Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2004.11a
- /
- Pages.723-726
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- 2004
Recycling Characteristics of Silica Abrasive Slurry
실리카 슬러리의 재활용 특성
- Park, Sung-Woo (Daebul Universlty) ;
- Kim, Chul-Bok (Dong-Sung A&T) ;
- Lee, Woo-Sun (Chosun University) ;
-
Chang, Eui-Goo
(Chung-Ang University)
;
- Seo, Yong-Jin (Daebul Universlty)
- 박성우 (대불대학교 전기전자공학과) ;
- 김철복 (동성A&T주식회사) ;
- 이우선 (조선대학교 전기공학과) ;
-
장의구
(중앙대학교 전자전기공학부)
;
- 서용진 (대불대학교 전기전자공학과)
- Published : 2004.11.11
Abstract
In this work, we have studied the CMP characteristics by mixing of original slurry and used slurry in order to investigated the possibility of recycle of used silica slurry. The removal rate and within-wafer non-uniformity (WIWNU) were measured as a function of different slurry composition. Also, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and the original slurry. Our experimental results revealed comparable removal rate and good planarity with commercial products.