1 |
Gunasekera, J. S. and Ali, A. F., 1995, 'A Three-Step Approach to Designing a Metal-Forming Process,' JOM, Vol. 47, pp.22-25
|
2 |
Hong, B. Z. and Su, L. S., 1998, 'Popcorning in PBGA Packages During IR Reflow Soldering,' Proc. 48th Electronic Components and Technology Conference, ECTC 98, Seattle, pp. 503-510
|
3 |
Jung, W., Lau, J. H. and Pao, Y. H., 1997, 'Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints,' ASME Trans. J. of Electronic Packaging, Vol. 119, pp.163-170
ScienceOn
|
4 |
Kelly, G., 1999, 'The Simulation of Thermomechanical Induced Stress in Plastic Encapsulated IC Packages,' Dordrecht, The Netherlands, Kluwer
|
5 |
Lee, K. Y. and Yang, J. H., 1999, 'Hygrothermal Cracking Analysis of Plastic IC Package with Po1yimide Coating Layer,' Transactions of KSME A, Vol. 23, No.9, pp. 1491-1498
|
6 |
Ahn, S. H. and Kwon, Y. S., 1995, 'Popcorn Phenomena in a Ball Grid Array Package,' IEEE Trans. on Components, Packaging, and Manufacturing Technology-Part B, Vol. 18, pp.491-495
DOI
ScienceOn
|
7 |
Pecht, M. G., 1999, 'Moisture Sensitivity Characterization of Build-Up Ball Grid Array Substrates,' IEEE Trans. on Advanced Packaging, Vol. 22, pp. 515-523
DOI
|
8 |
Mertol, A., 1995, 'Application of the Taguchi Method on the Robust Design of Molded 225 Plastic Ball Grid Array Packages,' IEEE Trans. on Components, Packaging, and Manufacturing Technology-Part B, Vol. 18, pp. 734-743
DOI
ScienceOn
|
9 |
Hwang, J. S., 1994, 'Reliability of BGA Solder Interconnections,' Electron. Eng. Times, pp. 81-85
|
10 |
Omi, S., Fujita, K., Tsuda, T. and Meade, T., 1991, 'Causes of Cracks in SMD and Type-Specific Remedies,' Proc. Electronic Components Conf., pp. 766-771
DOI
|
11 |
Mawer, A., Darveaux, R. and Petrucci, A. M., 1993, 'Calculation of Thermal Cycling and Application Fatigue Life of the Plastic Ball Grid Array (BGA) Package,' Proc. Int. Electron. Pkg. Conf., pp. 718-730
|
12 |
McCluskey, P., Munamarty, R. and Pecht, M., 1996, 'Popcorning in PBGA Packages During IR Reflow Soldering,' Proc. International Electronics Packaging Conference, Edina, pp.271-281
|
13 |
Takeuchi, E., Takeda, T. and Hirano, T., 1990, 'Effect of Combination Between Various Polyimide Coating Materials and Molding Compounds on the Reliability of Integrated Circuits (ICs),' Proc. Electronic Components Conf., pp.818-823
DOI
|
14 |
Mertol, A., 1997, 'Optimization of High Pin Count Cavity-Up Enhanced Plastic Ball Grid Array (EPBGA) Packages for Robust Design,' IEEE Trans. on Components, Packaging, and Manufacturing Technology-Part B, Vol. 20, pp.376-388
DOI
ScienceOn
|
15 |
Moore, T. D. and Jarvis, J. L., 2001, 'Failure Analysis and Stress Simulation in Small Multichip BGAs,' IEEE Trans. Advanced Packaging, Vol. 24, pp.216-223
DOI
ScienceOn
|
16 |
Moore, T. D. and Jarvis, J. L., 2001, 'Improved Reliability in Small Multichip Ball Grid Arrays,' Microelectronics Reliability, Vol. 41, pp.461-469
DOI
ScienceOn
|
17 |
Rajan, S. D., Nagaraj, B. and Mahalingam, M., 1992, 'A Shape Optimal Design Methodology for Packaging Design,' ASME Trans. J. of Electronic Packaging, Vol. 114, pp. 461-466
|
18 |
Romer, B. and Pape, H., 1989, 'Stress Effects of Package Parameters on 4MEGA DRAM with Fractional Factorial Designed Finite Element Analysis,' Proc. Electronic Components Conf., pp. 832-839
DOI
|
19 |
Shin, M. K., Hong, S. W. and Park, G. J., 2001, 'Axiomatic Design of the Motor-Driven Tilt/Telescopic Steering System for Safety and Vibration,' Proc. Instn. Mech. Engrs. Part D., Vol. 215, pp. 179-187
DOI
ScienceOn
|
20 |
Suh, N. P., 1990, 'The Principles of Design,' Oxford University Press, New York
|
21 |
Egan, E., Kelly, G. and Herard, L., 1999, 'PBGA Warpage and Stress Prediction for Efficient Creation of the Thermomechanical Design Space for Package-Level Reliability,' Proc. 49th Electronic Components and Technology Conference, ECTC 99, San Diego, pp. 1217-1223
DOI
|
22 |
Yang, J. H., Lee, K. Y., Lee, T. S. and Zhao, S. X., 2004, 'Fracture Analysis of Electronic IC Package,' KSME International Journal, Vol. 18, No.3, pp. 357-369
과학기술학회마을
|
23 |
ABAQUS User's Manual, Ver. 6.0, HKS Inc.
|
24 |
Aihara, T., Ito, S., Sasajima, H. and Oota, K., 2001, 'Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials,' ASME Trans. J. of Electronic Packaging, Vol. 123, pp. 88-94
DOI
ScienceOn
|