• 한국레이저가공학회:학술대회논문집
• /
• 한국레이저가공학회 1998년도 춘계학술발표대회 초록개요집
• /
• pp.37-39
• /
• 1998

• 대한치과보철학회지
• /
• 제8권1호
• /
• pp.15-19
• /
• 1968

To compare on the accuracy of bridge made by various soldering technics, four unit bridges were made on a blass original model. They were soldered to each other in the following three ways : In Group I, one central gap between two pieces of pre-soldered abutments and adjacent pontics were soldered at the final step. In Group II, the two gaps between one piece of pre-soldered pontics and two abutments were soldered at the final step. In Group III. the three gaps between two abutments and two ponitcs were soldered at the same time. Misfitting of those bridges were compared by measuring the spaces created between the retainer margins and the shoulders of preparated original model with a micrometer microscope. The author obtained following results : In the final step, the more number of the soldered gap increased, the more accuracy of the bridge decreased.

• 대한기계학회논문집A
• /
• 제28권6호
• /
• pp.709-716
• /
• 2004

In order to prevent the interface delamination of an plastic IC package in the infrared (IR) soldering process, we tried to reduce stress by parameterization, sensitivity analysis and unconstraint optimization. The design variables of dimensions and material properties are determined among all the possible variables from the parametric study. Their optimized values are determined by applying the unconstraint optimization to the parameterized IC package. The maximum von-Mises stress value decreases greatly by optimum design.

• Journal of Mechanical Science and Technology
• /
• 제18권9호
• /
• pp.1572-1581
• /
• 2004

The purposes of the paper are to apply the axiomatic design methodology to the design of PBGA package with polyimide coating under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by stress analysis. The analysis model is a 256-pin perimeter Plastic Ball Grid Array (PBGA) package with the polyimide coating surrounding chip and above surface of BT-substrate. The polyimide coating is suggested to depress the maximum stresses occurred on the stress concentration positions. The axiomatic design methodology is proved to be useful to find the more reliable design conditions for PBGA package. Finally, the optimal values of design variables to depress the stress in the PBGA package are obtained.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2004년도 추계학술발표대회 개요집
• /
• pp.79-81
• /
• 2004

In this study EB(Electron Beam) welder was modified to apply Ef welder to micro-joining for soldering and micro-brazing. The power and beam current of EB welder is 6kW, 100mA(60kV) and the minimum current was 1mA. The minimum current of EB welder was modified to decrease the amount of beam current to 0.0lmA and the monitoring system to observe materials was made up. The system is developed including teaching function for generating patterns. The control system and CAD/CAM software for EB direct writing was developed and the deflection beam was controlled without moving workpieces. the possibility of applying EB welder to micro-joining for soldering and brazing was studied through this experiments.

• Journal of Welding and Joining
• /
• 제21권4호
• /
• pp.87-91
• /
• 2003

Effects of the circular and non-circular pad shapes on self-alignment in BGA soldering are predicted using Surface Evolver, and the calculated results are compared with experimental data. While the pad shape has minor effects on self-alignment in the vertical direction, self-alignment in the lateral direction depends on the pad direction and length ratio of the non-circular pad. Larger restoring force is obtained in the minor-axis direction than the major-axis direction, which suggests a possibility of reducing misalignment in the specific direction. The restoring force of the circular pad is between those of the non-circular pad in the major and minor-axis directions. The calculated results of Surface Evolver show reasonably good agreements with experimental data using the shear loading system.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2011년도 제42회 하계학술대회
• /
• pp.1304-1305
• /
• 2011

In this study, tabbing cell samples in the soft touch method are compared samples according to soldering voltage conditions. Series resistance and power loss is measured by two measurement method. As a result, probe measurement method was found optimized soldering voltage optimized according to voltage condition and clamp measurement method was not difference. The purpose of this paper is to analysis the principle of measurement method.

• 한국전산유체공학회지
• /
• 제8권4호
• /
• pp.41-49
• /
• 2003

This study presents a numerical model to analyze dynamic thermal behavior of a hot chuck designed for flip-chip bonders. The hot chuck of concern is a heater which has been specifically developed for accomplishing high-speed and ultra-precision soldering. The characteristic features are radiative heat source and the heating tool made of a material of high thermal diffusivity. A physical modeling has been conducted for the network of heat transport. A simplified finite volume model is deviced to simulate time-dependent thermal behavior of the heating tool on which soldering is achieved. The reliability of the proposed numerical model is verified experimentally. A series of numerical tests illustrate the usefulness of the numerical model in design analysis.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
• /
• pp.791-797
• /
• 2002

This paper introduces the partial melting process for solder application and characterization of its feasibility using Sn-Ag, and Sn-Cu solder alloys. ill order to show that the liquid phase in the semi-liquid state maintains the similar wettability as single-phase liquid, the wetting balance tests are conducted with varying temperatures and compositions. Also, as a new soldering technology, the microstructural and mechanical test were investigated. The results from this research indicate that the partial melting can yield satisfactory sider joints as long as the liquid phase acquires sufficient chemical activity. At a condition where the partial melting is effective, a direct correlation between the wettability and the surface tension is found to exist.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
• /
• pp.469-474
• /
• 2002

Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bumps reflowed by laser was superior than the solder bumps reflowed by hot air, and the microstructure inside the solder bumps reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn$_4$ layer and remnant Au element. Needle-like AuSn$_4$ grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni$_3$Sn$_4$ intermetallic compound was found at the interface of solder bump reflowed by hot air, AuSn$_4$ particles distributed inside the whole solder bump randomly. It is the combination effect of the continuous AuSn$_4$ layer and finer eutectic microstructure inside the solder bump reflowed by laser that resulted in higher shear strength.