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http://dx.doi.org/10.5515/JKIEES.2013.13.4.233

Estimation of Transferred Power from a Noise Source to an IC with Forwarded Power Characteristics  

Pu, Bo (Department of Electrical & Electronic Engineering, Sungkyunkwan University)
Kim, Taeho (Department of Electrical & Electronic Engineering, Sungkyunkwan University)
Kim, SungJun (Department of Electrical & Electronic Engineering, Sungkyunkwan University)
Kim, Jong-Hyeon (Department of Electrical & Electronic Engineering, Sungkyunkwan University)
Kim, SoYoung (Department of Semiconductor System Engineering, Sungkyunkwan University)
Nah, Wansoo (Department of Electrical & Electronic Engineering, Sungkyunkwan University)
Publication Information
Journal of electromagnetic engineering and science / v.13, no.4, 2013 , pp. 233-239 More about this Journal
Abstract
This paper proposes an accurate approach for predicting transferred power from a noise source to integrated circuits based on the characteristics of the power transfer network. A power delivery trace on a package and a printed circuit board are designed to transmit power from an external source to integrated circuits. The power is demonstrated between an injection terminal on the edge of the printed circuit board and integrated circuits, and the power transfer function of the power distribution network is derived. A two-tier calibration is applied to the test, and scattering parameters of the network are measured for the calculation of the power transfer function. After testing to obtain the indispensable parameters, the real received and tolerable power of the integrated circuits can be easily achieved. Our proposed estimation method is an enhancement of the existing the International Electrotechnical Commission standard for precise prediction of the electromagnetic immunity of integrated circuits.
Keywords
Electromagnetic Immunity; Integrated Circuits; Power Distribution Network; Power Transfer Function;
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Times Cited By KSCI : 1  (Citation Analysis)
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1 M. Ramdani, E. Sicard, A. Boyer, S. Ben Dhia, J. J. Whalen, T. H. Hubing, M. Coenen, and O. Wada, "The electromagnetic compatibility of integrated circuits: past, present, and future," IEEE Transactions on Electromagnetic Compatibility, vol. 51, no. 1, pp. 78-100, Feb. 2009.   DOI   ScienceOn
2 Integrated Circuits, Measurement of Electromagnetic Immunity, 150 kHz 1 GHz, Part 4: Direct RF Power Injection Method, International Electrotechnical Commission Standard IEC 62132-4, 2006.
3 Integrated Circuits, Measurement of Electromagnetic Immunity, 150 kHz 1 GHz, Part 3: Bulk Current Injection Method, International Electrotechnical Commission Standard IEC 62132-3, 2006.
4 B. Pu, T. Kim, S. J. Kim, S. Y. Kim, and W. Nah, "Modeling and prediction of electromagnetic immunity for integrated circuits," Journal of Electromagnetic Engineering and Science, vol. 13, no. 1, pp. 54-61, Mar. 2013.   과학기술학회마을   DOI   ScienceOn
5 D. M. Pozar, Microwave Engineering, 3rd ed. New York, NY: John Wiley & Sons, 2005.
6 D. M. Pozar, Microwave and RF Design of Wireless Systems. New York, NY: John Wiley & Sons, 2001.
7 M. Frick, R. Weigel, and R. Eidher, "A method to determine the injected real power into an IC Pin in case of a conducted immunity EMC test," in Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Rome, Italy, 2011, pp. 850-854.
8 I. Chahine, M. Kadi, E. Gaboriaud, A. Louis, and B. Mazari, "Characterization and modeling of the susceptibility of integrated circuits to conducted electromagnetic disturbances up to 1 GHz," IEEE Transactions on Electromagnetic Compatibility, vol. 50, no. 2, pp. 285-293, May 2008.   DOI   ScienceOn
9 A. Boyer, B. Li, S. Ben Dhia, C. Lemoine, and B. Vrignon, "Development of an immunity model of a phase-locked loop," in Proceedings of the Asia-Pacific Symposium on Electromagnetic Compatibility, Jeju Island, Korea, 2011.
10 B. Pu, J. J. Lee, S. K. Kwak, S. Y. Kim, and W. Nah, "Electromagnetic susceptibility analysis of ICs using DPI method with consideration of PDN," in Proceedings of the Asia-Pacific Symposium on Electromagnetic Compatibility, Singapore, 2012, pp. 77-80.
11 F. Lafon, F. De Daran, M. Ramdani, R. Perdriau, and M. Drissi, "Immunity modeling of integrated circuits: an industrial case," IEICE Transactions on Communications, vol. 93B, no. 7, pp. 1723-1730. Jul. 2010.
12 A. Alaeldine, R. Perdriau, M. Ramdani, J. Levant, and M. Drissi, "A direct power injection model for immunity prediction in integrated circuits," IEEE Transactions on Electromagnetic Compatibility, vol. 50, no. 1, pp. 52-62, Feb. 2008.   DOI   ScienceOn
13 S. Baffreau and E. Sicard, "On the modeling of microcontrollers immunity to radio frequency interference," in Proceedings of EMC COMPO International Workshop on Electromagnetic Compatibility of Integrated Circuits, Toulouse, France, 2002.