• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• 정보처리학회논문지B
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• 제9B권2호
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• pp.245-254
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• 2002

머신비전을 이용한 IC 패키지 마킹검사 시스템은 입력영상으로부터 검사할 요소들의 위치를 식별하고, 추출된 요소들을 학습된 표준 패턴과 비교하여 마킹의 불량 여부를 판단한다. 본 논문에서는 검사 대상 IC 패키지의 위치 판별, 마킹문자 추출, 핀원딤플 검출과 같은 일련의 작업들에 적합한 적응적 다단계 이진화 방법과 마킹문자의 국소적인 오류검출은 물론 잡영에 강건한 정합단위의 동적 선택 방법을 제안한다. 제안하는 이진화 방법은 이진화 대상 영역과 명도 값의 범위를 제한하여 Otsu의 이진화 알고리즘을 적용함으로써 특정 응용에 적응적인 이진화가 가능하다. 정합단위의 동적 선택 방법은 문자추출 및 배치분석에 대한 결과에 따라 정합단위를 선택한다. 그러므로 문자추출 및 배치분석 과정에서 발생하는 예기치 못한 부적절한 상황에서도 가능한 범위내에서 최소의 정합단위를 선택할 수 있다. 제안된 방법을 구현하여 8종의 IC 패키지, 총 280개의 영상에 대하여 실험한 결과, IC 패키지와 핀원딤플의 검출율은 100%였으며, 마킹상태에 대한 판정은 98.8%의 정확도를 나타내어 제안된 방법이 효과적임을 확인할 수 있었다.

• 대한전기학회논문지:전기기기및에너지변환시스템부문B
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• 제53권10호
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• pp.597-601
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• 2004

A high bandwidth watt-converter, based on an inexpensive, commercially available, standard IC package, is described that covers a frequency ranges from DC to 100 kHz. The new resistive shunt for a wide-band frequency current measurement of the watt-converter was developed. The converter will use application in accurate power measurement under distorted and high frequency conditions. The advantages of the proposed watt-converter are its simplicity, low cost and fast response time.

• 마이크로전자및패키징학회지
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• 제18권2호
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• pp.35-41
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• 2011

Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 하계학술대회 논문집 D
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• pp.2332-2334
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• 2004

A high bandwidth watt-converter, based on an inexpensive, commercially available, standard IC package, is described that covers a frequency ranges from DC to 100 kHz. The new resistive shunt for a wide-band frequency current measurement of the watt-converter was developed. The converter will use application in accurate power measurement under distorted and high frequency conditions. The advantages of the watt-converter are its simplicity, low cost and fast response time.

• 센서학회지
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• 제8권1호
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• pp.38-44
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• 1999

본 논문에서는 8빔 압저항형 가속도센서에서 하나 이상의 빔이 파손되는 대부분의 경우에 대하여 에러신호를 검출할 수 있는 자기진단회로를 구현하고, 이를 PSPICE를 사용하여 시뮬레이션으로 그 기능을 확인하였다. 또한 현재 상용으로 나오는 KA 324 증폭기의 레이아웃을 사용하여 자기진단회로를 표준 바이폴라(bipolar)공정을 이용하여 IC칩으로 제조하고, 24핀 플라스틱 패키지 한 후 자기진단 특성을 조사하였다. 이때, 측정된 회로의 자기진단 특성을 시뮬레이션 결과와 비교하였다.

• Journal of electromagnetic engineering and science
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• 제13권4호
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• pp.233-239
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• 2013

This paper proposes an accurate approach for predicting transferred power from a noise source to integrated circuits based on the characteristics of the power transfer network. A power delivery trace on a package and a printed circuit board are designed to transmit power from an external source to integrated circuits. The power is demonstrated between an injection terminal on the edge of the printed circuit board and integrated circuits, and the power transfer function of the power distribution network is derived. A two-tier calibration is applied to the test, and scattering parameters of the network are measured for the calculation of the power transfer function. After testing to obtain the indispensable parameters, the real received and tolerable power of the integrated circuits can be easily achieved. Our proposed estimation method is an enhancement of the existing the International Electrotechnical Commission standard for precise prediction of the electromagnetic immunity of integrated circuits.

• 대한전자공학회논문지SD
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• 제47권9호
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• pp.14-23
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• 2010

본 논문에서는 유럽에서 사용되는 이동형 디지털 방송인 DVB-T/H 신호를 수신 및 신호처리 가능한 DVB-T/H SiP를 제작하였다. DVB-T/H SiP는 칩이 PCB 내부에 삽입될 수 있는 IC-임베디드 PCB 공정을 적용하여 설계되었다. DVB-T/H SiP에 삽입된 DVB-T/H IC는 신호를 수신하는 RF 칩과 어플리케이션 프로세서에서 활용할 수 있도록 수신된 신호를 변환하는 디지털 칩 2개를 원칩화한 모바일 TV용 SoC 이다. SiP 에는 DVB-T/H IC를 동작하기 위해 클럭소스로써 38.4MHz의 크리스탈을 이용하고, 전원공급을 위해 3MHz로 동작하는 DC-DC Converter와 LDO를 사용하였다. 제작된 DVB-T/H SiP는 $8mm{\times}8mm$ 의 4 Layer로 구성되었으며, IC-임베디드 PCB 기술을 사용하여 DVB-T/H IC는 2층과 3층에 배치시켰다. 시뮬레이션 결과 Ground Plane과 비아의 확보로 RF 신호선의 감도가 개선되었으며 SiP로 제작하는 경우에 Power 전달선에 존재하는 캐패시터와 인덕터의 조정이 필수적임을 확인하였다. 제작된 DVB-T/H SiP의 전력 소모는 평균 297mW이며 전력 효율은 87%로써 기존 모듈과 동등한 수준으로 구현되었고, 크기는 기존 모듈과 비교하여 70% 이상 감소하였다. 그러나 기존 모듈 대비평균 3.8dB의 수신 감도 하락이 나타났다. 이는 SiP에 존재하는 DC-DC Converter의 노이즈로 인한 2.8dB의 신호 감도 저하에 기인한 것이다.

• Journal of Nutrition and Health
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• 제30권6호
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• pp.679-689
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• 1997

Nutrition label (NL) on the package of processed food provides consumers with a reliable and consistent source of information . It has been considered as a useful aid for food selection and a potent educational tool for nutrition in daily life. Since current nutrition labeling regulation in Korea does not define a format for presenting nutrition information a wide variety of NL format exists in the markers created by individual manufacturers. Development of standard NL format and its registration remain to be the work for the professionals and government officials. However the acceptance and evaluation of NL by the consumers is a very important and necessary process in the development of NL formats. In this study four different formats A, B, C, D were formulated based on currently circulating labels and new U.S.NL. Subjects used for evaluation of these formats were middle -aged highly educated housewives, who and the potential users of NL. Major parameters observed through the questionnare were their nutritional knowledge of RDA, ability of IC(Information Comparison) and CA (Comprehension and Application of informed nutrient contents), as well as their preference to the different formats. The results are summarized as follows. 1) Of the 178 subjects , 89.9% of the middleaged housewives were college graduates. Their nutrition knowledge of RDA were relatively satisfactory showing over 80% correlation on the basic concepts and unit while for numerical value less than 50% correct answer. 2) IC test scores were significantly different among the formats showing the highest values for format A and B which are presented as absolute value and % RDA, respectively. Format C presented as serving size(number of products) showed the lowest score. CA scores were also significantly different, though the increased load of information did not facilitate to increase the consumers comprehension. 3) RDA knowledge test scores and the scores of IA and CA were correlated in format A and D but not in format B and C suggesting % RDA presentation would be more acceptable to the less educated group. 4) For the preference in the aspects of easiness and time-saving format A was the best one then format D supporting the result of IC and CA test. The results of the present study indicate the most useful and preferred format is the simplest format presented as absolute value without RDA, . The secondly preferred format is the new NL format of the US with much information .