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http://dx.doi.org/10.6117/kmeps.2011.18.4.071

Evaluation of Solder Printing Efficiency with the Variation of Stencil Aperture Size  

Kwon, Sang-Hyun (Advanced Welding and Joining Technology Center, KITECH)
Kim, Jeong-Han (Advanced Welding and Joining Technology Center, KITECH)
Lee, Chang-Woo (Advanced Welding and Joining Technology Center, KITECH)
Yoo, Se-Hoon (Advanced Welding and Joining Technology Center, KITECH)
Publication Information
Journal of the Microelectronics and Packaging Society / v.18, no.4, 2011 , pp. 71-77 More about this Journal
Abstract
Main parameters of the screen printing were determined and the printing parameters were optimized for 0402, 0603, and 1005 chips in this study. The solder pastes used in this study were Sn-3.0Ag-0.5Cu and Sn-0.7Cu. The process parameters were stencil thickness, squeegee angle, printing speed, stencil separating speed and gap between stencil and PCB. The printing pressure was fixed at 2 $kgf/cm^2$. From ANOVA results, the stencil thickness and the squeegee angle were determined to be main parameters for the printing efficiency. The printing efficiency was optimized with varying two main parameters, the stencil thickness and the squeegee angle. The printing efficiency increased as the squeegee angle was lowered under 45o for all chips. For the 0402 and the 0603 chips, the printing efficiency increased as the stencil thickness decreased. On the other hand, for the 1005 chip, the printing efficiency increased as the stencil thickness increased.
Keywords
solder paste; stencil printing; printing efficiency; design of experiments;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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