• Transactions of the Korean Society of Automotive Engineers
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• v.9 no.6
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• pp.170-177
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• 2001

Turbine blade is subject to torsional load by torsion-mount, centrifugal load by rotation of rotor and repeated bending load by steam pressure. Turbine with partially cracked blade has normal working condition at initial repair time but vibratory working condition at middle repair time due to crack growth. Finite element analysis on turbine blade indicates that repeated bending load out of all loads is the most important factor on fatigue strength of turbine blade. Therefore, this study shows root mean square roughness has linear relation with stress intensity factor range in 12% Cr steel and can predict loading condition of fractured turbine blade.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2006.05a
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• pp.821-826
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• 2006

This paper presents a novel type of hybrid dispensing head for IC fabrication and surface mount technology. The proposed mechanism consists of solenoid valve and piezoelectric stack as actuators, and provides positive-displacement and jet dispensing. The positive-displacement dispensing can produce desired adhesive amount without viscosity effect, while the jet dispensing can produce high precision adhesive amount. In order to determine the relationship between required voltage of the piezo actuator and needle displacement, both static and dynamic analysis are undertaken, In addition, finite element analysis is performed in order to find optimal design parameters. Dispensing flow rate and pressure in the chamber are evaluated through fluid dynamic model.

• International Journal of Automotive Technology
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• v.7 no.6
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• pp.741-747
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• 2006

It has been almost impossible to predict the fatigue life in the field of rubber materials by numerical methods. One of the reasons is that there are no obvious fracture criteria and excessively various ways of mixing processes. Tearing energy is considered as a fracture criterion which can be applied to rubber compounds regardless of different types of fillers, relative to other fracture factors. Fatigue life of rubber materials can be approximately predicted based on the assumption that the latent defect caused by contaminants or voids in the matrix, imperfectly dispersed compounding ingredients, mold lubricants and surface flaws always exists. Numerical expression for the prediction of fatigue life was derived from the rate of rough cut growth region and the formulated tearing energy equation. Endurance test data for dumbbell specimens were compared with the predicted fatigue life for verification. Also, fatigue life of industrial rubber components was predicted.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.12
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• pp.1276-1282
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• 2003

The SMT(Surface Mount Type) ferrite bead used to reduce the influx of power bus noise is modeled with parallel capacitor(C), series resistor(R) and series inductor(L). The simple equivalent circuit modeling doesn't agree with the measurement result. In this paper, we proposed the accurate equivalent circuit model of the ferrite bead at wide frequency range(50 MHz∼3 GHz) and analyzed the noise effect to the high speed IC(Integrate Circuit) with ferrite bead or not.

• Journal of electromagnetic engineering and science
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• v.17 no.1
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• pp.29-33
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• 2017

This paper proposes a half-mode substrate integrated waveguide (HMSIW) amplifier using lumped-element transition. The input and output impedances of this amplifier are matched by the lumped-element transition structure. This structure provides compact impedance and mode matching circuits between the HMSIW and a stand-alone amplifier. Surface mount technology inductors and capacitors are implemented to realize the lumped-element transition. A prototype of the proposed HMSIW amplifier shows 15 dB gain with 3 dB bandwidth of 4 to 7.05 GHz in a simulation and measurement.

• Proceedings of the KIEE Conference
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• 2007.10a
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• pp.333-334
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• 2007

We propose a path planning method to decrease a inspection lead time of line scan camera in SMT(surface mount technology) in-line system. The inspection window area of printed circuit board should be minimized to consider the FOV(field of view) of line scan camera so that line scan inspector is going to find a optimal solution of path planning. We propose one of the hierarchical clustrering algorithm for a given board. Comparative simulation results are presented to verify the usefulness of proposed method.

• Proceedings of the KIPE Conference
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• 2018.07a
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• pp.207-209
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• 2018

본 논문은 고효율 및 고전력밀도 3-레벨 PFC(Power Factor Correction) 컨버터를 제안한다. 기존 PFC의 고 전력밀도를 위한 스위칭 주파수 상승은 스위칭 특성이 우수한 소자를 적용하거나, 별도의 스너버 회로가 요구되므로 설계가 복잡하며 고전력밀도 달성에 한계가 있다. 제안 PFC 컨버터는 3-레벨 방식을 적용하여 각 스위칭 소자의 전압 스트레스를 절반으로 감소시켰으며, 스위치 손실 저감을 통한 고속 스위칭 동작으로 리액티브 소자의 고밀도화를 달성하였다. 또한, 기존의 3-레벨방식은 디지털 제어를 통해 스위칭 소자의 전압 평형이 이루어졌지만, 본 논문에서는 아날로그 IC에 전압 평형을 위한 RC Delay 회로와 소수의 SMD(Surface-mount devices) 소자만을 이용하여 별도의 제어회로 없이 전압 평형이 가능하므로 고 전력밀도 달성에 유리하다. 제안회로의 타당성을 검증하기 위해 CRM(Critical conduction mode) PFC 컨버터를 기반으로 250W급 시작품 제작을 통한 실험 결과를 제시한다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.442-446
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• 1999

Melting behavior and bridge phenomenon of solder paste, which is essential for surface mount technology in packaging, were investigated. solder paste of Sn-37%Pb was printed on Sn-coated Cu-pattern of PCB, and heated over melting point. Melting behavior of the paste was observed using CCD-camera. In order to modelize the melting and agglomeration phenomena of the paste, two solder balls of 0.76mm diameter were used. As experimental results, the paste start to melt from the margin of the printed shape. The hight of the melted paste decreased from 270 $\mu$m to 200 $\mu$m firstly, and finally recovered to 250 $\mu$m. During the melting procedure, pores were evolved from the molten paste. Bridge Phenomenon of the molten Paste depends upon the pitch of the pattern.

• ETRI Journal
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• v.35 no.4
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• pp.566-570
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• 2013

In this paper, we demonstrate the capabilities of 380-nm ultraviolet (UV) light-emitting diodes (LEDs) using metal organic chemical vapor deposition. The epi-structure of these LEDs consists of InGaN/AlGaN multiple quantum wells on a patterned sapphire substrate, and the devices are fabricated using a conventional LED process. The LEDs are packaged with a type of surface mount device with Al-metal. A UV LED can emit light at 383.3 nm, and its maximum output power is 118.4 mW at 350 mA.

• Journal of the Semiconductor & Display Technology
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• v.11 no.3
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• pp.39-44
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• 2012

Electronics in modern lives have become more miniaturized and precise. Multi Layered Ceramic Capacitor (MLCC) occupies 50% of electronic components consisting of electronics. This high volume of the production needs high speed and more precise machine performances. The dominate parts of the production equipments are the module transporting components and the visual inspection module. Most visual inspection has been off-line because of the image processing time. In this paper, a new image processing method is proposed to reduce thousands of matrix calculation for image processing and realize on-line high speed inspection.