• 한국정밀공학회지
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• 제30권2호
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• pp.236-240
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• 2013

In this presentation, we propose a fabrication method of PDMS stencil to apply into a localized culture of NIH/3T3 cells. PDMS stencil was fabricated by nitrogen gas blowing and soft lithography from preparing SU-8 master mold by photolithography. PDMS stencil pattern was production of the circle size 20 to $500{\mu}m$. In the culture test of PDMS stencil, a stencil was placed on a glass disk. The NIH/3T3 cells were successfully cultured into micropatterns by using the PDMS stencil. The results showed that cells could be cultured into micropatterns with precisely controlled manner at any shapes and specific size for bioscience study and bioengineering applications.

• International Journal of Precision Engineering and Manufacturing
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• 제4권1호
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• pp.23-29
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• 2003

Stencil is used normally as a mask for solder pasting on pad of a printed circuit board (PCB). The objective of this study is to develop a stencil cutting system and determine the optimal conditions to make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse duration on the cut edge quality were investigated. In order to analyze the cut surface characteristics (roughness, kerfwidth, dross) optical microscopy, SEM microscopy and roughness measurements were used. As a result, the optimal conditions of cutting process parameters were determined, and the practical feasibility of the proposed system was also examined by using a commercial Gerber file for PCB stencil manufacturing.

• 한국레이저가공학회지
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• 제3권3호
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• pp.13-19
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• 2000

The stencil is a thin stainless sheet in which a pattern is formed, which is placed on a surface of plate to reproduce the pattern of electric circuit. Conventionally the stencil has been produced by etching process. This process has many anti-environmental factors. In this study, Nd : YAG laser cutting process has been applied for stencil manufacturing. The study is focused on estimating kerf width of laser cut stencil by E.B.P.(Error Back-Propagation). This algorithm is good for estimating target value from input value. In this paper, target value was kerf width, and input values were frequency, pulse width, cutting speed and laser power. E.B.P. after teaming input and target could estimate kerf width from some variables precisely.

• 마이크로전자및패키징학회지
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• 제18권4호
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• pp.71-77
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• 2011

표면실장형 수동소자인 0402, 0603, 1005 칩에 대한 인쇄 주요인자 결정 및 공정 최적화를 실험계획법을 통해 실시하였다. 실험에 사용된 솔더는 Sn-3.0Ag-0.5Cu와 Sn-0.7Cu이며, 공정변수로는 스텐실 두께, 스퀴지 각도, 인쇄 속도, 기판분리 속도, 스텐실과 기판간의 갭이며, 인쇄압력은 2 $kgf/cm^2$로 고정하였다. 분산분석을 통해 인쇄효율에 영향을 미치는 주요인자가 스텐실 두께와 스퀴지 각도임을 확인할 수 있었다. 주요인자인 스텐실 두께와 스퀴지 각도를 변화시켜 인쇄효율의 최적화 영역을 확인하였고, 0402, 0603, 1005 칩 모두 스퀴지 각도가 $45^{\circ}$ 이하일 경우 인쇄효율이 높았다. 스텐실 두께를 변화할 경우 칩 크기에 따라 인쇄효율이 다른 양상을 보였는데, 0402, 0603 칩에서는 스텐실 두께가 얇을수록 높은 인쇄효율을 보였으며, 1005 칩에서는 스텐실 두께가 두꺼울수록 높은 인쇄효율을 나타내었다.

• ETRI Journal
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• 제42권2호
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• pp.272-281
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• 2020

Three-dimensional (3D) selfie services, one of the major 3D printing services, print 3D models of an individual's face via scanning. However, most of these services require expensive full-color supporting 3D printers. The high cost of such printers poses a challenge in launching a variety of 3D printing application services. This paper presents a stencil-based 3D facial relief creation method employing a low-cost RGBD sensor and a 3D printer. Stencil-based 3D facial relief is an artwork in which some parts are holes, similar to that in a stencil, and other parts stand out, as in a relief. The proposed method creates a new type of relief by combining the existing stencil techniques and relief techniques. As a result, the 3D printed product resembles a two-colored object rather than a one-colored object even when a monochrome 3D printer is used. Unlike existing personalization-based 3D printing services, the proposed method enables the printing and delivery of products to customers in a short period of time. Experimental results reveal that, compared to existing 3D selfie products printed by monochrome 3D printers, our products have a higher degree of similarity and are more profitable.

• 한국생산제조학회지
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• 제21권1호
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• pp.26-32
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• 2012

In the present study, the stencil printing process using solder paste are numerically analyzed. The key design parameters in the stencil printing process are the printing conditions, stencil design, and solder paste properties. Among these parameters, the effects of printing conditions including the squeegee angle and squeegee pressure are investigated through finite element (FE) analysis. However, the FE analysis for the stencil printing process requires tremendous computational loads and time because this process carries micro-filling through thousands of micro-apertures in stencil. To overcome this difficulty in simulation, the present study proposes a two-step approach to sequentially perform the global domain analysis and the local domain analysis. That is, the pressure development under the squeegee are firstly calculated in the full analysis domain through the global analysis. The filling stage of the solder paste into a micro-aperture is then analyzed in the local analysis domain based on the results of the preceding global analysis.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.989-992
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• 1997

The objective of this study is to develop stencil cutting process and determine optimal conditions which make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse width on the cut edge quality were investigated. In order to analyze the cut surface characteristics(roughness, kerf width, dross) optical microscopy, SEM photography and roughness test were used. A a results, the optimal conditions of process parameters were determined, and the practical feasibility of the proposed system is also examined by using a commercial gerber file for PCB stencil manufacturing.

• 한국레이저가공학회지
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• 제4권2호
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• pp.47-57
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• 2001

This study deals with the laser cutting of stencil for the PCB. The most important aim of this study is to determine optimal conditions which make good-qualify stencil in Nd:YAG laser cutting. We made an experiment according to various variables (power. type of mask. gas pressure, cutting speed, and pulse width) and analyzed the cutting characteristics (surface roughness, kerf width. dross) . Each variable has optimal value for good-qualify cut edge under fixed condition. And neural network after learning experimental data with a million time iteration could predict surface roughness of cut edge under arbitrary condition approximately.

• 한국경영과학회:학술대회논문집
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• 대한산업공학회/한국경영과학회 2002년도 춘계공동학술대회
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• pp.266-271
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• 2002

We propose a hardware accelerated voxelization method for various 3D object model such as surface models, solid models, and volumetric CSG models. The algorithm utilizes the stencil buffer that is one of modern Open히 graphics hardware features. The stencil buffer is originally used to restrict drawing to certain portions of the screen. The volumetric representations of given 3D objects are constructed slice-by-slice. For each slice, the algorithm restricts the drawing areas constructed inner region of 3D objects using the stencil buffer, and generates slices of the volumetric representation for target objects. As a result, we can provide volume graphics support for various engineering applications such as multi-axis machining simulation, collision detection and finite element analysis.

• 한국정밀공학회지
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• 제19권2호
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• pp.106-113
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• 2002

Stencil is used normally as a mask for seeder pasting on pad of PCB. The objective of this study is to develop stencil cutting system and determine optimal conditions which make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse width old the cut edge quality were investigated. In order to analyse fille cut surface characteristics(roughness, kerf width, dross) optical microscopy, SEM photography and roughness test were used. As a result, the optimal conditions of process parameters were determined, and the practical feasibility of the proposed system is also examined by using a commercial Gerber file for PCB stencil manufacturing.