A Numerical Model to Analyze Thermal Behavior of a Radiative Heater Disigned for Flip-Chip Bonders |
Lee S. H
(금오공과대학교 대학원 기계공학과)
Kwak H. S (금오공과대학교 기계공학부) Han C. S (기계연구원) Ryu D. H ((주)탑엔지니어링 기술연구소) |
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