Browse > Article

Application of the Axiomatic Design Methodology to the Design of PBGA Package with Polyimide Coating Layer  

Yang, Ji-Hyuck (Hyundai Motor Company)
Lee, Kang-Yong (School of Mechanical Engineering, Yonsei University)
Dong, C. Y. (School of Mechanical Engineering, Yonsei University)
Publication Information
Journal of Mechanical Science and Technology / v.18, no.9, 2004 , pp. 1572-1581 More about this Journal
Abstract
The purposes of the paper are to apply the axiomatic design methodology to the design of PBGA package with polyimide coating under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by stress analysis. The analysis model is a 256-pin perimeter Plastic Ball Grid Array (PBGA) package with the polyimide coating surrounding chip and above surface of BT-substrate. The polyimide coating is suggested to depress the maximum stresses occurred on the stress concentration positions. The axiomatic design methodology is proved to be useful to find the more reliable design conditions for PBGA package. Finally, the optimal values of design variables to depress the stress in the PBGA package are obtained.
Keywords
BGA Package; IR Soldering; Axiomatic Design; Polyimide Coating; Stress;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 Gunasekera, J. S. and Ali, A. F., 1995, 'A Three-Step Approach to Designing a Metal-Forming Process,' JOM, Vol. 47, pp.22-25
2 Hong, B. Z. and Su, L. S., 1998, 'Popcorning in PBGA Packages During IR Reflow Soldering,' Proc. 48th Electronic Components and Technology Conference, ECTC 98, Seattle, pp. 503-510
3 Jung, W., Lau, J. H. and Pao, Y. H., 1997, 'Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints,' ASME Trans. J. of Electronic Packaging, Vol. 119, pp.163-170   ScienceOn
4 Kelly, G., 1999, 'The Simulation of Thermomechanical Induced Stress in Plastic Encapsulated IC Packages,' Dordrecht, The Netherlands, Kluwer
5 Lee, K. Y. and Yang, J. H., 1999, 'Hygrothermal Cracking Analysis of Plastic IC Package with Po1yimide Coating Layer,' Transactions of KSME A, Vol. 23, No.9, pp. 1491-1498
6 Ahn, S. H. and Kwon, Y. S., 1995, 'Popcorn Phenomena in a Ball Grid Array Package,' IEEE Trans. on Components, Packaging, and Manufacturing Technology-Part B, Vol. 18, pp.491-495   DOI   ScienceOn
7 Pecht, M. G., 1999, 'Moisture Sensitivity Characterization of Build-Up Ball Grid Array Substrates,' IEEE Trans. on Advanced Packaging, Vol. 22, pp. 515-523   DOI
8 Mertol, A., 1995, 'Application of the Taguchi Method on the Robust Design of Molded 225 Plastic Ball Grid Array Packages,' IEEE Trans. on Components, Packaging, and Manufacturing Technology-Part B, Vol. 18, pp. 734-743   DOI   ScienceOn
9 Hwang, J. S., 1994, 'Reliability of BGA Solder Interconnections,' Electron. Eng. Times, pp. 81-85
10 Omi, S., Fujita, K., Tsuda, T. and Meade, T., 1991, 'Causes of Cracks in SMD and Type-Specific Remedies,' Proc. Electronic Components Conf., pp. 766-771   DOI
11 Mawer, A., Darveaux, R. and Petrucci, A. M., 1993, 'Calculation of Thermal Cycling and Application Fatigue Life of the Plastic Ball Grid Array (BGA) Package,' Proc. Int. Electron. Pkg. Conf., pp. 718-730
12 McCluskey, P., Munamarty, R. and Pecht, M., 1996, 'Popcorning in PBGA Packages During IR Reflow Soldering,' Proc. International Electronics Packaging Conference, Edina, pp.271-281
13 Takeuchi, E., Takeda, T. and Hirano, T., 1990, 'Effect of Combination Between Various Polyimide Coating Materials and Molding Compounds on the Reliability of Integrated Circuits (ICs),' Proc. Electronic Components Conf., pp.818-823   DOI
14 Mertol, A., 1997, 'Optimization of High Pin Count Cavity-Up Enhanced Plastic Ball Grid Array (EPBGA) Packages for Robust Design,' IEEE Trans. on Components, Packaging, and Manufacturing Technology-Part B, Vol. 20, pp.376-388   DOI   ScienceOn
15 Moore, T. D. and Jarvis, J. L., 2001, 'Failure Analysis and Stress Simulation in Small Multichip BGAs,' IEEE Trans. Advanced Packaging, Vol. 24, pp.216-223   DOI   ScienceOn
16 Moore, T. D. and Jarvis, J. L., 2001, 'Improved Reliability in Small Multichip Ball Grid Arrays,' Microelectronics Reliability, Vol. 41, pp.461-469   DOI   ScienceOn
17 Rajan, S. D., Nagaraj, B. and Mahalingam, M., 1992, 'A Shape Optimal Design Methodology for Packaging Design,' ASME Trans. J. of Electronic Packaging, Vol. 114, pp. 461-466
18 Romer, B. and Pape, H., 1989, 'Stress Effects of Package Parameters on 4MEGA DRAM with Fractional Factorial Designed Finite Element Analysis,' Proc. Electronic Components Conf., pp. 832-839   DOI
19 Shin, M. K., Hong, S. W. and Park, G. J., 2001, 'Axiomatic Design of the Motor-Driven Tilt/Telescopic Steering System for Safety and Vibration,' Proc. Instn. Mech. Engrs. Part D., Vol. 215, pp. 179-187   DOI   ScienceOn
20 Suh, N. P., 1990, 'The Principles of Design,' Oxford University Press, New York
21 Egan, E., Kelly, G. and Herard, L., 1999, 'PBGA Warpage and Stress Prediction for Efficient Creation of the Thermomechanical Design Space for Package-Level Reliability,' Proc. 49th Electronic Components and Technology Conference, ECTC 99, San Diego, pp. 1217-1223   DOI
22 Yang, J. H., Lee, K. Y., Lee, T. S. and Zhao, S. X., 2004, 'Fracture Analysis of Electronic IC Package,' KSME International Journal, Vol. 18, No.3, pp. 357-369   과학기술학회마을
23 ABAQUS User's Manual, Ver. 6.0, HKS Inc.
24 Aihara, T., Ito, S., Sasajima, H. and Oota, K., 2001, 'Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials,' ASME Trans. J. of Electronic Packaging, Vol. 123, pp. 88-94   DOI   ScienceOn