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The Effects of Electrolyte Compositions on the Property of Copper Electrodeposited Layer  

Park, Eun-Kwang (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Lee, Man-Hyung (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Woo, Tae-Gyu (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Park, Il-Song (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Jung, Kwang-Hee (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Seol, Kyeong-Won (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Publication Information
Korean Journal of Metals and Materials / v.47, no.11, 2009 , pp. 740-747 More about this Journal
Abstract
The purpose of this study is to identify the effect of electrolyte compositions on electrodeposited copper foil. First of all, the polyimide substrate was pretreated with plasma. Finally, copper foil was deposited on a Cu/Ni/Polyimide substrate using the electroplating technique. As the quantity of Cu increased, preferred orientations changed into (111). Increasing sulfuric acid, on the other hand, brought down the preferred orientation of (111). The lowest sheet resistance, surface roughness, and fine adhesion were detected when the ratio of $Cu^{2+}$ and $H_2SO_4$ is 50:50(g/l).
Keywords
polyimide; electrodeposition; electrolyte; surface morphology; texture; peel strength;
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1 J. W. Choi, T. S. Oh and Y. H. Kim, J. Kor. Inst. Met. & Mater. 35, 542 (1997)
2 H. J. Kang, P. N. Park, S. J. Park, and S. Y. Choi, Electro. Technol. Res. 203, 8 (2003)
3 M. L. Sartorelli, A. Q. Schervenski, R. G. Delatorre, and P. Klauss, Phys. Stat. Sol. 187, 91 (2001)   DOI   ScienceOn
4 C. H. Yang, S. C. Lee, J, M. Wu, and T. C. Lin, Appl. Surf. Sci. 252, 1818 (2005)   DOI   ScienceOn
5 W. J. Lee, Y. S. Lee, S. K. Rha, Y. J. Lee, K. Y. Lim, Y. D. Chung, and C. N. Whang, Appl. Surf. Sci. 205, 128 (2003)   DOI   ScienceOn
6 A. P. Paync and B. M. Clemens, J. Mater. Res. 7, 1370 (1992)   DOI
7 A. G. Dirks and J. J. van den Broek, J. Vac. Sci. Technol. A3, 2618 (1985)   DOI
8 C. J. Wang, C. A. Chang, C. E. Farrel, and A. G. Schrott, Appl. Phys. Lett. 62, 654 (1993)   DOI
9 J. Kim, S. H. Wen, and D. Yee, J. Vac. Sci. Technol. A6, 2366 (1988)   DOI
10 S. H. Kim, S. H. Cho, N. E. Lee, H. M. Kim, Y. W. Nam, and Y. H. Kim, Surf. Coat. Technol. 193, 101 (2005)   DOI   ScienceOn
11 Y. K. Lee and T. J. O'keefe, JOM 54, 44 (2002)
12 D. N. Lee, J. Mat. Sci. 24, 4375 (1989)   DOI
13 A. M. Ektessabi and S. Hakamata, Thin Solid Films 621, 377 (2000)   DOI   ScienceOn
14 T. X. Liang, Y. Q. Liu, Z. Q. Fu, Z. Q. Luo, and K. Y. Zhang, This Solid films 473, 247 (2005)   DOI   ScienceOn
15 M. M. D. Ramos, A. M. Stoncham, and A. P. Sutton, Acta. Met. Mater. 41, 2105 (1993)   DOI   ScienceOn
16 S. B. Lee, Y. K. Kim, and J. S. Kim, Kor. J. Mater. Resea. 16, 543 (2006)
17 T. G. Woo, I. L. Park, M. H. Lee, E. K. Park, and K. W. Seol, J. Kor. Inst. Met. & Mater. 45, 478 (2007)
18 H. S. Lee, H. S. Kim, and C. M. Lee, J. Kor. Inst. Met. & Mater. 39, 920 (2001)
19 J. H. Hong, Y. H. Lee, S. H. Han, and K. J. Kim, Surf. Coat. Techno. 201, 197 (2006)   DOI   ScienceOn
20 S. H. Kim, D. W. Lee, and K. H. Chung, Kor. J. Mater. Res. 9, 65 (1999)
21 R. Haight, R. C. White, B. D. Silverman, and P. S. Ho, J. Vac. Sci. Technol. A6, 2188 (1988)   DOI
22 Y. Momose, T. Ohalm, H. Chuma, S. Okazaki, T. Saruta, M. Masui, M. Takeuchi, and H. K. Yasuda, Hohn Wiley & Sons p.153 (1990)
23 S. J. Park, K. S. Cho, and S. H. Kim, Hwahak Konghak 40, 613 (2002)
24 S. Yoshimura, S. Yoshihara, T. Shirakashi, and E. Sato, Electrochim. Acta. 39, 589 (1994)   DOI   ScienceOn