• Proceedings of the KIEE Conference
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• 2006.07d
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• pp.2233-2234
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, $CeO_2$,and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

• Proceedings of the KIEE Conference
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• 2006.07d
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• pp.2235-2236
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, $CeO_2$,and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

• Korean Journal of Materials Research
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• v.16 no.5
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• pp.308-311
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• 2006

The purpose of this study is to investigate the difference of the wafer nanotopography impact on the oxide-film thickness variation between the STI CMP using ceria slurry and STI CMP using fumed silica slurry. The nanotopography impact on the oxide-film thickness variation after STI CMP using ceria slurry is 2.8 times higher than that after STI CMP using fumed silica slurry. It is attributed that the STI CMP using ceria slurry follows non-Prestonian polishing behavior while that using fumed silica slurry follows Prestonian polishing behavior.

• Journal of the Korean Ceramic Society
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• v.52 no.6
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• pp.403-409
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• 2015

Porous alumina ceramics are involved in many industrial applications due to the exceptional properties of these products. This study addresses the preparation of porous alumina ceramics using hollow microspheres as a pore-forming agent and slip casting as a green-body-forming technique. A uniform distribution of pores is a basic requirement of a porous material. This study investigates three different slurry systems, i.e., as-prepared alumina slurry, alumina slurry electrostatically dispersed by hydrochloric acid (HCl), and slurry dispersed by the commercial dispersant 'Darvan C-N'. At a low viscosity, the hollow microspheres in the slurry tend to float, which causes a non-uniform pore distribution. To avoid this phenomenon, the viscosity of the slurry was increased to the extent that the movement of hollow microspheres ceased in the slurry. As a result, a uniform pore distribution was achieved.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.723-726
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• 2004

In this work, we have studied the CMP characteristics by mixing of original slurry and used slurry in order to investigated the possibility of recycle of used silica slurry. The removal rate and within-wafer non-uniformity (WIWNU) were measured as a function of different slurry composition. Also, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and the original slurry. Our experimental results revealed comparable removal rate and good planarity with commercial products.

• Journal of Advanced Marine Engineering and Technology
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• v.39 no.8
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• pp.807-812
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• 2015

A microcapsule water slurry is a latent heat-storage material having a low melting point. In this study, the thermal properties of a microcapsule water slurry are measured. The physical properties of the test microcapsule water slurry, i.e., thermal conductivity, specific heat, latent heat, and density, are measured, and the results are discussed for the temperature region of solid and liquid phases of the dispersion material (paraffin). It is clarified that Eucken's equation can be applied to the estimation of the thermal conductivity of the microcapsule water slurry. Useful correlation equations of the thermal properties of the microcapsule water slurry are proposed in terms of the temperature and concentration ratio of the microcapsule water slurry constituents.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.378-381
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• 2003

The chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing However, cost of ownership (COO) and cost of consumables (COC) were relatively increased because of expensive slurry. In this paper, the effects of different slurry composition on the oxide CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity. We prepared the various kinds of slurry. In order to save the costs of slurry, the original slurry was diluted by de-ionized water (DIW). And then, alunima abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.6
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• pp.465-470
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• 2003

The chemical mechanical polishing (CMP) process has been widely used for the global planarization of multi-layer structures in semiconductor manufacturing. The CMP process can be optimized by several parameters such as equipment, consumables (pad, backing film and slurry), process variables and post-CMP cleaning. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, the slurry dominates more than 40 %. In this paper, we have studied the CMP characteristics of diluted silica slurry by adding of raw alumina abrasives and annealed alumina abrasives. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the view-point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.

• Transactions of Materials Processing
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• v.24 no.2
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• pp.95-100
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• 2015

It was confirmed that when phosphor slurry is formed in the cavity of an elastic mold, the pressure distribution of the phosphor slurry varies as a function of the major squeegee parameters (squeegee angle, squeegee velocity, and the viscosity of the phosphor slurry). The higher the slurry viscosity, the faster the squeegee velocity, and the smaller the squeegee angle, the higher the filling completeness of the phosphor slurry. The optimum conditions for complete filling of the phosphor slurry were found when the squeegee angle was between 30 to 45 degrees, squeegee velocity at 40 to 70mm/sec, and the viscosity of the phosphor slurry composite was at 6,556 cps (i.e. phosphor content around 50 wt. %).

• Journal of Animal Environmental Science
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• v.6 no.1
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• pp.37-44
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• 2000

A new hose slurry spreader with improved spreading uniformity is developed to distribute the slurrynear to the soil surface and to reduce odor problems. The precision of distributed slurry was investigated using 3 types of slurry and found to be dependent on the rotor speed. For the solid matter separated fluid containing 0.1% of dry matter rotor speed of 150 rpm showed best uniformity with CV of 10% In the case of slurry from dairy cattle which contains 8.2% of dry matter high rotor speed of 330 rpm showed best result with CV of 7.2% Also swine slurry which has a 13.6% of dry matter content showed the best result of 8.1% CV at the high rotor speed of 250rpm. A high rotor speed generates enough pressure in the central distributor and as a result uniform distribution of slurry can be achieved. In conclusion it is highly recommended rotor speed of 300 rpm to get the best performance.