Influence of Pad Shape on Self-Alignment in BGA Soldering
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안도현
(한국과학기술원 기계공학과)
정용진 (한국과학기술원 기계공학과) 유중돈 (한국과학기술원 기계공학과) 김용석 (홍익대학교 재료공학과) |
1 |
Quasi-static modeling of the self alignment mechanism in flip-chip soldering, part I - single solder joining
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DOI |
2 |
Prediction of solder joint geometries in array-type interconnects
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DOI ScienceOn |
3 |
Misaligned flip-chip solder joints: prediction and experimental determination of force-displacement curves
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DOI ScienceOn |
4 |
Multiple-chip precise self-aligned assembly for hybrid integrated optical modules using Au-Sn solder bumps
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DOI |
5 |
The Surface Evolver
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DOI |
6 |
An overview of solder bump shape prediction algorithms with validations
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DOI ScienceOn |
7 |
Analytical derivation of the self alignment motion of flip chip soldered components
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DOI |
8 |
Modeling of self-aligning effect in flip chip soldering
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과학기술학회마을 |
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