• 대한치과의사협회지
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• 제15권12호
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• pp.969-974
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• 1977

• 보존과학회지
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• 제26권1호
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• pp.13-24
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• 2010

부여 능산리사지 출토 누금세공 유물 4점을 대상으로 기초적인 재질특성과 미세조직을 분석하여 각각에 대한 제작방법을 살펴보았다. 이 결과 모두 22.7K 이상의 비교적 높은 순도를 나타냈으며 일부 유물에서는 금과 은이 일정 비율로 합금된 상태를 보였다. 표면을 장식한 금선은 0.2~0.8mm 두께를 보이고 다양한 단면형태를 나타냈다. 금입자는 2개 또는 3개가 접합되어 부착된 상태로, 0.3~0.8mm의 직경을 나타냈다. 금세선과 금입자의 표면 접합부에서는 땜의 잔재가 관찰되었으며 성분분석을 통해 금 땜의 사용 가능성을 확인하였다. 또한 진사(HgS), 먹과 같은 안료를 감장하여 표면을 장식한 모습도 보였다.

• Journal of Welding and Joining
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• 제20권4호
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• pp.505-509
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• 2002

Pb is considered to be eliminated from solder, due to its toxicity. However, melting temperatures of most Pb-free solders are known higher than that of Sn37Pb. Therefore, there is a difficulty to apply Pb-free solders to electronic industry. Since Sn3Ag8Bi5In has relatively lower melting range as $188~200^{\circ}C$, on this study. Wettability and soldering characteristics of Sn3Ag8Bi5In solder in BGA were investigated to solve for what kind of problem. Zero cross time, wetting time, and equilibrium force of Sn3Ag8Bi5In solder for Cu and plated Cu such as Sn, Ni, and Au/Ni-plated on Cu were estimated. Plated Sn on Cu showed best wettability for zero cross time, wetting time and equilibrium farce. Shear strength of the reflowed joint with Sn3Ag8Bi5In ball in BGA was investigated. Diameter of the ball was 0.5mm, UBM(under bump metallurgy) was $Au(0.5\mu\textrm{m})Ni(5\mu\textrm{m})/Cu(18\mu\textrm{m})$ and flux was RMA type. For the reflow soldering, the peak reflow temperature was changed in the range of $220~250^{\circ}C$, and conveyor speed was 0.6m/min.. The shear strength of Sn3Ag8Bi5In ball showed similar level as those of Sn37Pb. The soldered balls are aged at $110^{\circ}C$ for 36days and their shear strengths were evaluated. The shear strength of Sn3Ag8Bi5In ball was increased from 480gf to 580gf by aging for 5 days.

• 한국전기전자재료학회논문지
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• 제29권4호
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• pp.237-240
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• 2016

The improvement of irradiation intensity and irradiation uniformity is essential for large area and high power UVA light source application. In this study, large number of chips bonded by micro soldering technique were driven by low current, and current limiting diodes were configured to supply constant current to parallel circuits consisting of large number of series strings. The dimension of light source module circuit board was $350{\times}90mm^2$ and 16,650 numbers of 385 nm flip chip LEDs were used with a configuration of 90 parallel and 185 series strings. The space between LEDs in parallel and series strings were maintained at 1.9 mm and 1.0 mm distance, respectively. The size of the flip chip was $750{\times}750{\mu}m^2$ were used with contact pads of $260{\times}669{\mu}m^2$ size, and SAC (96.5 Sn/3.0 Ag/0.5 Cu) solder was used for flip chip bonding. The fabricated light source module with 7.5 m A supply current showed temperature rise of $66^{\circ}C$, whereas irradiation was measured to be $300mW/cm^2$. Inaddition, 0.23% variation of the constant current in each series string was demonstrated.

• The Journal of Advanced Prosthodontics
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• 제6권1호
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• pp.39-45
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• 2014

PURPOSE. The aim of the present study was to evaluate the accuracy of three techniques for correction of cast implant bars. MATERIALS AND METHODS. Thirty cast implant bars were fabricated on a metal master model. All cast implant bars were sectioned at 5 mm from the left gold cylinder using a disk of 0.3 mm thickness, and then each group of ten specimens was corrected by gas-air torch soldering, laser welding, and additional casting technique. Three dimensional evaluation including horizontal, vertical, and twisting measurements was based on measurement and comparison of (1) gap distances of the right abutment replica-gold cylinder interface at buccal, distal, lingual side, (2) changes of bar length, and (3) axis angle changes of the right gold cylinders at the step of the post-correction measurements on the three groups with a contact and non-contact coordinate measuring machine. One-way analysis of variance (ANOVA) and paired t-test were performed at the significance level of 5%. RESULTS. Gap distances of the cast implant bars after correction procedure showed no statistically significant difference among groups. Changes in bar length between pre-casting and post-correction measurement were statistically significance among groups. Axis angle changes of the right gold cylinders were not statistically significance among groups. CONCLUSION. There was no statistical significance among three techniques in horizontal, vertical and axial errors. But, gas-air torch soldering technique showed the most consistent and accurate trend in the correction of implant bar error. However, Laser welding technique, showed a large mean and standard deviation in vertical and twisting measurement and might be technique-sensitive method.

• 한국재료학회지
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• 제28권2호
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• pp.89-94
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• 2018

The properties of 18 K red gold solder alloys were investigated by changing the content of In up to 10.0 wt% in order to replace the hazardous Cd element. Cupellation and energy dispersive X-ray spectroscopy (EDS) were used to check the composition of each alloy, and FE-SEM and UV-VIS-NIR-Colormeter were employed for microstructure and color characterization. The melting temperature, hardness, and wetting angle of the samples were determined by TGA-DTA, the Vickers hardness tester, and the Wetting angle tester. The cupellation result confirmed that all the samples had 18K above 75.0wt%-Au. EDS results showed that Cu and In elements were alloyed with the intended composition without segregation. The microstructure results showed that the amount of In increased, and the grain size became smaller. The color analysis revealed that the proposed solders up to 10.0 wt% In showed a color similar to the reference 18 K substrate like the 10.0 wt% Cd solder with a color difference of less than 7.50. TGA-DTA results confirmed that when more than 5.0 wt% of In was added, the melting temperature decreased enough for the soldering process. The Vickers hardness result revealed that more than 5.0 wt% In solder alloys had greater hardness than 10.0 wt% Cd solder, which suggested that it was more favorable in making a wire type solder. Moreover, all the In solders showed a lower wetting angle than the 10.0 wt% Cd solder. Our results suggested that the In alloyed 18 K red gold solders might replace the conventional 10.0 wt% Cd solder with appropriate properties for red gold jewelry soldering.

• 한국재료학회지
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• 제15권8호
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• pp.536-542
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• 2005

Recently European Council(EU) published the RoHS(restriction of the use of certain hazardous substances in electrical and electronic equipment) which is prohibit the use of Pb, Hg, Cd, $Cr^{+6}$, PBB or PBDE in the electrical and electronic equipments. So EU member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain 6 hazardous substances. The one of the most important in electronics manufacturing process is soldering. Soldering process use the chemical substances which are applied in fluxing and cleaning processes and it can generate the malfunction of electronics caused by corrosion in the fields conditions. Therefore this study researched on the polarization and Tafel properties of Sn40Pb and Sn3.0Ag0.5Cu(SAC) solder based on the electrochemical theory. We prepared SnPb specimens which was aged in $150^{\circ}C,\;180^{\circ}C$ for 15 minutes ana Sn3.0Ag0.5Cu specimens that was aged in $180^{\circ}C,\;220^{\circ}C$ for 10 minutes. Experimental polarization curves were measured in distilled ionized water and $3.5 wt\%$, 1 mole NaCl electrolyte of $40^{\circ}C$, pH 7.5. Ag/AgCl and graphite were utilized by reference and counter electrode, respectively. To observe the electrochemical reaction, polarization test was conducted from -250 mV to +250 mV. From the polarization curves that were composed of anodic and cathodic curves, we obtained Tafel slop, reversible electrode potential(Ecorr) and exchange current density(Icorr). In these results, corrosion rate for two specimen were compared Sn3.0Ag0.5Cu with SnPb solders

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.54-56
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• 2005

Ultrasonic soldering using of Si-wafer to FR-4 PCB atroom temperature was investigated. Sn3.5Ag foil rolled $100{\mu}m$ was used for solder. The UBM of Si-die was Cu/ Ni/ Al from top to bottom and its thickness was $0.4{\mu}m$, $0.4{\mu}m$, $0.3{\mu}m$ respectively. Pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom and its thickness was $0.05{\mu}m$, $5{\mu}m$, $18{\mu}m$ respectively. The ultrasonic soldering time was changed from 0.5sec to 3.0sec and its power 1400W. As experimental result, reliable bond joint by ultrasonic at room temperature was obtained. The shear strength increased with soldering time up to 2.5 sec. That means at 2.5sec, the shear strength showed maximum rate of 65.23N. The strength decreased to 33.90N at 3.0 sec because the cracks generated along the intermetallic compound between Si-wafer and Sn-3.5mass%Ag solder. intermetallic compound produced by ultrasonic between the solder and the Si-die was $(Cu, Ni)_{6}Sn_{5}$ and the intermetallic compound between solder and pad on FR-4 was $(Ni, Cu)_{3}Sn_{4}$.

• 한국화재소방학회논문지
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• 제30권5호
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• pp.26-35
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• 2016

스프링클러 설비는 화재 발생 시 화재를 초기에 제어 및 진압하는 설비로서 어떠한 화재 분위기에서도 스프링클러 헤드의 작동온도에서 정상적인 동작을 하여야 한다. 그러나 최근 화재성장속도가 느린 화재 발생 장소에서 일부 조기반응형 스프링클러 헤드가 정상적인 동작을 하지 않을 수 있다는 문제가 제기되고 있다. 이에 본 논문에서는 공동주택 침실규모의 모형실험 및 캐비넷형 버너를 이용하여 화재성장속도가 느린 조건을 형성하고 실제 현장에서 배관 내에 가해지는 최소압력인 0.2MPa 이상의 가압수를 공급하여 실험을 진행하였다. 실험결과 국내에서 사용되고 있는 과반수 이상의 플러쉬형 조기반응형 스프링클러 헤드에서 Cold Soldering 현상이 발생되면서 불완전하게 개방되는 것이 확인되었다. 이러한 현상은 화재 조기진압 및 제어에 실패하여 화재확산 및 인명피해의 원인이 될 수 있으므로 추가적인 연구를 통해 국내 형식승인 및 제품검사기준의 보완의 필요할 것으로 판단된다.

• 한국표면공학회지
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• 제39권2호
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• pp.57-63
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• 2006

In this study, In-base solder was applied to the interface between $Bi_2Sr_2Ca_1Cu_2O_x(Bi_{2212})$ superconductor and Cu-Ni shunt metal at the temperature lower than $150^{\circ}C$. Most of the cases, $Bi_{2212}$ superconductor was precoated with Ag by electroplating in order to improve the contact properties of the solder layer. When the superconductor was directly soldered on to the superconductor, the solder was easily separated without external force. The shear strength of the contact between superconductor and shunt metal increased from 69.2 kgf to 74.4 kgf and 80.1 kgf, as the current density of the Ag electroplating was changed from 63 mA to 96 mA and 126 mA, respectively. The contact strength also increased to 49.9 kgf and 69.2 kgf when thickness of the electroplated Ag layer increased to $5{\mu}m$ and $10{\mu}m$, reapectively.