• Title/Summary/Keyword: Sn agglomeration

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Fabrication of TiO2 Nanowires Using Vapor-Liquid-Solid Process for the Osseointegration (골융합을 위한 Vapor-Liquid-Solid 법을 이용한 TiO2 나노와이어의 합성)

  • Yun, Young-Sik;Kang, Eun-Hye;Yun, In-Sik;Kim, Yong-Oock;Yeo, Jong-Souk
    • Journal of the Korean Vacuum Society
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    • v.22 no.4
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    • pp.204-210
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    • 2013
  • In order to improve osseointegration for biomedical implants, it is crucial to understand the interactions between nanostructured surfaces and cells. In this study, $TiO_2$ nanowires were prepared via Vapor-Liquid-Solid (VLS) process with Sn as a metal catalyst in the tube furnace. Nanowires were grown with $N_2$ heat treatment with their size controlled by the agglomeration of Sn layers in various thicknesses. MC3T3-E1 (pre-osteoblast) were cultured on the $TiO_2$ nanowires for a week. Preliminary results of the cell culture showed that the cells adhere well on the $TiO_2$ nanowires.

$SnO_2$ Powder Preparation from Hydroxide and Oxalate and its Characterization (수산화물과 옥살산염의 열분해에 의한 $SnO_2$미분말의 합성)

  • 이종흔;박순자
    • Journal of the Korean Ceramic Society
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    • v.27 no.2
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    • pp.274-282
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    • 1990
  • SnO2 powder was prepared by hydroxide method and oxalate method. In hydroxide method, the pH dependence of powder characteristics was investigated by using buffer solution. As increasing the pH of solution, SnO2 powder size was decreased because nucleation rate was inctreased by more supersaturation of solution. Also, we found that the powder by our method has larger specific surface area in comaprison with other method. And the degree of agglomeration of precipitate with the change of precipitation temperature was investigated in oxalate method. The SnC2O4 was angular shape precipitate, and the size of the SnC2O4 was increased with the increase of precipitation temperature in methanol solvent.

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A Study on the Metallization Properties of Cu-Sn Alloy Layers Deposited by the Electroplating Method (전해도금법으로 증착한 Cu-Sn 합금막의 배선특성에 관한 연구)

  • Kim, Ju-Yeon;Bae, Gyu-Sik
    • Korean Journal of Materials Research
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    • v.12 no.3
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    • pp.225-230
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    • 2002
  • Sn was selected as an alloying element of Cu. The Cu-Sn thin layers were deposited on the Si substrates by the electroplating method and their properties were studied. By rapidly thermal annealing(RTA) up to 40$0^{\circ}C$ after electroplating, sheet resistance decreased and adhesion strength increased, but that trend was reversed at the 50$0^{\circ}C$ RTA. Cu-Sn particles grew dense and the surface was uniform up to 40$0^{\circ}C$, but at 50$0^{\circ}C$, empty area was introduced and the surface became rough owing to oxidation and particle coarsening and agglomeration. Deposited layer contained significant amount of Si, while pure Cu-Sn layer with the composition ratio of 90:10 was present only on the top surface. However, no significant change in the Cu composition within alloy layers occured by the RTA regardless of its temperature. This indicates that the Cu diffusion into the Si was suppressed by the presence of Sn.

Role of Different Oxide to Fuel Ratios in Solution Combustion Synthesis of SnO2 Nanoparticles

  • Chavan, Archana U.;Kim, Ji-Hye;Im, Ha-Ni;Song, Sun-Ju
    • Journal of the Korean Ceramic Society
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    • v.53 no.1
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    • pp.122-127
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    • 2016
  • Tin oxide ($SnO_2$) nanoparticles have been synthesized by solution combustion method using citric acid as a fuel. The oxide to fuel ratio has been varied to obtain ultrafine nanoparticles with better surface area; such particles will be useful in many applications. With this synthesis method, spherical particles are formed having a particle size in the range of 11-30 nm and BET surface area of ~ $24m^2/g$. The degree of agglomeration of $SnO_2$ nanoparticles has been calculated.

Morphology and Formation Mechanism of Sn Nanoparticles Synthesized by Modified Polyol Process at Various pH Values (변형 폴리올 공정에서 pH에 따라 합성된 Sn 나노입자의 형상 변화 및 형성기구)

  • Shin, Yong Moo;Lee, Jong-Hyun
    • Korean Journal of Materials Research
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    • v.24 no.11
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    • pp.578-584
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    • 2014
  • To synthesize Sn nanoparticles (NPs) less than 30 nm in diameter, a modified polyol process was conducted at room temperature using a reducing agent, and the effects of different pH values of the initial solutions on the morphology and size of the synthesized Sn NPs were analyzed. tin(II) 2-ethylhexanoate, diethylene glycol, sodium borohydride, polyvinyl pyrrolidone (PVP), and sodium hydroxide were used as a precursor, reaction medium, reducing agent, capping agent, and pH adjusting agent, respectively. It was found by transmission electron microscopy that the morphology of the synthesized Sn NPs varied according to the pH of the initial solution. Moreover, while the size decreased to 11.32 nm with an increase up to 11.66 of the pH value, the size increased rapidly to 39.25 nm with an increase to 12.69. The pH increase up to 11.66 dominantly promoted generation of electrons and increased the amount of initial nucleation in the solution, finally inducing the reduced-size of the Sn particles. However, the additional increase of pH dominantly induced a decrease of PVP by neutralization, which resulted in acceleration of the agglomeration by collisions between particles.

Hydrothermal Synthesis of Indium Tin Oxide Nanoparticles without Chlorine Contamination

  • Wang, Hai Wen;Xu, Guo Dong;Zhang, Jian Rong;Yin, Xin
    • Bulletin of the Korean Chemical Society
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    • v.35 no.7
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    • pp.1999-2003
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    • 2014
  • Indium tin oxide ($In_2Sn_{1-x}O_{5-y}$) nanoparticles were synthesized by hydrothermal method from stable indium tin acetylacetone complexes and postannealing at $600^{\circ}C$. The absence of chlorine ions shortened the synthesis process, decreased the particle agglomeration and improved the particle purity. The introduced complexing ligand acetylacetone decreased the obtained nanoparticle size. The improved powder properties accelerated the sintering of the $In_2Sn_{1-x}O_{5-y}$ nanoparticles and reached a relative density of 96.4% when pressureless sintered at $1400^{\circ}C$.

A Study on melting and bridge phenomena of solder paste (Solder paste의 용융 및 bridge현상 관찰연구)

  • 안병용;정재필
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.05a
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    • pp.442-446
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    • 1999
  • Melting behavior and bridge phenomenon of solder paste, which is essential for surface mount technology in packaging, were investigated. solder paste of Sn-37%Pb was printed on Sn-coated Cu-pattern of PCB, and heated over melting point. Melting behavior of the paste was observed using CCD-camera. In order to modelize the melting and agglomeration phenomena of the paste, two solder balls of 0.76mm diameter were used. As experimental results, the paste start to melt from the margin of the printed shape. The hight of the melted paste decreased from 270 $\mu$m to 200 $\mu$m firstly, and finally recovered to 250 $\mu$m. During the melting procedure, pores were evolved from the molten paste. Bridge Phenomenon of the molten Paste depends upon the pitch of the pattern.

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Low Cost Alcoholic Breath Sensor Based on SnO2 Modified with CNTs and Graphene

  • Morsy, M.;Yahia, I. S.;Zahran, H.Y.;Ibrahim, M.
    • Journal of the Korean Physical Society
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    • v.73 no.10
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    • pp.1437-1443
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    • 2018
  • In this work, $SnO_2$ modified with reduced graphene oxide (rGO) and carbon nanotubes (CNTs) separately and combined sensitized by using the co-precipitation method and their sensing behavior toward ethanol vapor at room temperature were investigated. An interdigitated electrode (IDE) gold substrate is very expensive compared to a fluorine doped tin oxide (FTO) substrate; hence, we used the latter to reduce the fabrication cost. The structure and the morphology of the studied materials were characterized by using differential thermal analyses (DTA) and thermogravimetric analysis (TGA), transmission electron microscope (TEM), X-ray diffraction (XRD), Fourier transform infrared (FTIR) spectroscopy, Brunauer-Emmett-Teller surface area and Barrett-Joyner-Halenda (BJH) pore size measurements. The studied composites were subjected to ethanol in its gas phase at concentrations from 10 to 200 ppm. The present composites showed high-performance sensitivity for many reasons: the incorporation of $SnO_2$ and CNTs which prevents the agglomeration of rGO sheets, the formation of a 3D mesopourus structure and an increase in the surface area. The decoration with rGO and CNTs led to more active sites, such as vacancies, which increased the adsorption of ethanol gas. In addition, the mesopore structure and the nano size of the $SnO_2$ particles allowed an efficient diffusion of gases to the active sites. Based on these results, the present composites should be considered as efficient and low-cost sensors for alcohol.

Gas Sensing Properties and Mechanism of the $\textrm{SnO}_2-\textrm{In}_2\textrm{O}_3$ System Prepared by Coprecipitation Method (공침법으로 제조된 $\textrm{SnO}_2-\textrm{In}_2\textrm{O}_3$ 계의 가스감응특성 및 감응기구)

  • Yun, Gi-Hyeon;Im, Ho-Yeon;Gwon, Cheol-Han;Yun, Dong-Hyeon;Kim, Seung-Ryeol;Hong, Hyeong-Gi;Lee, Gyu-Jeong
    • Korean Journal of Materials Research
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    • v.8 no.9
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    • pp.813-818
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    • 1998
  • Ultrafine powders of $\textrm{In}_{2}\textrm{O}_{3}$-doped $\textrm{SnO}_{2}$ were synthesized by a coprecipitation method and the effects of pH value and the amount of In2Q addition on particle size were investigated. The influence of pH value on particle size could be negligible, whereas the amount of $\textrm{In}_{2}\textrm{O}_{3}$ has influenced on particle size and specific surface area. The gas sensitivity to hydrocarbOn($\textrm{C}_{3}\textrm{H}_{8}$, $\textrm{C}_{4}\textrm{H}_{10}$) increased with $\textrm{In}_{2}\textrm{O}_{3}$ addition and reached a maximum at 3wt.% addition. From the results of impedance analysis and I-V characteristics. it was showed that the agglomeration structure of particles and the boundaries between agglomerates were the important factors to determine the gas sensing mechanism.

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A Study on Melting Phenomena of Solder Paste (솔더 페이스트의 용융현상 연구)

  • 김문일;안병용;정재필
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.1
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    • pp.5-11
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    • 2001
  • Melting behavior and bridge phenomenon of solder paste, which is essential for surface mount technology in pachaging, were investigated. Solder paste of Sn-37%Pb was printed on Cu-pattern of PCB, and heated over melting point. Melting behavior of the paste was observed using CCD-camera. In order to modelize the melting and agglomeration phenomena of paste, two solder balls of 0.76 mm diameter were used. As experimental results, the paste start to melt from the margin of the printed shape. The height of the melted paste decreased from 270 $\mu\textrm{m}$ to 200 $\mu\textrm{m}$ firstly, and finally recovered to 250 $\mu\textrm{m}$ During the melting procedure, pores were evolved from the molted paste. Concerning melting model of solder ball, relationship between contact area of solder ball and soldering time was derived as $\chi^2/t=4r \; \gamma/\eta=7.56 m^2$/s at $280^{\circ}C$.

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