• 제목/요약/키워드: Silicon modification

검색결과 107건 처리시간 0.022초

잠재지문 현출용 나노 은 분말의 표면개질에 대한 연구 (A study on surface modification of Ag powder for developing latent fingerprints)

  • 김만기;최미정;전충현;박성우
    • 분석과학
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    • 제23권2호
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    • pp.216-223
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    • 2010
  • Ag 분말 입자형태와 크기에 따른 효율성을 확인한 결과 flake, spherical 형태의 분말은 시판 회색 분말과 현출효율이 유사하였고, nAg (rod, $0.9\;{\mu}m$) 분말의 경우 다양한 잠재지문 현출효율 평가 실험에서 우수한 결과를 보였다. 그러나 1개월간 nAg 분말을 자연조건에서 방치하였을 때 분말의 산화 및 수분의 영향으로 현출효율이 낮게 확인되어 산화 및 수분 흡습 방지를 위한 연구가 제기되었다. 본 연구는 nAg 분말의 산화 및 수분 흡습의 단점을 보완하기위해 nAg 분말에 실리콘 오일을 다양한 수준으로 표면개질하여 비다공성 대상물질 표면인 유리, 플라스틱에서 현출지문의 동일한 영역에서 특징점 수, 이랑과 분말의 흡착정도, 현출지문의 contrast 등으로 nAg 분말과 표면개질 nAg 분말의 현출효율을 평가하여 유리, 플라스틱 대상물질에서 DC200 실리콘 오일 0.5%로 표면개질한 nAg 분말의 우수함과 산화 및 수분 흡습의 단점을 보완할 수 있었다.

AFM 기반 Pulse 를 이용한 전기화학적 가공 (Localized Oxidation of (100) Silicon Surface by Pulsed Electrochemical Processes Based on AFM)

  • 이정민;김선호;박정우
    • 대한기계학회논문집A
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    • 제34권11호
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    • pp.1631-1636
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    • 2010
  • 본 연구는 AFM 을 이용하여 nano scale 의 Lithography 를 구현하는 것이다. 외부의 pulse generator 를 통하여 전류를 통전 시키는 방법을 수정함으로써, 일정 습도를 유지한 상태의 AFM 내부에서 Si-wafer 의 표면과 Tip의 사이에 전원을 인가하고 pulse generator 에서 임의로 pulse 폭의 변화를 준다. Si-wafer 표면에서 물 분자가 Tip과 wafer 사이의 직접적인 전류의 이동조절로 인해 전기 화학적 반응을 적절히 제한하여 산화물을 생성시키는 방법이다. 이렇게 생성된 산화물은 불산 처리를 통하여 산화물을 식각시켜 미세 그루브를 구현 할 수 있다. 본 연구를 통한 나노 패턴 생성 기법은 나노 머시닝 기술의 진보에 잠재적 가능성을 제시한다.

화학증착 탄화규소에 의한 흑연의 표면개질 연구 -수평형 화학증착반응관에서 탄화규소 성장특성- (A Study on the Surface Modification of Graphite by CVD SiC -Growth Characteristics of SiC in a Horizontal CVD Reactor-)

  • 김동주;최두진;김영욱;박상환
    • 한국세라믹학회지
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    • 제32권4호
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    • pp.419-428
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    • 1995
  • Polycrystalline silicon carbide (SiC) thick films were depostied by low pressure chemical vapor deposition (LPCVD) using CH3SiCl3 (MTS) and H2 gaseous mixture onto isotropic graphite substrate. Effects of deposition variables on the SiC film were investigated. Deposition rate had been found to be surface-reaction controlled below reactor temperature of 120$0^{\circ}C$ and mass-transport controlled over 125$0^{\circ}C$. Apparent activation energy value decreased below 120$0^{\circ}C$ and deposition rate decreased above 125$0^{\circ}C$ by depletion effect of the reactant gas in the direction of flow in a horizontal hot wall reactor. Microstructure of the as-deposited SiC films was strongly influenced by deposition temperature and position. Microstructural change occurred greater in the mass transport controlled region than surface reaction controlled region. The as-deposited SiC layers in this experiment showed stoichiometric composition and there were no polytype except for $\beta$-SiC. The preferred orientation plane of the polycrystalline SiC layers was (220) plane at a high reactant gas concentration in the mass transfer controlled region. As depletion effect of reactant concentration was increased, SiC films preferentially grow as (111) plane.

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N형 실리콘 제어 정류기 소자의 구조 변형을 통한 정전기 보호성능의 향상에 대한 연구 (Improvement of Electrostatic Discharge (ESD) Protection Performance through Structure Modification of N-Type Silicon Controlled Rectifier Device)

  • 양준원;서용진
    • 한국위성정보통신학회논문지
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    • 제8권4호
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    • pp.124-129
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    • 2013
  • PPS 구조가 삽입된 N형 실리콘 제어 정류기 소자를 마이크로 칩의 고전압 I/O 응용을 위해 연구하였다. 종래의 NSCR_PPS_Std 표준소자는 매우 낮은 스냅백 홀딩 전압을 갖는 전형적인 SCR 특성을 가지고 있어 정상적인 동작 동안 래치업 문제가 나타나는 것으로 보고되고 있다. 그러나 본 연구에서 제안하는 CPS 및 부분적으로 형성된 P-Well(PPW) 구조를 갖는 변형된 NSCR_PPS_CPS_PPW 소자는 높은 래치업 면역과 트리거링 전압의 조절이 용이한 안정한 ESD 보호 성능을 나타내어 고전압 동작용 마이크로 칩의 정전기보호 소자로 적용 가능함을 확인하였다.

나노임프린트 리소그래피 적용을 위한 CHF3 플라즈마를 이용한 실리콘 몰드 표면 처리 특성 (A Study of the Silicon Mold Surface Treatment Using CHF3 Plasma for Nano Imprint Lithography)

  • 김용근;김재현;유반석;장지수;권광호
    • 한국전기전자재료학회논문지
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    • 제24권10호
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    • pp.790-793
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    • 2011
  • In this study, the surface modification for a silicon(Si) mold using $CHF_3$ inductively coupled plasma(ICP). The conditions under that plasma was treated a input ICP power 600 W, an operating gas pressure of 10 mTorr and plasma exposure time of 30 sec. The Si mold surface became hydrophobic after plasma treatment in order to $CF_x$(X= 1,2,3) polymer. However, as the de-molding process repeated, it was investigated that the contact angle of Si surface was decreased. So, we attempted to investigate the degradation mechanism of the accurate pattern transfer with increasing the count of the de-molding process using scanning electron microscope (SEM), contact angle, and x-ray photoelectron spectroscopy (XPS) analysis of Si mold surface.

마이크로/나노 구조를 갖는 초발수성 표면의 제작 및 분사 액적의 충돌 특성 연구 (Fabrication of a Micro/Nano-scaled Super-water-repellent Surface and Its Impact Behaviors of a Shooting Water Droplet)

  • 김형모;이상민;이찬;김무환;김준원
    • 한국정밀공학회지
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    • 제29권9호
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    • pp.1020-1025
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    • 2012
  • In this study, we fabricated the superhydrophobic and super-water-repellent surface with the micro/nano scale structures using simple conventional silicon wet-etching technique and the black silicon method by deep reactive ion etching. These fabrication methods are simple but very effective. Also we reported the droplet impact experimental results on the micro/nano-scaled surface. There are two representative impact behaviors as "rebound" and "fragmentation". We found the transition Weber number between "rebound" and "fragmentation" statements, experimentally. Additionally, we concerned about the dimensionless spreading diameters for our super-water-repellent surface. The novel characterization method was introduced for analysis including the "fragmentation" region. As a result, our super-water-repellent surface with the micro/nano-scaled structures shows the different impact behaviors compared with a reference smooth surface, by some meaningful experiments.

마이크로 연소기에서 발생하는 열 소염과 화학 소염 현상 (I) -이온 주입법을 이용한 SiOx(≤2) 플레이트 제작과 구조 화학적 분석- (Thermal and Chemical Quenching Phenomena in a Microscale Combustor (I) -Fabrication of SiOx(≤2) Plates Using ion Implantation and Their Structural, Compositional Analysis-)

  • 김규태;이대훈;권세진
    • 대한기계학회논문집B
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    • 제30권5호
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    • pp.397-404
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    • 2006
  • Effects of surface defect distribution on flame instability during flame-surface interaction are experimentally investigated. To examine chemical quenching phenomenon which is caused by radical adsorption and recombination processes on the surface, thermally grown silicon oxide plates with well-defined defect density were prepared. ion implantation technique was used to control the number of defects, i.e. oxygen vacancies. In an attempt to preferentially remove oxygen atoms from silicon dioxide surface, argon ions with low energy level from 3keV to 5keV were irradiated at the incident angle of $60^{\circ}$. Compositional and structural modification of $SiO_2$ induced by low-energy $Ar^+$ ion irradiation has been characterized by Atomic Force Microscopy (AFM) and X-ray Photoelectron Spectroscopy (XPS). It has been found that as the ion energy is increased, the number of structural defect is also increased and non-stoichiometric condition of $SiO_x({\le}2)$ is enhanced.

실리콘 마이크로 몰드와 유리의 열-재흐름 현상을 이용한 초소수성 유리 표면 제작 및 젖음 특성 평가 (Fabrication and Characterization of Superhydrophobic Glass Surfaces Using Silicon Micro-mold and Thermal-reflow Process)

  • 김승준;공정호;이동윤;김종만
    • 대한금속재료학회지
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    • 제50권8호
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    • pp.591-597
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    • 2012
  • This paper presents regularly micro-textured glass surfaces ensuring the superhydrophobic properties in the Cassie-Baxter regime. The proposed surfaces were fabricated simply and efficiently by filling the glass material into a silicon micro-mold with periodic micro-cavities based on a thermal-reflow process, resulting in a successful demonstration of the textured glass surface with periodically-arrayed micro-pillar structures. The static and dynamic wetting properties of the micro-textured glass surfaces were characterized by measuring the static contact angle (SCA) and contact angle hysteresis (CAH), respectively. In addition, the surface wettability was estimated theoretically based on Wenzel and Cassie-Baxter wetting theories, and compared with the experimental ones. Through the experimental and theoretical observations, it was clearly confirmed that the proposed micro-textured glass surfaces showed the slippery superhydrophobic behaviors in the Cassie-Baxter wetting mode.