• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
• /
• pp.83-87
• /
• 2002

Plasma enhanced chemical vapor deposited (PECVD) silicon nitride ($SiN_X$) is widely used as a gate dielectric material for the hydrogenated amorphous silicon(a-Si:H) thin film transistors (TFT's). We investigated $SiN_X$ films were deposited PECVD at low temperature ($300^{\circ}C$). The reaction gases were used pure nitrogen and a helium diluted of silane gas(20% $SiH_4$, 80% He). Experimental investigations were carried out with the variation of $N_2/SiH_4$ flow ratios from 3 to 50 and the rf power of 200 W. This article presents the $SiN_X$ gate dielectric studies in terms of deposition rate, hydrogen content, etch rate and C-V, leakage current density characteristics for the gate dielectric layer of thin film transistor applications. Electrical properties were analyzed through high frequency (1MHz) C-V and current-voltage (I-V) measurements. The thickness and the refractive index on the films were measured by ellipsometry and chemical bonds were determined by using an FT-IR equipment.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 2009년도 춘계학술발표대회
• /
• pp.34.1-34.1
• /
• 2009

A great deal of attention has been focused on ZnO nanowires for various electronics and optoelectronics applications. in the pursuit of next generation nanodevices, it would be highly preferred if well-ordered ZnO nanowires of lower dimension could be fabricated on silicon. Before the growth of nanowires, silicon substrates were selectively etched using silicon nitride as masking layer. Vertical aligned ZnO nanowires were grown by metal organic chemical vapor deposition on patterned silicon substrate. The shape of nanostructures was greatly influenced by the micropatterned surface of the substrate. The aspect ratio, packing fraction and the number density of nanowires on top surface are around 10, 0.8 and $10^7\;per\;mm^2$, respectively, whereas the values are 20, 0.3 and $5\times10^7\;per\;mm^2$, respectively, towards the bottom of the cavity. XRD patterns suggest that the nanostructures have good crystallinity. High-resolution transmission electron microscopy confirmed the single crystalline growth of the ZnO nanowires along [0001] direction.

• 한국재료학회지
• /
• 제14권2호
• /
• pp.141-145
• /
• 2004

Silicon nitride thin films were deposited by atomic layer deposition (ALD) technique in a batch-type reactor by alternating exposures of precursors. XJAKO200414714156408$_4$ or$ SiH_2$$Cl_2$ was used as the Si precursor, $NH_3$ was used as the N precursor, and the deposited films were characterized comparatively. The thickness of the film linearly increased with the number of deposition cycles, so that the thickness of the film can be precisely controlled by adjusting the number of cycles. As compared with the deposition using$ SiCl_4$, the deposition using $SiH_2$$Cl_2$ exhibited larger deposition rate at lower precursor exposures, and the deposited films using $SiH_2$$Cl_2$ had lower wet etch rate in a diluted HF solution. Silicon nitride films with the Si:N ratio of approximately 1:1 were obtained using either Si precursors at $500^{\circ}C$, however, the films deposited using $SiH_2$$Cl_2$ exhibited higher concentration of H as compared with those of the $SiC_4$ case. Silicon nitride thin films deposited by ALD showed similar physical properties, such as composition or integrity, with the silicon nitride films deposited by low-pressure chemical vapor deposition, lowering deposition temperature by more than $200^{\circ}C$.

• 대한금속재료학회지
• /
• 제49권9호
• /
• pp.732-738
• /
• 2011

Silicon oxide thin films were deposited by using a plasma-enhanced chemical-vapor deposition technique to investigate the light emission properties. The photoluminescence characteristics were divided into two categories along the relative ratio of the flow rates of $SiH_4$ and $N_2O$ source gases, which show light emission in the broad/visible range and a light emission peak at 380 nm. We attribute the broad/visible light emission and the light emission peak to the quantum confinement effect of nanocrystalline silicon and the Si=O defects, respectively. Changes in the photoluminescence spectra were observed after the post-annealing processes. The photoluminescence spectra of the broad light emission in the visible range shifted to the long wavelength and were saturated above an annealing temperature of $900^{\circ}C$ or after 1 hour annealing at $970^{\circ}C$. However, the position of the light emission peak at 380 nm did not change at all after the post-annealing processes. The light emission intensities at 380 nm initially increased, and decreased at annealing temperatures above $700^{\circ}C$ or after 1 hour annealing at $700^{\circ}C$. The photoluminescence behaviors after the annealing processes can be explained bythe size change of the nanocrystalline silicon and the density change of Si=O defect in the films, respectively. These results support the possibility of using a silicon-based light source for Si-optoelectronic integrated circuits and/or display devices.

• 한국결정성장학회지
• /
• 제4권4호
• /
• pp.370-377
• /
• 1994

비이송식DC 플라즈마 토치를 제작하고 이를 이용하여 질화규소 분말을 제조하였다. Ar 가스를 사용하여 플라즈마를 발생시켯으며, 발생된 플라즈마 flame으로 반응가스 및 reactive quenching 가스를 도입하였다. 토치의 하단부에 2개의 slit를 장착하여 가스의 도입 위치를 변화시킬 수 있게 하였다. $SiCl_4와 NH_3$를 출발원료로 하여 질화규소 분말을 제조하였다. 얻어진 분말은 무정형이었으며, 반응부산물을 제거하고 $1420^{\circ}C$에서 질소 분위기하에서 가열함으로써 결정화된 질화규소 분말을 얻었다. XPD pattern 및 IR 스펙트럼으로부터 질화규소 분말을 확인하였고, TEM을 사용하여 전후의 형상을 관찰하였다.

• 한국재료학회지
• /
• 제11권6호
• /
• pp.512-518
• /
• 2001

6.5wt%Si강판을 낮은 철손실, 고투자율 그리고 자왜가 거의 0으로 우수한 자성재료로 잘 알려져 있다. 본 실험에서는 화학기상증착 (Chemical Vapor Deposition)으로 6.5wt%Si 강판을 만들었다 이 과정은 튜브 노내에서 실리콘의 함량이 낮은 Si강판에 SiCl$_4$가스를 반응시킨다. 이때 SiCl$_4$가스에서 분해된 Si의 원자들은 모재인 강판 표면에 증착되어 표면층에 Si가 풍부한 층을 형성한다. 마지막으로 고온에서 확산과정을 통하여 모재 내부로부터 실리콘의 함량이 균일한 강판을 얻을 수 있다. 0.5mm두께를 갖은 6.5wt%Si 강판의 철손실은 고주파수에서 약 8.92W/kg를 나타냈으며 투자율은 53,300으로 일반 실리콘강판, 즉 2.5wt%Si강판의 투자율 37,100보다 약 두배 가량 증가하였다. 또한 기계적인 특성을 평가하기 위해서 일반 0.5wt%Si강판과 773K의 온도에서 수시간 열처리한 강판을 인장실험 하였다. 따라서 수 시간 열처리한 시편에서 연신율이 증가함을 알 수 있었으며 파단면을 관찰한 결과 입 계파단면이 현저히 감소했음을 알았다

• 전기화학회지
• /
• 제2권1호
• /
• pp.17-22
• /
• 1999

다공질 실리콘을 이용한 마이크로센서와 마이크로액츄에이터의 연구는 현재 초기단계에 있기 때문에, 지금까지 발광 다이오드나 화학 센서 등과 같은 몇몇 응용 소자가 발표된 수준에 머물러 있다. 본 논문에서는 화학 센서와 광소자를 중심으로 다공질 실리콘 센서 및 액추에이터 연구현황을 고찰 보고하고자 한다. 정전용량형 다공질 실리콘 습도센서의 감습 특성은 비선형이였으며, 저습보다는 $40\%RH$ 이상의 고습영역에서 더 높은 감도를 나타내었다. 다공질 실리콘 $n^+-p-n^+$ 소자는 에탄올에 노출되었을 때 소자 전류가 급격히 증가하였다. 다공질 실리콘 다이어프램에 제작된 $p^+-PSi-n^+$ 다이오드는 광 스위칭 현상을 나타내어 광센서 또는 광스위치로써의 응용 가능성을 보여주었다. 다공질 실리콘에 365nm를 조사해서 얻어진 광루미네센스(PL)는 넓은 스펙트럼을 보였으며, 피크 파장은 610 nm이었다. ITO/PSi/In LED의 전계발광(EL)스펙트럼은 PL에 비해 약간 더 넓은 영역에 걸쳐 나타났으며, 피크 에너지가 단파장(535nm)으로 이동하였다.

• KSTLE International Journal
• /
• 제5권2호
• /
• pp.37-43
• /
• 2004

Abstract : Nano/micro-scale friction properties were investigated on Si (100) and three self-assembled monolayers (SAMs) (PFOTC, DMDM, DPDM) coated on Si-wafer by chemical vapor deposition technique. Experiments were conducted at ambient temperature(24$pm$1$circ$C) and humidity(45$pm$5%). Friction at nano-scale was measured using Atomic Force Microscopy (AFM) in the range of 0-40nN normal loads. In both Si-wafer and SAMs, friction increased linearly as a function of applied normal load. Results showed that friction was affected by the inherent adhesion in Ssi-wafer, and in the case of SAMs the physical/chemical structures had a major influence. Coefficient of friction of these test samples at the micro-scale was also energies. In order to study the effect of contact area on coefficient of friction at the micro-scale, friction was measured for Si-wafer and DPDM against Soda Lime balls (Duke Scientiffic Corporation) of different radii (0.25 mm, 0.5 mm and 1 mm) at different applied normal loads (1500, 3000 and 4800 mN). Results showed that Si-wafer had higher coefficient of friction than DPDM. Further, unlike that in the case of DPDM, friction in Si-wafer was severely influenced by its wear. SEM evidences showed that solid-solid adhesion was the wear mechanism in Si-wafer.

• 한국분말재료학회지
• /
• 제23권5호
• /
• pp.384-390
• /
• 2016

Tri-isotropic (TRISO) coatings on zirconia surrogate beads are deposited using a fluidized-bed vapor deposition (FB-CVD) method. The silicon carbide layer is particularly important among the coated layers because it acts as a miniature pressure vessel and a diffusion barrier to gaseous and metallic fission products in the TRISO-coated particles. In this study, we obtain a nearly stoichiometric composition in the SiC layer coated at $1400^{\circ}C$, $1500^{\circ}C$, and $1400^{\circ}C$ with 20 vol.% methyltrichlorosilane (MTS), However, the composition of the SiC layer coated at $1300-1350^{\circ}C$ shows a difference from the stoichiometric ratio (1:1). The density decreases remarkably with decreasing SiC deposition temperature because of the nanosized pores. The high density of the SiC layer (${\geq}3.19g/cm^2$) easily obtained at $1500^{\circ}C$ and $1400^{\circ}C$ with 20 vol.% MTS did not change at an annealing temperature of $1900^{\circ}C$, simulating the reactor operating temperature. The evaluation of the mechanical properties is limited because of the inaccurate values of hardness and Young's modulus measured by the nano-indentation method.

• 한국결정성장학회지
• /
• 제6권3호
• /
• pp.318-326
• /
• 1996

본 연구는 초고집적회로의 금속 배선으로써 보다 유용할 것으로 기대되는 구리박막의 화학적인 증착기술에 관한 것으로 precursor 물질로는 (hfac)Cu(I)VTMS ; (hevaflouoroacetylacetonate trimethyvinylsilane copper)로 명명된 금속 유기 물질을 사용하였다. 실험시스템의 초기 압력은 $10^{-6}$ Torr를 유지하고, 시스템의 챔버압력과 기판온도가 조정 가능하도록 설계, 제작되었다. 공정 조건에 따른 구리 박막 결정의 성장속도, Grain size, 전기적 성질을 측정하였다. 구리 박막을 증착하기 전에 W(tungsten) 또는 TiN(titanium nitride)이 증착되어 있는 실리콘 웨이퍼를 사용하였다. 본 연구에서는 $250^{\circ}C$이하의 상대적으로 낮은 실리콘 웨이퍼 온도에서의 실험이 가능하였으며 헬륨을 carrier gas로 사용하였는데 연구 결과 구리 박막 증착율이 $220^{\circ}C$에서 최대 $1,800\;{\AA}/분$으로 증가한 반면 표면 거칠기는 $200\;{\AA}$를 갖는 다결정 구리 박막을 관찰하게 되었다. 기판 온도가 $250^{\circ}C$이하일 때의 W(또는 TiN)과 $SiO_{2}$ 기판사이에서 구리 증착 선택성이 관찰되었으며, 최적의 기판 증착 온도는 약 $180^{\circ}C$와 반응용기 압력 0.8 Torr로 나타났다.