Browse > Article
http://dx.doi.org/10.7735/ksmte.2012.21.1.026

Improvement of Filling Characteristics of Micro-Bumps in the Stencil Printing Process  

Seo, W.S. (서울과학기술대학교 NID융합기술대학원)
Min, B.W. (서울과학기술대학교 NID융합기술대학원)
Park, K. (서울과학기술대학교 기계설계자동화공학부)
Lee, H.J. (한국생산기술연구원 미래융합연구그룹)
Kim, J.B. (서울과학기술대학교 자동차공학과)
Publication Information
Journal of the Korean Society of Manufacturing Technology Engineers / v.21, no.1, 2012 , pp. 26-32 More about this Journal
Abstract
In the present study, the stencil printing process using solder paste are numerically analyzed. The key design parameters in the stencil printing process are the printing conditions, stencil design, and solder paste properties. Among these parameters, the effects of printing conditions including the squeegee angle and squeegee pressure are investigated through finite element (FE) analysis. However, the FE analysis for the stencil printing process requires tremendous computational loads and time because this process carries micro-filling through thousands of micro-apertures in stencil. To overcome this difficulty in simulation, the present study proposes a two-step approach to sequentially perform the global domain analysis and the local domain analysis. That is, the pressure development under the squeegee are firstly calculated in the full analysis domain through the global analysis. The filling stage of the solder paste into a micro-aperture is then analyzed in the local analysis domain based on the results of the preceding global analysis.
Keywords
Solder paste; Stencil printing; Squeegee angle; Micro bumps; Numerical analysis;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 Tsai, T., 2008 "Modeling and Optimization of Stencil Printing Operations: A Comparison Study," Comput. & Indust. Eng., Vol. 54, No. 3, pp. 374-389.   DOI   ScienceOn
2 Moon, J. K., Ki, J. M., and Jung, J. P., 2004, "Fluxless Plasma Soldering of Pb-free Solders on Si-Wafer-Effect of Plasma Cleaning," J. Microelectron. Packag. Soc., Vol. 11, No. 1, pp. 77-85.
3 Wang, J., 2007, "The Effects of Rheological and Wetting Properties on Underfill Filler Settling and Flow Voids in Flip Chip Packages," Microelectron. Reliab., Vol. 47, No. 12, pp. 1958-1966.   DOI   ScienceOn
4 Shin, K. H., Kim, H. T., and Jang, D. Y., 2007, "An Analysis on the Thermal Shock Characteristics of Pb-free Solder Joints and UBM in the Flip Packages," J. Manuf. Engng. Technol, Vol. 16, No. 5, pp. 134-139.
5 COMSOL, 2008, Comsol Multiphysics : MEMS Module User/s Guide, Ver. 3.5a, COMSOL AB.
6 Seo, W. S., Min, B. W., Kim, J. H., Lee, N. K., and Kim, J. B., 2010, "An Analysis of Screen Printing using Solder Paste," J. Microelectron. Packag. Soc., Vol. 17, No. 1, pp. 47-53.
7 NIHON GENMA MFG. CO., n.d, viewed 13 August 2010, "Solder Cream ZERO series NP303-CQS-2,"
8 Howell, E. A., Megaridis, C. M., and McNallan, M., 2004, "Dynamic Surface Tension Measurements of Molten Sn/Pb Solder using Oscillating Slender Elliptical Jets," Int. J. Heat and Fluid Flow, Vol. 25, No. 1, pp. 91-102.   DOI   ScienceOn
9 Hsieh, H., Lin, F., Yao, F., and Lin, M., 2009, "The Effects of Temperature and Solders on the Wettability between Ribbon and Solar Cell," Solar Energy Mater. & Solar Cells, Vol. 93, No. 6-7, pp. 864-868.   DOI   ScienceOn
10 Lee, J., Cho, S., Lee, Y., Kim, K., Cheon, C., and Jung, J., 2005, "Aging Characteristics of Sn-1.8 Bi-0.7-Cu-0.6In Solder," J. Microelecton. Packag. Soc., Vol. 12, No. 4, pp. 301-306.
11 Durairaj, R., Mallik, S., Seman, A., Marks A., and Ekere, N. N., 2009, "Rheological Characterisation of Solder Pastes and Isotropic Conductive Adhesives used for Flip-chip Assembly," J. Mater. Process. Technol., Vol. 209, No. 8, pp. 3923-3930.   DOI   ScienceOn
12 Kim, M., Ahn, B., and Jung, J., 2001, "A Study on Melting Phenomena of Solder Paste," J. Microelecton. Packag. Soc., Vol. 8, No. 1, pp. 5-11.
13 Haslehurst, I., and Ekere, N. N., 1996, "Parameter Interactions in Stencil Printing of Solder Paste," J. of Electron. Manuf., Vol. 6, No. 4, pp. 307-316.   DOI   ScienceOn
14 Ihm, J. W., Choi, D., and Ryu, H., 2004, "High Performance Electrode of Polymer Electrolyte Membrane Fuel Cells Prepared by Direct Screen Printing Process," J. Microelectron. Packag. Soc., Vol. 11, No. 1, pp. 65-69.
15 Evans, J. W., and Beddow, J. K., 1987, "Characterization of Particle Morphology and Rheological Behavior in Solder Paste," IEEE Trans. Compon., Hybrids, Manuf. Technol., Vol. 10, No. 2, pp. 224-231.   DOI
16 Durairaj, R., Ramesh, S., Mallik, S., Seman, A., and Ekere, N. N., 2009, "Rheological Characterisation and Printing Performance of Sn/Ag/Cu Solder Pastes," Mater. Design, Vol. 30, No. 9, pp. 3812-3818.   DOI   ScienceOn
17 Durairaj, R., Man, L. W., Ekere, N. N., and Mallik, S., 2010, "The Effect of Wall-slip Formation on the Rheological Behavior of Lead-free Solder Pastes," Mater. Design, Vol. 31, No.3, pp. 1056-1062.   DOI   ScienceOn
18 Ko, Y. K., Shin, Y. S., Yoo, S., and Lee, C. W., 2009, "Via Filling Technique with Molten Solder and Low Temperature Solder Bump for 3D Packaging," Proc. 2009 Fall Conference of Korean Society for Precision Engineering, pp. 699-700.