• 한국전자파학회지:전자파기술
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• 제24권2호
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• pp.3-14
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• 2013

In this paper, key design issues and considerations for Signal Integrity(SI) and Power Integrity(PI) of a TSV-based 3D IC are introduced. For the signal integrity and power integrity of a TSV-based 3-D IC channel, analytical modeling and analysis results of a TSV-based 3-D channel and power delivery network (PDN) are presented. In addition, various design techniques and solutions which are to improve the electrical performance of a 3-D IC are investigated.

• 한국전자파학회논문지
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• 제21권2호
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• pp.188-193
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• 2010

본 논문은 관통형 비아와 전송 선로 사이의 임피던스 불연속과 P/G(Power/Ground) 면 사이에서 발생되는 공진으로 인한 클록 신호 응답 성능 저하가 관통형 비아(through-hole via)가 있는 4층 PCB(Printed Circuit Boards)의 SI(Signal Integrity) 성능에 악영향을 미치는 것을 이론적으로 분석하였다. 비아 구조의 집중소자 모델링을 이용한 반사 전압 계산과 TDR(Time Domain Reflector) 시뮬레이션 결과 비교로 관통형 비아와 전송 선로 사이의 임피던스 불연속 최소화 시킬 수 있고, 관통형 비아 위치를 이용한 P/G면 공진 상쇄의 시뮬레이션 결과로 클록 신호 응답 성능을 향상시킬 수 있음을 확인하였다.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2013년도 추계학술대회
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• pp.386-389
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• 2013

본 논문에서는 Processor와 DDR2 사이에 인터페이스되는 고속신호의 Signal Integrity 해석을 위해 IC Chip의 IBIS Model과 Transmission Line의 S-Parameter를 이용하여 고속신호의 Transient 해석을 수행하고 Eye Diagram을 생성하였다. 고속으로 동작하는 DQ, DQS/DQSb 신호 및 Clock, Address, Control 신호의 Eye Diagram에서 Setup/Hold 구간동안 Timing Margin과 Voltage Margin을 측정하였으며 Over-/Under-shoot 및 Differential 신호의 Cross Point가 Spec에 만족하는지 확인하여 신호의 품질을 확보하였다.

• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.27-33
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• 2010

We have successfully demonstrated a high-pin-count and thin embedded-LSI package to realize next generation's mobile terminals. The following three design key points were applied: (i) Using Cu posts, (ii) Using the coreless structure, (iii) Using a Cu plate as the ground plane. In order to quantitatively determine the contribution of the three points, the five-stage process for reducing the number of metal layers is described by means of the electrical simulation. The point-(i) and (ii) are effective from the viewpoint of the power integrity (PI); that is, these points play important roles in reducing the number of metal layers, and especially the point-(ii) contributes at least twice as the point-(i). The point-(iii) is not effective in the PI, but has a few effects on the signal integrity (SI). For reducing the number of metal layers, we should, at first, pay attention whether the PI characteristics fulfill the specification, and then we should confirm the SI characteristics.

• Journal of Electrical Engineering and Technology
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• 제11권1호
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• pp.175-183
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• 2016

This paper brings out a novel method for reducing Near end and Far end Crosstalk using Electromagnetic Band Gap structures (EBG) in High Speed RF transmission lines. This work becomes useful in high speed closely spaced Printed Circuit Board (PCB) traces connected to multi core processors. By using this method, reduction of −40dB in Near-End Crosstalk (NEXT) and −60 dB in Far End Crosstalk (FEXT) is achieved. The results are validated through experimental measurements. Time domain analysis is performed to validate the signal integrity property of coupled transmission lines.

• Journal of international Conference on Electrical Machines and Systems
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• 제3권3호
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• pp.248-251
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• 2014

As more vehicles become equipped with advanced electronic control systems, more consideration is needed with regards to automotive safety issues related to the effects of electromagnetic waves. Unwanted electromagnetic waves from the antenna, electricity and other electronic devices cause the performance and safety problem of automotive components. In general, Power Integrity and Signal Integrity analysis have been widely used, but these analyses have stayed PCB level. PCB base analysis is different from radiated emission TEST condition so its results are used just for reference. This paper proposes EMC optimization technology using module level 3-dimensional radiation simulation process closed to fundamental test conditions. If module level EMC analysis, which is proposed in this study, is applied to all automotive electronics systems, unexpected EMC noise will be prevented.

• 전기학회논문지
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• 제63권12호
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• pp.1716-1721
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• 2014

In this paper, a study on automation method for the circuit/EM (Electro-Magnetic) simulation is carried out to analyze effectively the SI/PI (Signal Integrity/Power Integrity) issues which occur on circuits and/or PCBs (Printed Circuit Boards). For the automation of the circuit/EM simulation, algorithms performing each process of the SI/PI analysis automatically (such as ports setup, circuit definition and SI/PI evaluation) are developed; thereby automation system for the SI/PI analysis is constructed with the algorithms. The automation of the circuit/EM simulation is accomplished in the environment of the C/S (Client/Server) architecture in order to reduce resources such as high cost computers demanded for the SI/PI analysis. The automation method for the SI/PI analyses proposed in this paper reduces effort, time, and cost spent on the environment setup for simulation and the SI/PI analysis process. In addition, the proposed method includes automation of the documenting process, which organizes, records and displays the SI/PI analysis results automatically for users.

• 한국전자파학회논문지
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• 제21권7호
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• pp.786-795
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• 2010

본 논문에서는 EBG(Electromagnetic Band Gap) 구조에 존재하는 두 단위 셀을 신호 전달 평면상의 브릿지 라인으로 연결하는 새로운 형태의 EBG 구조를 제안하였다. 이와 같은 구조를 갖는 EBG는 단위 셀을 연결하는 비아 홀과 브릿지 라인으로 인해 전원면에서 SSN(Simultaneous Switching Noise)를 효과적으로 차단하였으며, 또한 신호 평면상에서 존재하는 신호선들 사이에서는 우수한 신호 전달 특성을 보였다. 제안된 구조의 EBG는 특정 사이즈에서 차단 주파수 1.2 GHz, 저지 대역폭은 8.3 GHz로 넓은 주파수 대역에서 －30 dB 이하의 저지 대역특성을 나타내었다. 또한 광대역의 저지 대역폭을 유지하면서 신호 평면상에 위치한 신호선이 우수한 신호 전달 특성을 가질 수 있는 전원면/접지면의 위치를 최종적으로 제안하였다.

• 정보통신설비학회논문지
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• 제8권1호
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• pp.1-5
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• 2009

In this paper, we propose a method that applies Vector Fitting (VF) technique to the equivalent circuit model for RF passive components. These days wireless communication system is getting smaller and smaller. So EMI/EMC is an issue in RF. We can solve PI/SI (Power Integrity/Signal Integrity) that one of EMI/EMC problem apply IFFT for 3D EM simulation multiple with input signal. That is time consuming task. Therefore equivalent circuit model using RF passive component is important. VF schemes are implemented to obtain the rational functions. S parameters of the equivalent circuit model is compared to those of EM simulation in case of the microstrip line structure.

• 한국정보통신설비학회:학술대회논문집
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• 한국정보통신설비학회 2009년도 정보통신설비 학술대회
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• pp.281-284
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• 2009

In this paper, we propose a method that applies Adaptive Frequency Sampling(AFS) technique to the equivalent circuit model for RF passive components. Thes days wireless communication system is getting smaller and smaller. So EMI/EMC is an issue in RF. We can solve PI(Power Integrity)/SI(Signal Integrity) that one of EMI/EMC problem apply IFFT for 3D EM simulation multiple with input signal. That is time comuming task. Therefore equivalent circuit model using RF passive component is important. AFS schemes are implemented to obtain the rational functions. S parameters of the equivalent circuit moldel is compared to those of EM simulation in case of the microstrip line structure.