[KSCI] Korea Science Citation Index Service

Overview of 3-D IC Design Technologies for Signal Integrity (SI) and Power Integrity (PI) of a TSV-Based 3D IC

Kim, Joohee (KAIST)
Kim, Joungho (KAIST)

Publication Information

The Proceeding of the Korean Institute of Electromagnetic Engineering and Science / v.24, no.2, 2013 , pp. 3-14 More about this Journal

Abstract

In this paper, key design issues and considerations for Signal Integrity(SI) and Power Integrity(PI) of a TSV-based 3D IC are introduced. For the signal integrity and power integrity of a TSV-based 3-D IC channel, analytical modeling and analysis results of a TSV-based 3-D channel and power delivery network (PDN) are presented. In addition, various design techniques and solutions which are to improve the electrical performance of a 3-D IC are investigated.

Keywords

Citations & Related Records

Reference

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