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Development of Laser Process and System for Stencil Manufacturing  

Lee, Jae-Hoon (Laser Application Group, Korea Institute of Machinery & Materials(KIMM))
Jeong Suh (Laser Application Group, Korea Institute of Machinery & Materials(KIMM))
Shin, Dong-Sig (Laser Application Group, Korea Institute of Machinery & Materials(KIMM))
Kim, Jeon-O (Laser Application Group, Korea Institute of Machinery & Materials(KIMM))
Lee, Young-Moon (Department of Machanicla Engineering, Kyungpook National University)
Publication Information
Abstract
Stencil is used normally as a mask for solder pasting on pad of a printed circuit board (PCB). The objective of this study is to develop a stencil cutting system and determine the optimal conditions to make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse duration on the cut edge quality were investigated. In order to analyze the cut surface characteristics (roughness, kerfwidth, dross) optical microscopy, SEM microscopy and roughness measurements were used. As a result, the optimal conditions of cutting process parameters were determined, and the practical feasibility of the proposed system was also examined by using a commercial Gerber file for PCB stencil manufacturing.
Keywords
Nd:YAG laser; Stencil; Cut edge; Surface roughness; Dross; Kerf width; Mask;
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