• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.09a
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• pp.124-128
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• 2005

To produce a highly sensitive uncooled microbolometer, the development of a high-performance thermometric material is essential. In this work, amorphous vanadium-tungsten oxide was developed as a thermometric material at a low temperature of $300^{\circ}C$, and the microbolometer, coupled with the material, was designed and fabricated using surface micromachining technology. The vanadium-tungsten oxide showed good properties for application to the microbolometer, Such as a high temperature coefficient of resistance of over -4.0 $\%$/K and good compatibility with the surface micromachining and integrated circuit fabrication process due to its low fabrication temperature. As a result, the uncooled microbolometer could be fabricated with high detectivity over $1.0\;{\times}\;10^9\;cmHz^{1/2}/W$ at a bias current of $7.5\;{\mu}A$ and a chopper frequency of 10-20 Hz

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.247-248
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• 2009

• Journal of the Semiconductor & Display Technology
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• v.5 no.3 s.16
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• pp.5-10
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• 2006

This paper investigates cutting qualities after laser dicing and predicts the problems that can be generated by laser dicing. And through 3 point bending test, die strength is measured and the die strength after laser dicing is compared with the die strength after mechanical sawing. Laser dicing is chiefly considered as an alternative to overcome the defects of mechanical sawing such as chipping on the surface and crack on the back side. Laser micromachining is based on the thermal ablation and evaporation mechanism. As a result of laser dicing experiments, debris on the surface of wafer is observed. To eliminate the debris and protect the surface, an experiment is done using a water soluble coating material and ultrasonic. The consequence is that most of debris is removed. But there are some residues around the cutting line. Unlike mechanical sawing, chipping on the surface and crack on the back side is not observed. The cross section of cutting line by laser dicing is rough as compared with that by mechanical sawing. But micro crack can not be seen. Micro crack reduces die strength. To measure this, 3 point bending test is done. The die strength after laser dicing decreases to a half of the die strength after mechanical sawing. This means that die cracking during package assembly can occur.

• Laser Solutions
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• v.12 no.1
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• pp.7-13
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• 2009

Engineering ceramics as sapphire are widely used in industry owing to their superior mechanical and corrosion properties. However, micromachining of sapphire is a considerable challenge due to its transparency. Recently, direct ablation of sapphire has been demonstrated with a visible laser pulse at sufficiently high laser intensity. In this work, the theoretical model for pulsed laser ablation of sapphire is suggested and numerical analysis is carried out using the model. Sapphire ablation begins with plasma generation by the laser interaction with surface defects, impurities and contaminations in the initial stage of machining. Subsequent absorption of the visible laser beam can be explained by three mechanisms: metalization of sapphire surface due to the EUV radiation from the hot plasma, increments of surface roughness and temperature-dependent absorption coefficient. Comparison of the computation results with experimental observation indicates that the proposed model of sapphire is reasonable.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.10
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• pp.1089-1095
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• 2012

Laser beam machining (LBM) using nanosecond pulsed laser is widely known to be rapid and non-wear process for micromachining. However, the quality itself cannot meet the precision standard due to the recast layer and heat affected zone. In this paper, a fabrication method for machining micro features in stainless steel using a hybrid process of LBM using nanosecond pulsed laser and electrochemical etching (ECE) is reported. ECE uses non-contacting method for precise surface machining and selectively removes the recast layer and heat affected zone produced by laser beam in an effective way. Compared to the single LBM process, the hybrid process of LBM and ECE enhanced the quality of the micro features.

• Laser Solutions
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• v.16 no.2
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• pp.1-6
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• 2013

Picosecond lasers are a very effective tool for micromachining metals, especially when high accuracy, high surface roughness and no heat affected zone are required. However, low productivity has been a limit to broadening the spectrum of their industrial applications. Recently it was reported that in the micromachining of copper with a 1064nm picosecond laser, there exist the optimal pulse energy and repetition rate to achieve the maximum volume ablation rate. In this paper, we used a 515nm picosecond laser, which is more efficient for micromachining copper in terms of laser energy absorption, to obtain its optimal pulse energy and repetition rate. Theoretical analysis based on the experimental data on copper ablation showed that using a 515nm picosecond laser instead of a 1064nm picosecond laser is more favorable in that the calculated threshold fluence is 75% lower and optical penetration depth is 50% deeper.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.12
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• pp.7-11
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• 2007

In this paper, we proposed the dual-mode stepped impedance ring resonator bandpass filter for MMIC (Microwave Monolithic Integrated Circuit) applications using the dielectric-supported air-gapped microstrip line (DAML). The ring resonator fabricated by surface micromachining technology. This filter consists of a DAML resonator layer and a CPW feed line. The DAML ring resonator is elevated with $10{\mu}m$ height from GaAs substrate surface. This bandpass filter is $1-{\lambda}g$ type stepped impedance ring resonator including dual-mode resonance. From the measurements, we obtained attenuation of over 15 dB and insertion loss of 2.65 dB at the center frequency of 97 GHz. Relative bandwidth is about 12 % at 97 GHz. Furthermore, the proposed bandpass filter is useful to integrate with conventional MMICs.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.157-158
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• 2012

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1991-1993
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• 1996

This paper describes a standardized micromachinung project (SMP) performed at Seoul National University (SNU). The SNU SMP uses a 3-mask, 2-polysilicon surface micromaching process. The entire process is performed at SNU Inter-University Semiconductor Research Institute(ISRC). In this first SNU SMP attemp, 16 $1cm^2$ cells containing different designs were fabricated.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.12
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• pp.1159-1165
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• 2013

Powder blasting, which is an efficient micromachining method for glass, silicon, and ceramics, has a critical disadvantage in that the surface finish is poor owing to the brittle fracture of materials. Low-pressure waterjet machining can be applied to smoothen the rough surface inside the blasted structure. In this study, the surface roughness and sectional dimension of micro-channels are observed during the repetitive application of a waterjet to blasted micro-channels. The asperities and subsurface cracks created by blasting are removed by waterjet machining. Along with the surface roughness, it is found that the sectional dimension increases and the edges of the finished micro-channel become slightly round. Finally, a microfluidic chip is machined by the blasting-waterjet process and a transparent microfluidic channel is obtained efficiently.