대한용접접합학회:학술대회논문집 (Proceedings of the KWS Conference)
- 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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- Pages.469-474
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- 2002
EXPERIMENTAL STUDY ON LASER AND HOT AIR REFLOW SOLDERING OF
- Tian, Yanhong (National Key Laboratory of Advanced Welding Production Technology) ;
- Wang, Chunqing (National Key Laboratory of Advanced Welding Production Technology)
- 발행 : 2002.10.01
초록
Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bumps reflowed by laser was superior than the solder bumps reflowed by hot air, and the microstructure inside the solder bumps reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn