $700^{\circ}C$, formed on single crystal silicon and 30 nm polysilicon substrates exhibited 30 nm-thick uniform silicide layers. However, silicide annealed at $1,000^{\circ}C$ showed preferred and agglomerated phase. The high resistance was due to the agglomerated and mixed microstructures. Through X-ray diffraction analysis, the silicide formed on single crystal silicon and 30 nm polysilicon substrate, showed NiSi phase on the entire temperature range and mixed phases of NiSi and $NiSi_2$ on 70 nm polysilicon substrate. Through scanning probe microscope (SPM) analysis, we confirmed that the surface roughness increased abruptly until 36 nm on 30 nm polysilicon substrate while not changed on single crystal and 70 nm polysilicon substrates. The Pd-inserted nickel monosilicide could maintain low resistance in a wide temperature range and is considered suitable for nano-thick silicide processing.

• 한국자동차공학회논문집
• /
• 제21권3호
• /
• pp.165-173
• /
• 2013

Core loss has a major effect on heat generation in synchronous motors with surface-mounted permanent magnets (SPMs). It is essential to perform heat transfer analysis considering core loss in SPM because core loss is seriously affected by torque and speed of motors. In the present study, mechanical loss, core loss and coil loss are evaluated by measuring input and output energies under various driving conditions. For a better understanding heat transfer paths in synchronous motors, we developed a lumped thermal system analysis model. Subsequently, heat transfer analysis has been performed based on acquired energy loss, temperature data and thermal resistance with three types of SPM. It is shown that the torque constants decrease by Max. 10% as speed increase. At the rated torque, the core loss is Max. 10.9 times greater than the coil loss and the hysteresis loss of magnets is dominant in total loss.

• 한국재료학회지
• /
• 제18권1호
• /
• pp.5-11
• /
• 2008

Thermally evaporated 10 nm-Ni/1 nm-Au/(30 nm-poly)Si structures were fabricated in order to investigate the thermal stability of Au-inserted nickel silicide. The silicide samples underwent rapid thermal annealing at $300{\sim}1100^{\circ}C$ for 40 seconds. The sheet resistance was measured using a four-point probe. A scanning electron microscope and a transmission electron microscope were used to determine the cross-sectional structure and surface image. High-resolution X-ray diffraction and a scanning probe microscope were employed for the phase and surface roughness. According to sheet resistance and XRD analyses, nickel silicide with Au had no effect on widening the NiSi stabilization temperature region. Au-inserted nickel silicide on a single crystal silicon substrate showed nano-dots due to the preferred growth and a self-arranged agglomerate nano phase due to agglomeration. It was possible to tune the characteristic size of the agglomerate phase with silicidation temperatures. The nano-thick Au-insertion was shown to lead to self-arranged microstructures of nickel silicide.

• 비파괴검사학회지
• /
• 제33권2호
• /
• pp.187-192
• /
• 2013

크랙 계면에서의 접촉 열저항에 의해 만들어지는 온도 강하 특성을 적외선을 이용하여 측정함으로써 피로균열을 검사하였다. 크랙과 같은 불연속면을 지나는 열 유동은 연속체에서와는 달리 접촉경계면에서 급격한 온도구배를 나타내는데 이 변화를 표면에서의 적외선 방사량으로 측정하여 피로균열의 위치를 탐지하였다. 표준 피로균열 시편의 중앙부에 노치를 생성한 후 저주기 피로균열을 노치 끝단으로부터 발생시킨 다음, 이 시편의 한쪽 끝단에 할로겐램프를 이용하여 일정한 열을 가함으로서 시편의 길이 방향으로 열 유동이 일어나도록 하면서 시편의 표면온도 분포를 적외선 실험장치로 계측하였다. 열 유동이 크랙을 지나면서 온도구배가 크게 변화하는 것을 적외선 열화상 이미지로부터 알 수 있었으며 균열 면에서의 적외선 온도 데이터로부터 크랙의 위치와 크기를 평가할 수 있음을 실험적으로 확인하였다.

• 대한금속재료학회지
• /
• 제46권3호
• /
• pp.159-168
• /
• 2008

Thermally-evaporated 10 nm-Ni/1 nm-Ru/(30 nm or 70 nm-poly)Si structures were fabricated in order to investigate the thermal stability of Ru-inserted nickel monosilicide. The silicide samples underwent rapid thermal anne aling at $300{\sim}1,100^{\circ}C$ for 40 seconds. Silicides suitable for the salicide process were formed on the top of the single crystal and polycrystalline silicon substrates mimicking actives and gates. The sheet resistance was measured using a four-point probe. High resolution X-ray diffraction and Auger depth profiling were used for phase and chemical composition analysis, respectively. Transmission electron microscope and scanning probe microscope(SPM) were used to determine the cross-sectional structure and surface roughness. The silicide, which formed on single crystal silicon and 30 nm polysilicon substrate, could defer the transformation of $Ni_2Si $i and $NiSi_2 $, and was stable at temperatures up to $1,100^{\circ}C$ and $1,100^{\circ}C$, respectively. Regarding microstructure, the nano-size NiSi preferred phase was observed on single crystalline Si substrate, and agglomerate phase was shown on 30 nm-thick polycrystalline Si substrate, respectively. The silicide, formed on 70 nm polysilicon substrate, showed high resistance at temperatures >$700^{\circ}C$ caused by mixed microstructure. Through SPM analysis, we confirmed that the surface roughness increased abruptly on single crystal Si substrate while not changed on polycrystalline substrate. The Ru-inserted nickel monosilicide could maintain a low resistance in wide temperature range and is considered suitable for the nano-thick silicide process.

• Corrosion Science and Technology
• /
• 제22권2호
• /
• pp.108-114
• /
• 2023

In this study, anti-corrosion effect was investigated through various electrochemical experiments after applying Al thermal spraying technology to AA5083-H321. Open circuit potential and anodic polarization curves were analyzed through electrochemical experiments in natural seawater. The shape of the surface was observed using a scanning electron microscope (SEM) and a 3D microscope before and after the experiment. Component and crystal structure were analyzed through EDS and XRD. As a result, the surface roughness of AA5083-H321 and the Al thermal sprayed coating layer increased due to surface damage caused by anodic dissolution reaction during the anodic polarization experiment. The corrosion rate of AA5083-H321 was relatively low because the Al thermal spray coating layer contained structural defects such as pores and crevices. Nevertheless, the open circuit potential of the Al thermal spray coating layer in natural seawater was measured about 0.2 V lower than that of AA5083-H321. Thus, a sacrificial anode protection effect can be expected.

• 한국조명전기설비학회:학술대회논문집
• /
• 한국조명전기설비학회 2007년도 추계학술대회 논문집
• /
• pp.349-352
• /
• 2007

It is impossible to database(DB) the patterns of cable events and cause analysis of faulted cable because the product liability(PL) law have been enforced in Korea, since 2002. In additions, simulation and pattern of cable events are needed for DB system under accelerated deterioration. In this paper, we tested for resistance to nicking of cable below the 22.9kV class due to thermal stresses. This method of exam is following IEC 60811-3-1(Common test methods for insulating and sheathing materials of electric cables). First of all, set the cable in the thermal stress instrument, temperature changed from -20 degree to 120 degree. After thermal stress, we observed a surface crack of cable through microscope and carried out AC withstand voltage test.

• 한국생산제조학회지
• /
• 제21권6호
• /
• pp.1008-1012
• /
• 2012

Injection molds are fabricated by assembling a number of plates in which mold core and cavity components are inserted. The assembled structure causes a number of contact interfaces between each component where the heat transfer is affected by the thermal contact resistance. However, the mold assembly has been treated as a one body in numerical analyses of injection molding, which has a limitation in predicting the mold temperature distribution during the molding cycle. In this study, a numerical approach that considers the thermal contact effect is proposed to predict the heat transfer characteristics of an injection mold assembly. To find the thermal contact conductance between the mold core and plate, a number of finite element (FE) simulations were performed with the design of experiment (DOE) and statistical analysis. Thus, the heat transfer analyses using the obtained conductance values can provide more reliable results than conventional one-body simulations.

• 한국표면공학회지
• /
• 제52권2호
• /
• pp.58-61
• /
• 2019

The aim of this study is to quantitatively demonstrate the possibility of heat transfer by thermal radiation by comparing heat transfer by conventional heat transfer and radiation by radiation. 1) The heat transfer was measured by using filler of TIM material with low thermal conductivity (CuS). As a result, heat transfer was easier than ceramic with high thermal conductivity ($Al_2O_3$ and $Si_3N_4$). 2) The reason for this is thought to be that the infrared wave due to radiation of the air diaphragm has moved easily. 3) From the above results, the heat dissipation of the TIM material indicates the possibility of heat transfer by thermal radiation.