• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2003.09a
• /
• pp.93-100
• /
• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• The KIPS Transactions:PartB
• /
• v.9B no.2
• /
• pp.245-254
• /
• 2002

IC package marking inspection system using machine vision locates and identifies the target elements from input image, and decides the quality of marking by comparing the extracted target elements with the standard patterns. This paper proposes an adaptive multi-level thresholding (AMLT) method which is suitable for a series of operations such as locating the target IC package, extracting the characters, and detecting the Pinl dimple. It also proposes a dynamic matching unit selection (DMUS) method which is robust to noises as well as effective to catch out the local marking errors. The main idea of the AMLT method is to restrict the inputs of Otsu's thresholding algorithm within a specified area and a partial range of gray values. Doing so, it can adapt to the specific domain. The DMUS method dynamically selects the matching unit according to the result of character extraction and layout analysis. Therefore, in spite of the various erroneous situation occurred in the process of character extraction and layout analysis, it can select minimal matching unit in any environment. In an experiment with 280 IC package images of eight types, the correct extracting rate of IC package and Pinl dimple was 100% and the correct decision rate of marking quality was 98.8%. This result shows that the proposed methods are effective to IC package marking inspection.

• The Transactions of the Korean Institute of Electrical Engineers B
• /
• v.53 no.10
• /
• pp.597-601
• /
• 2004

A high bandwidth watt-converter, based on an inexpensive, commercially available, standard IC package, is described that covers a frequency ranges from DC to 100 kHz. The new resistive shunt for a wide-band frequency current measurement of the watt-converter was developed. The converter will use application in accurate power measurement under distorted and high frequency conditions. The advantages of the proposed watt-converter are its simplicity, low cost and fast response time.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.2
• /
• pp.35-41
• /
• 2011

Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

• Proceedings of the KIEE Conference
• /
• 2004.07d
• /
• pp.2332-2334
• /
• 2004

A high bandwidth watt-converter, based on an inexpensive, commercially available, standard IC package, is described that covers a frequency ranges from DC to 100 kHz. The new resistive shunt for a wide-band frequency current measurement of the watt-converter was developed. The converter will use application in accurate power measurement under distorted and high frequency conditions. The advantages of the watt-converter are its simplicity, low cost and fast response time.

• Journal of Sensor Science and Technology
• /
• v.8 no.1
• /
• pp.38-44
• /
• 1999

In this paper, we have constructed a self-diagnostic circuit which could detect erroneous signals in most cases that a eight-beam piezoresistive accelerometer were destroyed more than its one beam. To confirm the function of the circuit, PSPICE simulation was carried out. An IC chip was fabricated with a layout of KA 324 amplifier using a bipolar standard processing. After a package of the chip was sealed using a plastic package with 24 pins, the self-diagnostic characteristics were investigated. Then, the measured self-diagnostic characteristics of the circuit were compared with the PSPICE simulated result.

• Journal of electromagnetic engineering and science
• /
• v.13 no.4
• /
• pp.233-239
• /
• 2013

This paper proposes an accurate approach for predicting transferred power from a noise source to integrated circuits based on the characteristics of the power transfer network. A power delivery trace on a package and a printed circuit board are designed to transmit power from an external source to integrated circuits. The power is demonstrated between an injection terminal on the edge of the printed circuit board and integrated circuits, and the power transfer function of the power distribution network is derived. A two-tier calibration is applied to the test, and scattering parameters of the network are measured for the calculation of the power transfer function. After testing to obtain the indispensable parameters, the real received and tolerable power of the integrated circuits can be easily achieved. Our proposed estimation method is an enhancement of the existing the International Electrotechnical Commission standard for precise prediction of the electromagnetic immunity of integrated circuits.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.47 no.9
• /
• pp.14-23
• /
• 2010

This paper reports the fabrication of a DVB-T/H System in Package (SiP) that is able to receive and process the DVB-T/H signal. The DVB-T/H is the European telecommunication standard for Digital Video Broadcasting (DVB). An IC-embedded Printed Circuit Board (PCB) process, interpose a chip between PCB layers, has applied to the DVB-T/H SiP. The chip inserted in DVB-T/H SiP is the System on Chip (SoC) for mobile TV. It is comprised of a RF block for DVB-T/H RF signal and a digital block to convert received signal to digital signal for an application processor. To operate the DVB-T/H IC, a 3MHz DC-DC converter and LDO are on the DVB-T/H SiP. And a 38.4MHz crystal is used as a clock source. The fabricated DVB-T/H SiP form 4 layers which size is $8mm{\times}8mm$. The DVB-T/H IC is located between 2nd and 3rd layer. According to the result of simulation, the RF signal sensitivity is improved since the layout modification of the ground plane and via. And we confirmed the adjustment of LC value on power transmission is necessary to turn down the noise level in a SiP. Although the size of a DVB-T/H SiP is decreased over 70% than reference module, the power consumption and efficiency is on a par with reference module. The average power consumption is 297mW and the efficiency is 87%. But, the RF signal sensitivity is declined by average 3.8dB. This is caused by the decrease of the RF signal sensitivity which is 2.8dB, because of the noise from the DC-DC converter.

• Journal of Nutrition and Health
• /
• v.30 no.6
• /
• pp.679-689
• /
• 1997

Nutrition label (NL) on the package of processed food provides consumers with a reliable and consistent source of information . It has been considered as a useful aid for food selection and a potent educational tool for nutrition in daily life. Since current nutrition labeling regulation in Korea does not define a format for presenting nutrition information a wide variety of NL format exists in the markers created by individual manufacturers. Development of standard NL format and its registration remain to be the work for the professionals and government officials. However the acceptance and evaluation of NL by the consumers is a very important and necessary process in the development of NL formats. In this study four different formats A, B, C, D were formulated based on currently circulating labels and new U.S.NL. Subjects used for evaluation of these formats were middle -aged highly educated housewives, who and the potential users of NL. Major parameters observed through the questionnare were their nutritional knowledge of RDA, ability of IC(Information Comparison) and CA (Comprehension and Application of informed nutrient contents), as well as their preference to the different formats. The results are summarized as follows. 1) Of the 178 subjects , 89.9% of the middleaged housewives were college graduates. Their nutrition knowledge of RDA were relatively satisfactory showing over 80% correlation on the basic concepts and unit while for numerical value less than 50% correct answer. 2) IC test scores were significantly different among the formats showing the highest values for format A and B which are presented as absolute value and % RDA, respectively. Format C presented as serving size(number of products) showed the lowest score. CA scores were also significantly different, though the increased load of information did not facilitate to increase the consumers comprehension. 3) RDA knowledge test scores and the scores of IA and CA were correlated in format A and D but not in format B and C suggesting % RDA presentation would be more acceptable to the less educated group. 4) For the preference in the aspects of easiness and time-saving format A was the best one then format D supporting the result of IC and CA test. The results of the present study indicate the most useful and preferred format is the simplest format presented as absolute value without RDA, . The secondly preferred format is the new NL format of the US with much information .