A Study of the Silicon Mold Surface Treatment Using CHF3 Plasma for Nano Imprint Lithography |
Kim, Young-Keun
(Department of Control and Instrumentation Engineering, Korea University)
Kim, Jae-Hyun (Department of Control and Instrumentation Engineering, Korea University) You, Ban-Seok (Department of Control and Instrumentation Engineering, Korea University) Jang, Ji-Su (Department of Control and Instrumentation Engineering, Korea University) Kwon, Kwang-Ho (Department of Control and Instrumentation Engineering, Korea University) |
1 | S. Y. Chou, P. R. Krauss, and P. J. Renstrom, J. Vac. Sci. Technol., B14, 4129 (1996). |
2 | D. Y. Khang, H. Kang, T. I. Kim, and H. H. Lee, Nano Lett., 4, 633 (2004). DOI |
3 | H. C. Scheer, N. Bogdanski, M. Wissen, T. Konishi, and Y. Hirai, J. Vac. Sci. Technol., B23, 2963 (2005). |
4 | T. Haatainen, T. Makela, J. Ahopelto, and Y. Kawaguchi, Microelectron. Eng., 86, 2293 (2009). DOI |
5 | T. Glinsner, T. Veres, G. Kreindl, E. Roy, K. Morton, T. Wieser, C. Thanner, D. Treiblmayr, R. Miller, and P. Lindner, Microelectron. Eng., 87 1037 (2010). DOI |
6 | Y. J. Weng, Y. C. Weng, S. Y. Yang, and J. L. Wong, Polym. Adv. Technol., 19, 1704 (2008). DOI |
7 | D. Truffier-Boutry, A. Beaurain, R. Galand, B. Pelissier, J. Boussey, and M. Zelsmann, Microelectron. Eng., 87, 122 (2010). DOI |
8 | F. Hamouda, G. Barbillon, S. Held a, G. Agnus, P. Gogol, T. Maroutian, S. Scheuring, and B. Bartenlian, Microelectron. Eng., 86, 583 (2009). DOI |
9 | A. Efremov, N. K. Min, J. Jeong, Y. Kim, and K. H. Kwon, Plasma Sources Sci. Technol., 19, 045020 (2010). DOI |
10 | D. Y. Chu and J. K. Thomas, Macromolecules, 23, 2217 (1990). DOI |
11 | H. H. Park, K. H. Kwon, J. L. Lee, K. S. Suh, O. J. Kwon, K. I. Cho, and S. C. Park, J. Appl. Phys., 76, 4596 (1994). DOI |