• Journal of the Korean Vacuum Society
• /
• v.16 no.3
• /
• pp.187-191
• /
• 2007

In this paper, the catalyst layer is deposited on silicon substrate using magnetron sputtering system and carbon nanotubes(CNTs) were grown in $NH_3\;and\; C_2H_2$ gas by hot-filament plasma enhanced chemical vapor deposition (HFPECVD) system. A growth temperature of carbon nanotubes was changed from $350^{\circ}C\;to\;650^{\circ}C\;by\;100^{\circ}C$. We observed the shape of CNTs by a field-emission scanning electron microscope(FE-SEM) measurement and analyzed the surface characteristic of CNTs layer by contact angle measurement. That is, the growth temperature of CNTs is the important factor leads to the variation of the properties.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2011.10a
• /
• pp.16.2-16.2
• /
• 2011

Graphene has attracted significant attention due to its unique characteristics and promising nanoelectronic device applications. For practical device applications, it is essential to synthesize high-quality and large-area graphene films. Graphene has been synthesized by eloborated mechanical exfoliation of highly oriented pyrolytic graphite, chemical reduction of exfoliated grahene oxide, thermal decomposition of silicon carbide, and chemical vapor deposition (CVD) on metal substrates such as Ni, Cu, Ru etc. The CVD has advantages over some of other methods in terms of mass production on large-areas substrates and it can be easily separated from the metal substrate and transferred to other desired substrates. Especially, plasma-enhanced CVD (PECVD) can be very efficient to synthesize high-quality graphene. Little information is available on the synthesis of graphene by PECVD even though PECVD has been demonstrated to be successful in synthesizing various carbon nanostructures such as carbon nanotubes and nanosheets. In this study, we synthesized graphene on $Ni/SiO_2/Si$ and Cu plate substrates with CH4 diluted in $Ar/H_2$ (10%) by using an inductively-coupled PECVD (ICPCVD). High-quality graphene was synthesized at as low as $700^{\circ}C$ with 600 W of plasma power while graphene layer was not formed without plasma. The growth rate of graphene was so fast that graphene films fully covered on substrate surface just for few seconds $CH_4$ gas supply. The transferred graphene films on glass substrates has a transmittance at 550 nm is higher 94%, indicating 1~3 monolayers of graphene were formed. FETs based on the grapheme films transferred to $Si/SiO_2$ substrates revealed a p-type. We will further discuss the synthesis of graphene and doped graphene by ICPVCD and their characteristics.

• Journal of the Korean Vacuum Society
• /
• v.20 no.5
• /
• pp.374-380
• /
• 2011

Carbon coils could be synthesized on nickel catalyst layer-deposited silicon oxide substrate using $C_2H_2$ and $H_2$ as source gases and $SF_6$ as an additive gas under thermal chemical vapor deposition system. The characteristics (formation density and morphology) of as-grown carbon coils according to the injection stage of $SF_6$ gas incorporation were investigated. A continuous injecting of $SF_6$ gas flow could give rise to many types of carbon coils-related geometries, namely linear tub, micro-sized coil, nano-sized coil, and wave-like nano-sized coil. However, the limitation of the geometry as the nano-sized geometries of carbon coils could be achieved by the incorporation of $SF_6$ in a short time (1 min) during the initial deposition stage. A delayed injection of a short time $SF_6$ gas flow can deteriorate the limitation of the geometries. It confirms that the injection time and its starting point of $SF_6$ gas flow would be very important to determine the geometries of carbon coils.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.21 no.4
• /
• pp.153-157
• /
• 2011

We have investigated the effect of inductively coupled plasma (ICP) treatment on the early growth stage of heteroepitaxial Ge layers grown on Si(100) substrates using low pressure chemical vapor deposition (LPCVD), The Si(100) substrates were treated by ICP process with various source and bias powers, followed by the Ge deposition, The ICP treatment led to the enhancement in the coalescence of Ge islands, The growth rate of Ge on Si(100) with ICP surface treatment is about 5 times higher than that without ICP surface treatment. A missing dimer caused by the ICP surface treatment can act as a nucleation site for Ge adatoms, which could be responsible for the improvement in growth behavior of Ge on Si(100) substrates.

• Journal of the Microelectronics and Packaging Society
• /
• v.11 no.2 s.31
• /
• pp.29-35
• /
• 2004

Hafnium-oxide gate dielectric films deposited by a metal organic chemical vapor deposition technique on a $N_2-plasma$ treated SiNx and a hydrogen-terminated Si substrate have been investigated. In the case of $HfO_2$ film deposited on a hydrogen-terminated Si substrate, suppressed crystallization with effective carbon impurity reduction was obtained at $450^{\circ}C$. X-ray photoelectron spectroscopy indicated that the interface layer was Hf-silicate rather than phase separated Hf-silicide and silicon oxide structure. Capacitance-voltage measurements show equivalent oxide thickness of about 2.6nm for a 5.0 nm $HfO_2/Si$ single layer capacitor and of about 2.7 nm for a 5.7 nm $HfO_2/SiNx/Si$ stack capacitor. TEM shows that the interface of the stack capacitor is stable up to $900^{\circ}C$ for 30 sec.

• Korean Journal of Materials Research
• /
• v.17 no.3
• /
• pp.160-166
• /
• 2007

TRISO coatings on $ZrO_{2}$ surrogate kernels were conducted by a fluidized-bed chemical vapor deposition (FBCVD) method. Effects of the deposition temperature and the gas flow rate on the properties of SiC layer were investigated in the TRISO-coated particles. Deposition rate of the SiC layer decreased as the deposition temperature increased in the temperature range of $1460^{\circ}-1550^{\circ}C$. At the deposition temperature of $1550^{\circ}C$ the SiC layer contained an excess carbon, whereas the SiC layers had stoichiometric compositions at $1460^{\circ}C\;and\;1500^{\circ}C$. Hardness and elastic modulus measured by a nanoindentation method were the highest in the SiC layer deposited at $1500^{\circ}C$. The SiC layer deposited at the gas flow rate of 4000 sccm exhibited a high porosity and contained large pores more than $1{\mu}m$, being due to a violent spouting of particles. On the other hand, the SiC layer deposited at 2500 sccm revealed the lowest porosity.

• Korean Journal of Optics and Photonics
• /
• v.4 no.3
• /
• pp.266-275
• /
• 1993

We made $P_2O_5-SiO_2$ films on silicon for integrated optics application by low pressure chemical vapor deposition using TEOS (tetraethylorthosilicate) and TMPite (trimethylphosphite) and studied the deposition characteristics. The activation energy of the reaction was changed from 54.6 kcal/mole to 39.2 kcal/mole by incorporating the TMPite into the reaction of TEOS. The deposition rate and the P concentration of films increased in proportion to the flow of TMPite. As the deposition temperature increased, the deposition rate of the films increased but the P concentration decreased. The fabricated films showed the increase of refractive index of 0.0019 per 1 wt% of P concentration. The nonuniformity of films was ${\pm}$7% in thickness and ${\pm}$0.5wt% in P concentration and we showed this'nonuniformity is due to the nonuniform transport of TMPite. The films of more than 10wt% P concentration developed phosphoric acid on its surface when exposed to air for long time.

• Journal of the Korean Vacuum Society
• /
• v.22 no.1
• /
• pp.31-36
• /
• 2013

For the simplification of doping process in amorphous carbon film, arsenic (As) ions were implanted on the nucleated silicon wafer before the growth process. Then amorphous carbon films were grown at the condition of $CH_4/H_2=5%$ by microwave plasma chemical vapour deposition. Because the implanted seeds were grown at the high temperature and the implanted ions were spread, it was possible to reduce the process steps by leaving out the annealing process. When the implanted amorphous carbon films were electrically characterized in diode configuration, field emission current of $0.1mA/cm^2$ was obtained at the applied electric field of about $2.5V/{\mu}m$. The results show that the implanted As ions were sufficiently doped by the self-annealing process by using the growth after implantation.

• Korean Journal of Optics and Photonics
• /
• v.6 no.3
• /
• pp.233-238
• /
• 1995

'#65279;We made $P_2O_5-SiO_2$ films on silicon for integrated optics application by low pressure chemical vapor deposition using TEOS(tetraethylorthosilicate), TMPite(trimethylphosphite) and phosphine($PH_3$). And We studied and compared between TMPite and PH, as a dopant of P in PSG films in the aspect of the de,position characteristics. Deposition rate of TMPate-PSG films was $55 \AA/min$ which was smaller than 90 A/min , that of $PH_3-PSG$ films. Thickness deviation of TMPate-PSG films was 2% and that of PH3-PSG was 4.5%. So TMPate-PSG films had a good quality in thickness uniformity. The range of refractive index was controlled from 1.445 to 1.468 at 633 nm in TMPate-PSG films and it was controlled from 1.456 to 1.476 in $PH_3-PSG$ films.

• Journal of Information Display
• /
• v.7 no.3
• /
• pp.13-18
• /
• 2006

Currently, the flexible organic light emitting devices (OLEDs) are investigated. They are very vulnerable to moisture, and thus have been found to show some problems. Thus, an effective barrier layer is needed to protect from moisture in air. We deposited thin films with magnesium oxide (MgO) and silicon oxide $(SiO_{2})$ compounds mixed at various mixture ratios on flexible polyether sulfone (PES) substrates by an electron-beam evaporator to investigate their applizability for transparent barrier applications. In this study, we found that as the MgO fraction increased, thin films comprised of MgO and $(SiO_{2})$ compounds became more amorphous and their surface morphologies become smoother and denser. In addition, zirconium oxide $(ZrO_{2})$ was added to the above-mentioned compound mixtures. $ZrO_{2}$ made thin mixture films more amorphous and made the surface morphology denser and more uniform. The water vapor transmission rates (WVTRs) of the whole films decreased rapidly. The best WVTR was obtained by depositing thin films of Mg-Si-Zr-O compound among the whole thin films. As the thin mixture films became more amorphous, and the surface morphology become denser and more uniform, the WVTRs decreased. Therefore, the thin mixture films became more suitable for flexible OLED applications as transparent passivation layers against moisture in air.