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Influence of Pad Shape on Self-Alignment in BGA Soldering  

안도현 (한국과학기술원 기계공학과)
정용진 (한국과학기술원 기계공학과)
유중돈 (한국과학기술원 기계공학과)
김용석 (홍익대학교 재료공학과)
Publication Information
Journal of Welding and Joining / v.21, no.4, 2003 , pp. 87-91 More about this Journal
Abstract
Effects of the circular and non-circular pad shapes on self-alignment in BGA soldering are predicted using Surface Evolver, and the calculated results are compared with experimental data. While the pad shape has minor effects on self-alignment in the vertical direction, self-alignment in the lateral direction depends on the pad direction and length ratio of the non-circular pad. Larger restoring force is obtained in the minor-axis direction than the major-axis direction, which suggests a possibility of reducing misalignment in the specific direction. The restoring force of the circular pad is between those of the non-circular pad in the major and minor-axis directions. The calculated results of Surface Evolver show reasonably good agreements with experimental data using the shear loading system.
Keywords
Self-aligning effect; Circular and non-circular pad; Surface Evolver; Shear loading system;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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