• Title/Summary/Keyword: Substrate quantity

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A Study on a change of image in packing quantity (통꾸밈량에 대한 화선 변화에 관한 연구)

  • SonYeopKwak
    • Journal of the Korean Graphic Arts Communication Society
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    • v.9 no.1
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    • pp.45-51
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    • 1991
  • Commercially available paper stickers, electrostatic stickers, and metal sticker generally involve process of printing on the substrate and die-cutting to peel the sticker off the release paper. Using plastisol ink and multi-layer screen printing technique, a process of non die-cutting sticker with same image on both sides was developed. It was also possible to prevent color mixing phenomena at image edge part by printing narrow lines of black ink along the borderline.

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A study on characteristics of thin film $SnO_2$ gas sensor (박막형 $SnO_2$가스 센서의 특성에 관한 연구)

  • 김상연;송준태
    • Electrical & Electronic Materials
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    • v.8 no.3
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    • pp.278-284
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    • 1995
  • Thin fihn SnO$_{2}$ Gas Sensor was fabricated by electron-beam evaporation system and the target made by general firing method for the purpose of detecting gas components in air, especially methane gas. SnO$_{2}$ thin film was prepared on the polished alumina substrate which Pt interdigital electrode was precoated. The effects of annealing temperature and substrate temperature on the structural properties of SnO$_{2}$ thin film on glass were investigated using the X-ray diffraction. The good crystalline structure is formed when substrate temperature is 150[.deg. C] and annealing condition is 550[.deg. C], 1[hour]. And the sensing properties at various thickness of the SnO$_{2}$ thin film and the effects of PdCI$_{2}$ addition were also investigated. The good result is showed when the thickness is below 1000[.angs.] and the quantity of PdCI$_{2}$ addition is 4[wt%]. The thickness of SnO$_{2}$ thin film was measured by .alpha.-step and Elliopsometer.

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Maskless Screen Printing Process using Solder Bump Maker (SBM) for Low-cost, Fine-pitch Solder-on-Pad (SoP) Technology

  • Choi, Kwang-Seong;Lee, Haksun;Bae, Hyun-Cheol;Eom, Yong-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.4
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    • pp.65-68
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    • 2013
  • A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process. A selective solder bumping mechanism without the mask is based on the material design of SBM. Maskless screen printing process can implement easily a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology. Its another advantage is ternary or quaternary lead-free SoP can be formed easily. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 ${\mu}m$ is, successfully, formed.

Substrate removal characteristics in anaerobic filter using volcanic stones (화산석(火山石)을 이용(利用)한 혐기성고정상(嫌氣性固定床)에 있어서 기질(基質)의 제거특성(除去特性))

  • Eom, Tae-Kyu;Kim, Young-Chur;Kim, Kyung-Ho
    • Journal of Korean Society of Water and Wastewater
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    • v.7 no.1
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    • pp.46-53
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    • 1993
  • This study was carried out to examine substrate removal characteristics with the variation of the hydraulic retention time in an anaerobic filter. The feed concentration of synthetic wastewater used in the experiment was $10,000mg/l$ glucose. As media, the porosity of volcanic stones in Jeju island were 76%. The conditions of the experiment were as follows; HRT ranging from 1 day to 3 day, loading rates ranging from 3.33kg $COD_{er}/void\;m^3.day$ to 10kg $COD_{er}/void\;m^3.day$ and a temperature $35^{\circ}C$. Based on the results of the experiments, the COD removal efficiency was 98~99% in $COD_{er}$ method with loading rates ranging from 3.33kgCOD/void $m^3.day$ to 10kg COD/void $m^3.day$ and HRT ranging from 1day to 3 day. The produced quantity of gas equivalant to a porosity volume was $1.332~3.756Nm^3/void\;m^3.day$. The relationship between $COD_{er}$ loading rates and gas produced quantity equivalant to a porosity volume was well fitted with the equation of $Nm^3/void\;m^3.day{\cdot}=0.359L_0+0.179$($L_0=COD$ loading rate). Judging from the removal efficiency in this experiment, We concluded that anaerobic filter using Volcanic stones is one of improved and effective. As media, practical value of volcanic stones is sufficient.

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Cultivate Characterics of Chili Growth using Nutrient Solution in Articifial Soil (인공 토양에서의 양액을 이용한 고추의 재배 특성)

  • Yoon, Sang Jin;Sean, Keefe Dimas Harris;Kwon, Soon Hong;Chung, Sung Won;Kwon, Soon Goo;Park, Jong Min;Kim, Jong Soon;Choi, Won Sik
    • Journal of the Korean Society of Industry Convergence
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    • v.20 no.5
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    • pp.351-357
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    • 2017
  • Growing plant in potting media without soil is known as Soilless cultivation. This method is used mostly in greenhouse cultivation to increase horticultural commodities production. Peat moss is commonly utilized as potting media substrate because of its characteristic. However, peat moss price is high because of the quantity of peat moss in nature has been decreased. Recently, most of the research is conducted to find the alternative growing medium to cultivate horticulture plant in potting media. Perlite and rice husk ash were mentioned that had a potent as alternative growing media for seasonal plants to increase agriculture production due to the lack of production area. This study aimed to determine the effect of using different substrate and growth performance of chili. The method used was the soilless cultivation. The chili was planted in the pot with perlite media, rice husk ash media, and peat moss media. The chili was measured after 65 days after planting. The result showed that rice husk ash and perlite were more potentials in chili growth performance than peat moss. Rice husk ash had the significant result of plant height. While, Perlite effect on root length, plant weight, leaf length, and stem diameter. The best alternative for cultivation chili without substrate based on this research was perlite then rice husk ash and peat moss.

A Study on Driving Characteristics by Particle-inserting Method in Charged Particle Type Display (대전입자형 디스플레이의 입자주입 방법에 의한 구동특성 연구)

  • Lee, Dong-Jin;Kim, Young-Cho
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.2
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    • pp.129-134
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    • 2012
  • We analyzed the movement and response time of charged particles according to particle-inserting methods to understand the variation of quantity of q/m of charged particles, which is a very important factor in electrical and optical characteristics of the charged particle type display, such as lifetime, response time, contrast ratio, reflectivity, etc. For our study we used white and black charged particles of which diameter is $20{\mu}m$, prepared pieces of ITO(indium tin oxide) coated glass substrate, and formed ribs on the glass substrates. The width of a rib is $30{\mu}m$ and the cell size is $220{\mu}m{\times}220{\mu}m$. As the particle-inserting methods, the white and black charged particles were respectively inserted into a front and a rear panel with a very small electric field and also the mixture of the white and black charged particles were inserted into a rear panel. As a result of the driving characteristics of charged particles, the factors about variation of quantity of q/m according to the particle inserting method was experimentally demonstrate, showing very different driving voltage, response time, the particle movement, etc.

Mechanisms involved in modification of film structure and properties in ICP assisted dc and pulsed dc sputtering

  • Kusano, Eiji
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.59.2-59.2
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    • 2015
  • Modification of film structure and properties in inductively-coupled plasma (ICP) assisted dc and pulsed dc sputtering has been reported by Oya and Kusano [1] and by Sakamoto, Kusano, and Matsuda [2], showing drastic changes in films structure and properties by the ICP assistance in particular to the pulsed dc discharge. Although mechanisms involved in the modification has been reported to be the increase in energy transferred to the substrate, details of effects of low-energy ion bombardment on the modification and origin of an anomalous increase in the ion quantity by the ICP assistance to the pulsed dc discharge have not been discussed. In this presentation, mechanisms involved in film structure and property modification in ICP assisted dc and pulsed dc sputtering, in which a number of low-energy ions are formed, will be discussed based on ion energy distribution as well as effectiveness of energy transfer to the substrate by low energy particles [3]. The results discussed in this presentation will emphasize the fact that the energetic particles playing an important role in the film structure modification are those to be deposited, but not those of inert gas, when their energies range in less than 100 eV in the pressure range of magnetron sputtering.

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Study on the Synthesis of Isoquercitrin by Enzymatic Partial Hydrolysis (효소를 이용한 부분 가수분해에 의한 isoquercitrin의 합성에 관한 연구)

  • Lee, Seul Bi;Chung, Dae-Won
    • Applied Chemistry for Engineering
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    • v.25 no.2
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    • pp.152-156
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    • 2014
  • Isoquercitrin (IQ), quercetin monoglycoside, is classified as a polyphenol, and a minute quantity of IQ is known to be present in several plants. Recently, it was reported that IQ can be prepared by the partial enzymatic hydrolysis of quercetin diglycoside (rutin, RU). In this paper, the effects of enzyme types, enzyme amounts, and substrate concentrations on the reactivity were investigated using a series of $Pecinex^{TM}$ multi-enzymes. The reaction, when a 8 ml of Ultra Clear to 1 g of RU was applied with the substrate concentration of 1% at $50^{\circ}C$, was found to be optimum, based on the reaction rate and the selectivity to IQ.

The Effects of Electrolyte Compositions on the Property of Copper Electrodeposited Layer (구리전착층의 물성에 미치는 전해액 조성의 영향)

  • Park, Eun-Kwang;Lee, Man-Hyung;Woo, Tae-Gyu;Park, Il-Song;Jung, Kwang-Hee;Seol, Kyeong-Won
    • Korean Journal of Metals and Materials
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    • v.47 no.11
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    • pp.740-747
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    • 2009
  • The purpose of this study is to identify the effect of electrolyte compositions on electrodeposited copper foil. First of all, the polyimide substrate was pretreated with plasma. Finally, copper foil was deposited on a Cu/Ni/Polyimide substrate using the electroplating technique. As the quantity of Cu increased, preferred orientations changed into (111). Increasing sulfuric acid, on the other hand, brought down the preferred orientation of (111). The lowest sheet resistance, surface roughness, and fine adhesion were detected when the ratio of $Cu^{2+}$ and $H_2SO_4$ is 50:50(g/l).

Effect of Surface Damage of Metal Substrate on LIBS Signal (금속 Substrate의 표면손상이 LIBS신호에 미치는 영향)

  • Jang, Sang-Ik;Kim, Kibum
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.3
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    • pp.1259-1264
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    • 2014
  • Hydrogen is in the world limelight for future energy source, and it has been already used in various industry fields including aerospace. The extremely fine molecule of the hydrogen can be easily leaked from tiny size of the crack on the surface of transporting pipes or storage tanks, and it could bring on awfully terrible disaster. In this study, Laser-Induced Breakdown Spectroscopy (LIBS) was employed to develope a reliable detection scheme for a small quantity of hydrogen leakage. Effect of three different metal substrates (i.e. Al, Cu, SUS) on plasma generation and the intensity of the hydrogen atomic signal was investigated, and the surface damage of the substrates due to repetitive laser shots was observed using Scanning electron microscope. It was also evaluated how the surface damage could distort the atomic signal. The intensity of the atomic signal was found to be the strongest, and the signal distortion due to the surface damage was approximately $100W/m^2$ lower when Al was used for the substrate.