Improvement of Filling Characteristics of Micro-Bumps in the Stencil Printing Process

스텐실 프린팅 공정에서 미세범프의 성형성 향상을 위한 연구

  • 서원상 (서울과학기술대학교 NID융합기술대학원) ;
  • 민병욱 (서울과학기술대학교 NID융합기술대학원) ;
  • 박근 (서울과학기술대학교 기계설계자동화공학부) ;
  • 이혜진 (한국생산기술연구원 미래융합연구그룹) ;
  • 김종봉 (서울과학기술대학교 자동차공학과)
  • Received : 2011.10.20
  • Accepted : 2011.12.19
  • Published : 2012.02.15


In the present study, the stencil printing process using solder paste are numerically analyzed. The key design parameters in the stencil printing process are the printing conditions, stencil design, and solder paste properties. Among these parameters, the effects of printing conditions including the squeegee angle and squeegee pressure are investigated through finite element (FE) analysis. However, the FE analysis for the stencil printing process requires tremendous computational loads and time because this process carries micro-filling through thousands of micro-apertures in stencil. To overcome this difficulty in simulation, the present study proposes a two-step approach to sequentially perform the global domain analysis and the local domain analysis. That is, the pressure development under the squeegee are firstly calculated in the full analysis domain through the global analysis. The filling stage of the solder paste into a micro-aperture is then analyzed in the local analysis domain based on the results of the preceding global analysis.



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