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A Numerical Model to Analyze Thermal Behavior of a Radiative Heater Disigned for Flip-Chip Bonders  

Lee S. H (금오공과대학교 대학원 기계공학과)
Kwak H. S (금오공과대학교 기계공학부)
Han C. S (기계연구원)
Ryu D. H ((주)탑엔지니어링 기술연구소)
Publication Information
Journal of computational fluids engineering / v.8, no.4, 2003 , pp. 41-49 More about this Journal
Abstract
This study presents a numerical model to analyze dynamic thermal behavior of a hot chuck designed for flip-chip bonders. The hot chuck of concern is a heater which has been specifically developed for accomplishing high-speed and ultra-precision soldering. The characteristic features are radiative heat source and the heating tool made of a material of high thermal diffusivity. A physical modeling has been conducted for the network of heat transport. A simplified finite volume model is deviced to simulate time-dependent thermal behavior of the heating tool on which soldering is achieved. The reliability of the proposed numerical model is verified experimentally. A series of numerical tests illustrate the usefulness of the numerical model in design analysis.
Keywords
Flip-Chip Bonder; Radiative Heater; Heating Tool of High Conductivity; Thermal Modeling; Natural Convection; Thermal Plume;
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