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Influence of Ag Precoating of $Bi_{2212}$ Superconductor-In Base Solder Soldering  

Jang Ji-Hoon (Korea University of Technology and Education, Materials Science Engineering)
Kim Sang-Hyun (Korea University of Technology and Education, Materials Science Engineering)
Shin Seung-Yong (Korea University of Technology and Education, Materials Science Engineering)
Lee Yong-Chul (Woorisojae Company)
Kim Chan-Joong (Korea Atomic Energy Research Institute)
Hyun Ok-Bae (Korea Electric Power Research Institute)
Park Hae-Woong (Korea University of Technology and Education, Materials Science Engineering)
Publication Information
Journal of the Korean institute of surface engineering / v.39, no.2, 2006 , pp. 57-63 More about this Journal
Abstract
In this study, In-base solder was applied to the interface between $Bi_2Sr_2Ca_1Cu_2O_x(Bi_{2212})$ superconductor and Cu-Ni shunt metal at the temperature lower than $150^{\circ}C$. Most of the cases, $Bi_{2212}$ superconductor was precoated with Ag by electroplating in order to improve the contact properties of the solder layer. When the superconductor was directly soldered on to the superconductor, the solder was easily separated without external force. The shear strength of the contact between superconductor and shunt metal increased from 69.2 kgf to 74.4 kgf and 80.1 kgf, as the current density of the Ag electroplating was changed from 63 mA to 96 mA and 126 mA, respectively. The contact strength also increased to 49.9 kgf and 69.2 kgf when thickness of the electroplated Ag layer increased to $5{\mu}m$ and $10{\mu}m$, reapectively.
Keywords
PTC; Superconductor; Soldering; Electroplating; Solder; $Bi_{2212}$; In; Ag; Precooling;
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